Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Onsemi KAE-01093-QBB-SD-EE is an image sensor with 1024x1024 pixels, 9x9 um pixel size, and 95 dB dynamic range. It operates b/w -50 to 60 °C and has a digital voltage output. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.
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Having a small pixel size allows for high resolution images with fine details, making this image sensor a great choice for applications requiring precise image capture.
The high maximum supply voltage ensures compatibility with a wide range of power sources, offering flexibility in system integration.
The compact body width enables easy mounting and integration into various devices and systems without taking up too much space.
Being a CCD image sensor type ensures high-quality image capture with low noise, making it a reliable choice for demanding imaging applications.
The low body height allows for a sleek and slim design, making this image sensor suitable for applications where space is limited.
The rectangular package shape offers easy integration into electronic systems and provides a standardized form factor for compatibility with various setups.
The low minimum supply voltage ensures efficient power consumption, making this image sensor suitable for battery-powered devices or energy-conscious applications.
With a high maximum operating temperature, this image sensor can withstand harsh environmental conditions, making it suitable for outdoor or industrial applications.
Having a high horizontal pixel count ensures detailed image capture with sharp clarity, making this image sensor ideal for applications requiring high-resolution images.
The digital voltage output type provides a clean and reliable signal for easy integration with digital systems, ensuring accurate data transmission.
With a low minimum operating temperature, this image sensor can function reliably in cold environments, making it suitable for a wide range of temperature conditions.
A high dynamic range allows for capturing a wide range of light intensities, ensuring accurate image representation in both bright and dark scenes.
The high vertical pixel count complements the horizontal resolution, providing a balanced image capture for various applications requiring detailed imaging.
The moderate body length offers a good balance between compact design and functionality, making this image sensor suitable for a wide range of system designs.
With a high data rate, this image sensor can capture and transmit images quickly, ideal for applications requiring real-time image processing or high-speed data transfer.
The solder termination type ensures a secure and reliable connection, making this image sensor suitable for rugged environments or applications with vibration or mechanical stress.
A high frame rate allows for capturing fast-moving scenes with smooth motion, making this image sensor ideal for applications requiring high-speed image capture or video recording.
An interline array type offers fast readout speed and reduced image lag, making this image sensor suitable for applications requiring minimal distortion or motion blur.
The through hole mounting feature provides a secure attachment method, ensuring stable installation and reliable performance in various mounting configurations.
Image Sensors KAE-01093-QBB-SD-EE attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Data Rate:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
1N4148
Philips Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
08055C104KAT4A
KYOCERA AVX
08055C104KAT4A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance, rated for 50V. With X7R temperature characteristics and -55 to 125 °C operating range, it's ideal for SMT applications requiring compact size and high reliability. The wraparound terminals and multi-layer design make it suitable for various electronic circuits.
Space Power Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Dc Components
BAV99
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ST3485EBDR
STMicroelectronics
ST3485EBDR by STMicroelectronics is a Line Driver & Receiver with 3.3V power supply, EIA-422/EIA-485 interface standard, and 30ns max transmit delay. It is ideal for industrial applications requiring differential output and operates in temperatures ranging from -40 to 85°C.
Yangzhou Yangjie Electronics
Laube Technology
ULN2003ADR
Texas Instruments
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
BSS123,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
BSS138
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Minimum DS Breakdown Voltage: 50 V; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
LM317T
Fairchild Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Output Current-1: 1.5 A; No. of Outputs: 1; Qualification Status: Not Qualified;
2N7002
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
SS495A-SP
Honeywell Sensing And Control
SS495A-SP by Honeywell is a magnetic field sensor with 10.5V max supply voltage, 3" body width, and 1.5% linearity. Ideal for applications requiring a Hall effect sensor with -40 to 150°C operating temperature range, such as position sensing in automotive or industrial systems.
