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KAE-04472-ABA-SD-FA

Onsemi

KAE-04472-ABA-SD-FA by Onsemi

KAE-04472-ABA-SD-FA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal and vertical pixels, and a dynamic range of 92 dB. It operates b/w -50 to 60 °C and outputs current at a rate of 40 Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,461 parts In-Stock

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Digiode

USA . 1,681 parts In-Stock

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SupplyDigital Components

Austria . 7,806 parts In-Stock

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TANS Electronics

Latvia . 4,813 parts In-Stock

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Kulean Microsystems

USA . 3,677 parts In-Stock

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Problanco Electronics

Mexico . 1,234 parts In-Stock

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Corphita

USA . 704 parts In-Stock

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Corohmni

South Africa . 392 parts In-Stock

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UHIMA Technologies

Türkiye . 4 parts In-Stock

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Overview

Elevate your imaging solutions with the KAE-04472-ABA-SD-FA by Onsemi. As a leading manufacturer of image sensors, Onsemi delivers unparalleled quality and reliability in its products. The KAE-04472-ABA-SD-FA boasts a compact design and advanced features, making it ideal for a wide range of applications. From industrial automation to medical imaging, this image sensor offers exceptional value, superior performance, and unmatched precision. Trust Onsemi to provide cutting-edge technology that empowers you to capture the world in stunning detail.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Smaller pixel size allows for higher resolution images to be captured, making this product ideal for applications requiring detailed image quality.

Maximum Supply Voltage: 15.3 V

Higher maximum supply voltage ensures stable and reliable operation of the image sensor in various power conditions, increasing overall performance.

Body Width: 41 inch

Compact body width makes this image sensor easy to integrate into different devices or systems without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD (Charge-Coupled Device) sensors offer high-quality image capturing capabilities, making this product suitable for professional imaging applications.

Body Height: 5.62 mm

Low body height allows for a slim design, making it suitable for applications where space constraints are a concern.

Package Shape or Style: RECTANGULAR

Rectangular package shape provides ease of mounting and integration into different systems, contributing to the versatility of this image sensor.

Minimum Supply Voltage: 14.7 V

Having a relatively low minimum supply voltage ensures efficient power usage and reduces the risk of voltage fluctuations impacting the sensor's performance.

Maximum Operating Temperature: 60 °C

High maximum operating temperature range allows for reliable operation even in challenging environmental conditions, increasing the product's durability.

Horizontal Pixel: 2096

High horizontal pixel count enables capturing wide-angle images with detailed resolution, making this sensor suitable for panoramic photography or surveillance applications.

Output Type: CURRENT OUTPUT

Current output provides accurate and fast signal transmission, ensuring high-quality image data is delivered efficiently.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature makes the sensor suitable for use in extreme cold conditions, increasing its versatility for various applications.

Maximum Operating Current: 9 mA

Low operating current ensures energy-efficient performance, making this image sensor suitable for battery-powered devices or applications requiring low power consumption.

Housing: GLASS

Glass housing offers protection against environmental factors and mechanical damage, ensuring the longevity and reliability of the image sensor.

Dynamic Range: 92 dB

High dynamic range allows the sensor to capture both bright and dark areas in a scene with excellent detail, making it suitable for high-contrast imaging applications.

Vertical Pixel: 2096

Vertical pixel count complements the high horizontal pixel count, enabling the sensor to capture detailed images with both width and height resolution.

Body Length/Diameter: 43.5 mm

Compact body length/diameter makes this sensor easy to mount and integrate into various devices or systems, adding to its overall versatility.

Optical Format (inch): 4/3

4/3 optical format offers a standard aspect ratio for capturing images, making this sensor compatible with a wide range of imaging systems and lenses.

Data Rate: 40 Mbps

High data rate enables fast and efficient image data transfer, ensuring real-time imaging applications can operate seamlessly with this sensor.

Termination Type: SOLDER

Solder termination provides a secure and reliable connection for the sensor, ensuring stable operation and reducing the risk of signal loss or interference.

Frame Rate: 24 fps

24 frames per second frame rate allows for smooth and natural motion capture, making this sensor suitable for video recording or motion analysis applications.

Array Type: INTERLINE

Interline array type enables fast image readout and reduced image lag, making this sensor suitable for applications requiring high-speed image capture.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature offers easy and secure installation of the sensor onto circuit boards or mounting surfaces, ensuring stability during operation.

Technical Specifications

Image Sensors KAE-04472-ABA-SD-FA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAVE OUTPUT SENSTIVITY OF 45 MICRO VOLT PER ELECTRON; GLOBAL SHUTTER; ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

41 inch

Body Height:

5.62 mm

Body Length/Diameter:

43.5 mm

Data Rate:

40 Mbps

Dynamic Range:

92 dB

Frame Rate:

24 fps

Horizontal Pixel:

2096

Housing:

GLASS

Mounting Feature:

Maximum Operating Current:

9 mA

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

4/3

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.3 V

Minimum Supply Voltage:

14.7 V

Termination Type:

SOLDER

Vertical Pixel:

2096

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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