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KAE-01093-QBB-SD-EE

Onsemi

KAE-01093-QBB-SD-EE by Onsemi

The Onsemi KAE-01093-QBB-SD-EE is an image sensor with 1024x1024 pixels, 9x9 um pixel size, and 95 dB dynamic range. It operates b/w -50 to 60 °C and has a digital voltage output. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,406 parts In-Stock

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Vyrian

USA . 1,445 parts In-Stock

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1,445

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Problanco Electronics

Mexico . 5,777 parts In-Stock

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5,777

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Kulean Microsystems

USA . 3,066 parts In-Stock

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SupplyDigital Components

Austria . 2,014 parts In-Stock

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UHIMA Technologies

Türkiye . 523 parts In-Stock

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523

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TANS Electronics

Latvia . 417 parts In-Stock

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Corphita

USA . 248 parts In-Stock

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Corohmni

South Africa . 248 parts In-Stock

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Overview

Discover the unparalleled quality and innovation of the KAE-01093-QBB-SD-EE image sensor by Onsemi. This cutting-edge device offers superior performance and reliability, making it ideal for a wide range of applications. From high-resolution imaging to advanced digital voltage output, this sensor delivers exceptional value and benefits to customers seeking top-tier technology. Elevate your projects with the KAE-01093-QBB-SD-EE and experience the difference that Onsemi's expertise brings to the table.

Feature Benefit Bullets

Pixel Size (um): 9X9

Having a small pixel size allows for high resolution images with fine details, making this image sensor a great choice for applications requiring precise image capture.

Maximum Supply Voltage: 6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, offering flexibility in system integration.

Body Width: 30 inch

The compact body width enables easy mounting and integration into various devices and systems without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

Being a CCD image sensor type ensures high-quality image capture with low noise, making it a reliable choice for demanding imaging applications.

Body Height: 5.49 mm

The low body height allows for a sleek and slim design, making this image sensor suitable for applications where space is limited.

Package Shape or Style: RECTANGULAR

The rectangular package shape offers easy integration into electronic systems and provides a standardized form factor for compatibility with various setups.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures efficient power consumption, making this image sensor suitable for battery-powered devices or energy-conscious applications.

Maximum Operating Temperature: 60 °C

With a high maximum operating temperature, this image sensor can withstand harsh environmental conditions, making it suitable for outdoor or industrial applications.

Horizontal Pixel: 1024

Having a high horizontal pixel count ensures detailed image capture with sharp clarity, making this image sensor ideal for applications requiring high-resolution images.

Output Type: DIGITAL VOLTAGE

The digital voltage output type provides a clean and reliable signal for easy integration with digital systems, ensuring accurate data transmission.

Minimum Operating Temperature: -50 °C

With a low minimum operating temperature, this image sensor can function reliably in cold environments, making it suitable for a wide range of temperature conditions.

Dynamic Range: 95 dB

A high dynamic range allows for capturing a wide range of light intensities, ensuring accurate image representation in both bright and dark scenes.

Vertical Pixel: 1024

The high vertical pixel count complements the horizontal resolution, providing a balanced image capture for various applications requiring detailed imaging.

Body Length/Diameter: 33 mm

The moderate body length offers a good balance between compact design and functionality, making this image sensor suitable for a wide range of system designs.

Data Rate: 40 Mbps

With a high data rate, this image sensor can capture and transmit images quickly, ideal for applications requiring real-time image processing or high-speed data transfer.

Termination Type: SOLDER

The solder termination type ensures a secure and reliable connection, making this image sensor suitable for rugged environments or applications with vibration or mechanical stress.

Frame Rate: 91 fps

A high frame rate allows for capturing fast-moving scenes with smooth motion, making this image sensor ideal for applications requiring high-speed image capture or video recording.

Array Type: INTERLINE

An interline array type offers fast readout speed and reduced image lag, making this image sensor suitable for applications requiring minimal distortion or motion blur.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature provides a secure attachment method, ensuring stable installation and reliable performance in various mounting configurations.

Technical Specifications

Image Sensors KAE-01093-QBB-SD-EE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE SUPPLY VOLTAGE FROM 14.7 TO 15.3V, ELECTRONIC SHUTTER, GLOBAL SHUTTER

Array Type:

INTERLINE

Body Width:

30 inch

Body Height:

5.49 mm

Body Length/Diameter:

33 mm

Data Rate:

40 Mbps

Dynamic Range:

95 dB

Frame Rate:

91 fps

Horizontal Pixel:

1024

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1

Output Type:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Termination Type:

SOLDER

Vertical Pixel:

1024

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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