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
LAN8720A-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
MT9V022IA7ATC
Onsemi
MT9V022IA7ATC by Onsemi is an image sensor with 6x6 um pixel size, 26.6 MHz master clock, and 752 horizontal pixels. Ideal for applications requiring a digital current output interface, such as frame arrays in cameras or surveillance systems.
AS0142ATSC00XUSM0-DRBR-E
Onsemi's AS0142ATSC00XUSM0-DRBR-E is a 3x3 um CMOS image sensor with 1280H x 800V pixels. It operates at a max supply voltage of 1.89V, has a master clock of 27 MHz, and offers a dynamic range of 93 dB. Ideal for applications requiring high-resolution imaging in compact devices.
TC276-10
TC276-10 by Texas Instruments is an image sensor with 699x288 pixels, operating at -10 to 45°C. It requires a 12V power supply and features THROUGH HOLE MOUNT. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
KAI-4021-ABA-CR-BA
KAI-4021-ABA-CR-BA by Onsemi is a 2048x2048 CCD image sensor with 7.4um pixel size and 60dB dynamic range. It operates b/w -50 °C to 70°C, making it suitable for industrial imaging applications requiring high-resolution and temperature versatility. The rectangular package style with through-hole mounting feature enhances ease of integration into various systems.
AMIS-70700
AMIS-70700 by Onsemi is a CMOS image sensor with 10.6x10.6 um pixel size, offering 60 dB dynamic range and 750x400 resolution. Operating at -40 to 105 °C, it has a digital voltage output type and supports up to 20 Mbps data rate. Ideal for full-frame applications in imaging systems requiring high-quality visuals.
KAI-47051-FXA-JD-B1
KAI-47051-FXA-JD-B1 by Onsemi is an image sensor with 5.5x5.5 um pixel size, 40 MHz master clock, and 66 dB dynamic range. Ideal for applications requiring high-resolution imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.
NOIX1SE9400B-LTI
NOIX1SE9400B-LTI by Onsemi is an Image Sensor with 3.2X3.2 um Pixel Size, 32.4 MHz Master Clock, and 3072 Horizontal Pixels. Ideal for applications requiring high-resolution imaging in a compact form factor, such as surveillance cameras or industrial machine vision systems.
KAF-1402E
Image Sensors;
KAI-02050-FBA-JB-B2
KAI-02050-FBA-JB-B2 by Onsemi is an image sensor with 5.5x5.5 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 64 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
MT9V024IA7XTM-DR1
MT9V024IA7XTM-DR1 by Onsemi is a 1/3-inch CMOS image sensor with 6x6 um pixel size, offering 60 fps frame rate. Ideal for applications requiring high-quality imaging such as surveillance cameras and industrial machine vision systems.
TSL208R
Ams Ag
TSL208R by Ams Ag is an image sensor with a pixel size of 70x120 um and a max supply voltage of 5.5V. With a master clock of 5 MHz, it offers a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in various industries such as automotive, security, and industrial automation.
NOIP1SE0300A-QDI
NOIP1SE0300A-QDI by Onsemi is an image sensor with 4.80X4.80 um pixel size, 72 MHz master clock, and 640x480 resolution. It operates at a voltage range of 1.7-1.9V and is ideal for digital imaging applications requiring high frame rates up to 815 fps in a compact square package.
NOIP1FN2000A-LTI
NOIP1FN2000A-LTI by Onsemi features 1920x1200 resolution, 4.8um pixel size, and 360MHz master clock. Ideal for high-speed imaging applications with a frame rate of 230fps.
TSL1401CCS
IMAGE SENSOR,CCD;
AR0147ATSC00XUEG0-TRBR
Onsemi's AR0147ATSC00XUEG0-TRBR is a 3x3 um CMOS image sensor with 1344H x 968V pixels, offering a dynamic range of 140 dB. Operating at -40 to 110 °C, it has a max supply voltage of 1.26 V and output interface type of 2-WIRE INTERFACE. Ideal for applications requiring high-resolution imaging and low-light sensitivity in compact devices.
