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AR0138AT3R00XUEA0-DPBR-E

Onsemi

AR0138AT3R00XUEA0-DPBR-E by Onsemi

Onsemi AR0138AT3R00XUEA0-DPBR-E is a 1/2.6" CMOS image sensor with 1288x968 resolution, 4.2um pixel size, and 69fps frame rate. Ideal for surface mount applications in cameras, offering a rectangular package style with solder termination and 2-wire interface for seamless integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,400 parts In-Stock

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Vyrian

USA . 514 parts In-Stock

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Native Components

USA . 885 parts In-Stock

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$0.211

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$0.203

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Northwest PG Solutions

USA . 856 parts In-Stock

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$0.232

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Problanco Electronics

Mexico . 7,075 parts In-Stock

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Kulean Microsystems

USA . 6,008 parts In-Stock

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TANS Electronics

Latvia . 4,777 parts In-Stock

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Corphita

USA . 1,295 parts In-Stock

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SupplyDigital Components

Austria . 395 parts In-Stock

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Perfect Parts

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Corohmni

South Africa . 309 parts In-Stock

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UHIMA Technologies

Türkiye . 290 parts In-Stock

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Authorized Procurement Solutions

USA . 60 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Capture every moment in stunning detail with the AR0138AT3R00XUEA0-DPBR-E by Onsemi. As a leading manufacturer in the industry, Onsemi's image sensors are known for their exceptional quality and reliability. Perfect for a wide range of applications, this CMOS image sensor delivers high performance and crisp images. Elevate your projects with the value and benefits of the AR0138AT3R00XUEA0-DPBR-E, offering superior image quality and unmatched versatility. Choose Onsemi for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Pixel Size (um): 4.2X4.2

This small pixel size allows for high resolution image capture, making this sensor ideal for detailed imaging applications.

Body Width: 9 inch

The compact body width makes this sensor easy to integrate into various devices without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

Being a CMOS image sensor, this product offers low power consumption and high sensitivity, perfect for portable and battery-operated devices.

Body Height: 1.4 mm

The low body height of this sensor makes it suitable for thin device designs where space is limited.

Package Shape or Style: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various device designs.

Horizontal Pixel: 1288

With a high horizontal pixel count, this sensor can capture detailed and high-resolution images.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of these high-quality terminal finishes ensures reliable connections and long-term performance of the sensor.

Vertical Pixel: 968

The vertical pixel count complements the high horizontal pixel count, providing a balanced and detailed image capture.

Body Length/Diameter: 10 mm

The compact body length of the sensor makes it easy to fit into various device designs without sacrificing performance.

Optical Format (inch): 1/2.6

With an optical format of 1/2.6 inch, this sensor provides good sensitivity and image quality for a wide range of applications.

Termination Type: SOLDER

The solder termination ensures secure and reliable connections for the sensor, enhancing its durability and longevity.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the sensor's integration with other devices, making it easy to use in various applications.

Frame Rate: 69 fps

The high frame rate of 69 fps allows for smooth and real-time image capturing, making this sensor suitable for dynamic imaging applications.

Array Type: SINGLE FRAME

The single frame array type simplifies the sensor design and operation, making it cost-effective and efficient for imaging purposes.

Mounting Feature: SURFACE MOUNT

The surface mount feature allows for easy and secure mounting of the sensor onto PCBs or other surfaces, enhancing its versatility and usability.

Technical Specifications

Image Sensors AR0138AT3R00XUEA0-DPBR-E attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER

Array Type:

SINGLE FRAME

Body Width:

9 inch

Body Height:

1.4 mm

Body Length/Diameter:

10 mm

Frame Rate:

69 fps

Horizontal Pixel:

1288

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/2.6

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Pixel Size (um):

4.2X4.2

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

968

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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