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AR0135CS2M00SUEA0-DPBR1

Onsemi

AR0135CS2M00SUEA0-DPBR1 by Onsemi

The Onsemi AR0135CS2M00SUEA0-DPBR1 image sensor features 3.75um pixel size, 50MHz master clock, and 1280x960 resolution. Ideal for applications requiring high-quality digital imaging with a dynamic range of 71.1dB, such as surveillance cameras and industrial machine vision systems.

Median Price

$31.410

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

AR0135CS2M00SUEA0-DPBR1 by Onsemi
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 189 parts In-Stock

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$31.410

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$25.898

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189

$31.410

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Nova Conductors

Japan . 15 parts In-Stock

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$27.981

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15

$27.981

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Digiode

USA . 2,034 parts In-Stock

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$29.840

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$29.840

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Vyrian

USA . 3,029 parts In-Stock

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3,029

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VNN

France . 663 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 871 parts In-Stock

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$12.085

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871

$12.085

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Ampacity Inc.

Singapore . 189 parts In-Stock

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$26.700

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Corohmni

South Africa . 154 parts In-Stock

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$27.421

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Netroflash

USA . 50 parts In-Stock

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$27.981

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$27.421

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Corphita

USA . 107 parts In-Stock

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$28.269

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 8,013 parts In-Stock

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Argo Parts USA

USA . 5,423 parts In-Stock

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TANS Electronics

Latvia . 5,418 parts In-Stock

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SupplyDigital Components

Austria . 3,979 parts In-Stock

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Perfect Parts

USA . 2,902 parts In-Stock

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Continental Prestige Electronics

USA . 1,588 parts In-Stock

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Problanco Electronics

Mexico . 1,210 parts In-Stock

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UHIMA Technologies

Türkiye . 281 parts In-Stock

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Overview

Capture every moment with the AR0135CS2M00SUEA0-DPBR1 by Onsemi, a cutting-edge image sensor that promises superior quality and performance. Manufactured by Onsemi, a trusted name in the industry, this sensor is perfect for a wide range of applications. Whether you're capturing breathtaking landscapes or creating stunning portraits, this sensor delivers exceptional value with its high dynamic range and crystal-clear image output. Elevate your photography or surveillance projects with the AR0135CS2M00SUEA0-DPBR1 and experience the difference in quality and reliability.

Feature Benefit Bullets

Pixel Size (um): 3.75

Smaller pixel size allows for higher resolution images to be captured with more detail.

Maximum Supply Voltage: 1.95 V

Higher maximum supply voltage allows for better performance and flexibility in power management.

Master Clock: 50 MHz

Higher master clock frequency enables faster data processing and higher frame rates.

Body Width: 9 inch

Compact body width makes it suitable for integration into small devices or systems.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors offer low power consumption and high image quality, making them a popular choice.

Package Shape or Style: SQUARE

Square package shape provides a stable and compact form factor for easy integration.

Minimum Supply Voltage: 1.7 V

Lower minimum supply voltage ensures efficient power usage and extended battery life.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for reliable performance in various environments.

Horizontal Pixel: 1280

High horizontal pixel count enables high-resolution image capture for detailed imagery.

Output Range: 0.40-1.50V

Wide output range provides flexibility in output signal levels for different applications.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies integration with digital systems for easy data processing.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures functionality in cold environments.

Terminal Finish: TIN SILVER COPPER

Quality terminal finish ensures good electrical conductivity and durability for long-term use.

Dynamic Range: 71.1 dB

High dynamic range allows for capturing a wide range of light intensities for better image quality.

Vertical Pixel: 960

High vertical pixel count contributes to capturing detailed images with clear resolution.

Body Length/Diameter: 9 mm

Compact body length/diameter facilitates easy integration into various devices and systems.

Optical Format (inch): 1/3

Standard optical format provides compatibility with various imaging systems and lenses.

Termination Type: SOLDER

Solder termination type ensures secure and reliable connections for stable operation.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and communication with external devices.

Frame Rate: 54 fps

High frame rate enables capturing fast-moving scenes or objects with smooth motion.

Array Type: FRAME

Frame array type provides stability and consistency in image capture for reliable performance.

Mounting Feature: SURFACE MOUNT

Surface mounting feature offers easy and secure installation in various applications.

Technical Specifications

Image Sensors AR0135CS2M00SUEA0-DPBR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER; IT ALSO OPERATES AT ANALOG VOLTAGE OF 2.5 V TO 3.1 V

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.39 mm

Body Length/Diameter:

9 mm

Dynamic Range:

71.1 dB

Frame Rate:

54 fps

Horizontal Pixel:

1280

JESD-609 Code:

e1

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

90 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

TIN SILVER COPPER

Termination Type:

SOLDER

Vertical Pixel:

960

Trade Compliance

AR0135CS2M00SUEA0-DPBR1 Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.40.60.50

SB

8541.40.60.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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