AR0330CM1C21SHKA0-CP
The Onsemi AR0330CM1C21SHKA0-CP image sensor features 2.2x2.2 um pixel size, 27 MHz master clock, and 2304 horizontal pixels. Ideal for applications requiring a digital voltage output interface, this CMOS sensor offers a dynamic range of 69.5 dB and operates b/w -30 to 70°C temperatures.
KAE-04471-FBA-SD-FA
The Onsemi KAE-04471-FBA-SD-FA is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal pixels, and 2096 vertical pixels. It operates b/w -30 to 40 °C with a dynamic range of 72 dB. Ideal for applications requiring high-resolution imaging at a max supply voltage of 15.3 V and min supply voltage of 14.7 V.
MT9V128IA3XTC-DR
MT9V128IA3XTC-DR by Onsemi is a 5.6x5.6 um CMOS image sensor with 680H x 512V pixels, offering a dynamic range of 74.8 dB and operating at temperatures from -40 to 105°C. It features a digital voltage output interface, operates at 27 MHz master clock, and is ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.
MT9V135C12STC
Aptina
Image Sensors; Mounting Feature: SURFACE MOUNT; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 70 Cel; Horizontal Pixel: 640; Power Supplies (V): 2.8;
KAI-2020-ABA-CR-AE
KAI-2020-ABA-CR-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It has a dynamic range of 60 dB and outputs analog voltage at a data rate of 40 Mbps. This rectangular CCD sensor is ideal for applications requiring high-resolution imaging in industrial or scientific settings.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KAE-04471-ABA-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: VOLTAGE OUTPUT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 2096; Frame Rate: 30 fps;
KAE-02150-FBB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 33 mm; Termination Type: SOLDER; Additional Features: IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 AND 86 DB;
KAE-02150-ABB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Additional Features: IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 86 DB; Maximum Operating Temperature: 40 Cel;
KAE-02150-FBB-JP-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 1920; Array Type: INTERLINE; Power Supplies (V): 15;
KAE-02150-ABB-JP-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Power Supplies (V): 15; Optical Format (inch): 2/3; Minimum Operating Temperature: -70 Cel;
KAE-02150-FBB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1080; Minimum Operating Temperature: -40 Cel; Additional Features: IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 AND 86 DB;
KAE-01093-ABB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1024; Horizontal Pixel: 1024;
KAE-01093-QBB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Body Length/Diameter: 33 mm;
KAE-02150-ABB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Housing: ALUMINIUM; Optical Format (inch): 2/3;
KAE-02150-ABB-SP-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Height: 4.61 mm; Body Length/Diameter: 33 mm; Horizontal Pixel: 1920;
KAE-02150-FBA-JP-FE
KAE-02150-ABA-JP-FE
KAE-02150-FBB-JP-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Optical Format (inch): 2/3; Vertical Pixel: 1080;
KAE-01093-FBB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 4.5 V; Termination Type: SOLDER;
KAE-02150-ABB-SP-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Width: 29.97 inch; Minimum Supply Voltage: 4.5 V; Termination Type: SOLDER;
KAE-02150-ABB-JP-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Termination Type: SOLDER; Maximum Operating Temperature: 40 Cel;
KAE-01093-ABB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1024; Frame Rate: 91 fps;
KAE-01093-FBB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Pixel Size (um): 9X9; Minimum Operating Temperature: -50 Cel;
KAE-02150-ABA-JP-FA
IMAGE SENSOR,CCD; Array Type: INTERLINE; Vertical Pixel: 1080; Additional Features: IT ALSO HAVE DYNAMIC RANGE 86 DB; IT HAS SENSITIVITY OF 44 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER; Horizontal Pixel: 1920; Dynamic Range: 68 dB;
Supply Digital Components
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12,000 In-Stock
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