Loading...

ASX342ATSC00XPED0-TP

Onsemi

ASX342ATSC00XPED0-TP by Onsemi

ASX342ATSC00XPED0-TP by Onsemi is a 5.6x5.6 um CMOS image sensor with 728H x 560V pixels, offering a dynamic range of 87 dB and operating at temperatures from -40 to 105 °C. It has a digital voltage output interface, operates at a max supply voltage of 1.95 V, and features a square package style suitable for surface mount applications in various imaging systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,410 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,410

-

-

-

-

Digiode

USA . 413 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

413

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 657 parts In-Stock

1+ parts

$0.456

100+ parts

-

1k+ parts

-

10k+ parts

$0.438

657

$0.456

-

-

$0.438

Northwest PG Solutions

USA . 2,165 parts In-Stock

1+ parts

$0.502

100+ parts

-

1k+ parts

-

10k+ parts

$0.442

2,165

$0.502

-

-

$0.442

AZTECH Wire

Italy . 398 parts In-Stock

1+ parts

$11.470

100+ parts

-

1k+ parts

-

10k+ parts

-

398

$11.470

-

-

-

Kulean Microsystems

USA . 6,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,250

-

-

-

-

TANS Electronics

Latvia . 4,771 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,771

-

-

-

-

SupplyDigital Components

Austria . 4,135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,135

-

-

-

-

Problanco Electronics

Mexico . 1,368 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,368

-

-

-

-

Corphita

USA . 694 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

694

-

-

-

-

Corohmni

South Africa . 305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

305

-

-

-

-

UHIMA Technologies

Türkiye . 142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

142

-

-

-

-

Overview

Experience the superior quality and cutting-edge technology of the ASX342ATSC00XPED0-TP image sensor by Onsemi. This innovative product offers unparalleled precision and reliability, making it ideal for a wide range of applications in industries such as automotive, healthcare, and security. With a focus on delivering exceptional value to customers, this image sensor provides high performance, efficiency, and versatility. Trust Onsemi to provide you with the best solutions for your imaging needs.

Feature Benefit Bullets

Pixel Size (um): 5.6X5.6

Smaller pixel size allows for higher resolution images to be captured, resulting in better quality images.

Maximum Supply Voltage: 1.95 V

Higher supply voltage ensures stable operation and performance of the image sensor.

Master Clock: 27 MHz

High master clock frequency enables fast and efficient processing of image data, leading to quick image capture.

Array Type: FRAME

Frame array type allows for capturing full-frame images, providing complete and detailed picture information.

Dynamic Range: 87 dB

High dynamic range ensures that the sensor can capture a wide range of light intensities accurately, leading to better image quality in various lighting conditions.

Technical Specifications

Image Sensors ASX342ATSC00XPED0-TP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE ANALOG VOLTAGE FROM 2.66 TO 2.94V, ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

7.5 inch

Body Height:

1.28 mm

Body Length/Diameter:

7.5 mm

Data Rate:

27 Mbps

Dynamic Range:

87 dB

Frame Rate:

60 fps

Horizontal Pixel:

728

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

5.6X5.6

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

560

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19