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KAE-04471-FBA-SP-FA

Onsemi

KAE-04471-FBA-SP-FA by Onsemi

KAE-04471-FBA-SP-FA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal and vertical pixels, and a dynamic range of 72 dB. It operates b/w -30 to 40 °C with a supply voltage range of 14.7 to 15.3 V, making it suitable for high-resolution imaging applications in various industries.

Median Price

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Lifecycle Status

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1k+

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Vyrian

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Digiode

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Problanco Electronics

Mexico . 8,095 parts In-Stock

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Kulean Microsystems

USA . 6,070 parts In-Stock

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TANS Electronics

Latvia . 1,851 parts In-Stock

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Corphita

USA . 1,744 parts In-Stock

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SupplyDigital Components

Austria . 676 parts In-Stock

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Corohmni

South Africa . 205 parts In-Stock

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UHIMA Technologies

Türkiye . 135 parts In-Stock

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Overview

Experience the superior quality and cutting-edge technology of the KAE-04471-FBA-SP-FA image sensor by Onsemi. Perfect for a wide range of applications, this CCD sensor offers unmatched performance and precision in every pixel. With a dynamic range of 72 dB and voltage output, this rectangular sensor delivers crystal-clear images with exceptional detail. Trust Onsemi's reputation for excellence and innovation to bring value and reliability to your imaging projects. Elevate your work with the KAE-04471-FBA-SP-FA and experience the difference firsthand.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Allows for high resolution and clarity in images captured by the sensor.

Maximum Supply Voltage: 15.3 V

Provides a wide voltage range for flexibility in powering the sensor.

Body Width: 41 inch

Compact size makes it suitable for various applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD sensors are known for producing high-quality images with low noise.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for easy integration into electronic devices.

Minimum Supply Voltage: 14.7 V

Ensures stable operation even at lower voltage levels.

Maximum Operating Temperature: 40 °C

Can withstand high temperatures, making it suitable for various environments.

Horizontal Pixel: 2096

High pixel count provides detailed images with sharpness and clarity.

Output Type: VOLTAGE OUTPUT

Voltage output simplifies interfacing with other electronic components.

Minimum Operating Temperature: -30 °C

Works effectively in cold environments without performance degradation.

Maximum Operating Current: 9 mA

Low power consumption for energy-efficient operation.

Dynamic Range: 72 dB

Offers a wide dynamic range for capturing images with varying levels of brightness.

Vertical Pixel: 2096

Equal vertical and horizontal pixel count ensures square aspect ratio images.

Body Length/Diameter: 43.5 mm

Compact size and shape allow for easy installation and integration.

Optical Format (inch): 4/3

Compatible with standard optical formats for seamless integration with lenses.

Data Rate: 40 Mbps

High data rate allows for fast and efficient transmission of image data.

Termination Type: SOLDER

Solder termination provides a reliable connection for long-term use.

Frame Rate: 30 fps

Capture smooth and real-time video footage with a high frame rate.

Array Type: INTERLINE

Interline array design minimizes interline transfer artifacts for cleaner images.

Mounting Feature: THROUGH HOLE MOUNT

Ease of installation and secure mounting using through-hole mounting method.

Technical Specifications

Image Sensors KAE-04471-FBA-SP-FA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 45 UV/ELECTRON

Array Type:

INTERLINE

Body Width:

41 inch

Body Length/Diameter:

43.5 mm

Data Rate:

40 Mbps

Dynamic Range:

72 dB

Frame Rate:

30 fps

Horizontal Pixel:

2096

Mounting Feature:

Maximum Operating Current:

9 mA

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

4/3

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.3 V

Minimum Supply Voltage:

14.7 V

Termination Type:

SOLDER

Vertical Pixel:

2096

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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