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VSP7500ZWV

Texas Instruments

VSP7500ZWV by Texas Instruments

VSP7500ZWV by Texas Instruments is an 8mm square CCD image sensor with a supply voltage range of 1.65-1.95V, operating temperature from -25 to 85°C, and digital output voltage of 1.50-2.10V. Ideal for applications requiring high-resolution imaging in compact devices due to its small form factor and surface mounting feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,615 parts In-Stock

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Vyrian

USA . 910 parts In-Stock

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910

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Parana Technologies

USA . 539 parts In-Stock

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$1.972

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$2.505

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539

$1.972

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$2.505

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DigiPath Technology Company

USA . 1,251 parts In-Stock

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$2.172

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$2.172

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ChromeModa Solutions

Germany . 6,304 parts In-Stock

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$2.216

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$1.817

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$2.216

$1.817

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IDEA Electronic Components Group

UK . 2,268 parts In-Stock

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$2.216

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$1.994

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$2.216

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$1.994

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AZTECH Wire

Italy . 524 parts In-Stock

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$6.054

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524

$6.054

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Ampacity Inc.

Singapore . 1,110 parts In-Stock

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$31.750

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$31.750

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One Stop Electronics

USA . 179 parts In-Stock

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$41.750

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$41.750

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Semicontronic

India . 1,222 parts In-Stock

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$50.750

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$49.481

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$49.228

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$50.750

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$49.228

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Corphita

USA . 4,436 parts In-Stock

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Corohmni

South Africa . 230 parts In-Stock

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Microchip USA

USA . 124 parts In-Stock

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Overview

Elevate your imaging experience with the VSP7500ZWV by Texas Instruments. Crafted with precision and expertise, this image sensor delivers unparalleled quality and performance. Perfect for a wide range of applications, this sensor offers crystal-clear digital voltage output, making it ideal for capturing stunning images with ease. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations. Upgrade to the VSP7500ZWV today and unlock a world of possibilities in image sensing.

Feature Benefit Bullets

Maximum Supply Voltage: 1.95 V

The maximum supply voltage of 1.95 V ensures efficient power consumption and safe operation of the image sensor.

Body Width: 8 inch

The compact body width of 8 inches enables easy integration of the image sensor into various devices without taking up much space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

Being a CCD image sensor, it offers high-quality image capture, making it suitable for applications requiring superior image quality.

Body Height: 1.2 mm

The low body height of 1.2 mm allows for a slim design and flexibility in placement within devices.

Package Shape or Style: SQUARE

The square package shape provides ease of handling and mounting, ensuring a secure fit within the device.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage of 1.65 V helps in reducing power consumption and extends the battery life of devices using the image sensor.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the image sensor can function effectively even in high-temperature environments.

Output Range: 1.50-2.10V

The digital voltage output range of 1.50-2.10V provides accurate and stable output signals for further processing or analysis.

Output Type: DIGITAL VOLTAGE

The digital voltage output type simplifies interfacing with other digital circuits and devices, enhancing overall system compatibility.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25°C ensures the image sensor can perform reliably in cold environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of Tin/Silver/Copper provides good conductivity and reliability in the connections, contributing to the overall durability of the image sensor.

Maximum Operating Current: 0.001 mA

The low maximum operating current of 0.001 mA helps in conserving power and reducing heat generation, making it suitable for battery-powered devices.

Housing: PLASTIC

The plastic housing offers a lightweight and cost-effective solution while providing adequate protection to the internal components of the image sensor.

Body Length/Diameter: 8 mm

The compact body length/diameter of 8 mm allows for versatile installation options and compatibility with a wide range of device designs.

Termination Type: SOLDER

The solder termination type ensures secure and reliable connections, reducing the risk of signal loss or damage during operation.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies the assembly process and allows for easy integration into circuit boards or devices.

Technical Specifications

Image Sensors VSP7500ZWV attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Additional Features:

ITS ALSO OPERATES IN 2.7 TO 3.6V

Body Width:

8 inch

Body Height:

1.2 mm

Body Length/Diameter:

8 mm

Housing:

PLASTIC

JESD-609 Code:

e1

Mounting Feature:

Maximum Operating Current:

.001 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Range:

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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