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AR0130CSSC00SPCA0-DPBR2

Onsemi

AR0130CSSC00SPCA0-DPBR2 by Onsemi

Onsemi's AR0130CSSC00SPCA0-DPBR2 is a 1/3-inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 50MHz master clock. Ideal for applications requiring high sensitivity (5.6 V/lx.s) and a wide dynamic range of 82dB. Suitable for use in digital cameras, surveillance systems, and automotive imaging.

Median Price

$22.990

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 5 parts In-Stock

1+ parts

$26.620

100+ parts

$20.910

1k+ parts

$20.200

10k+ parts

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5

$26.620

$20.910

$20.200

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Master Electronics

USA . 20 parts In-Stock

1+ parts

-

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$18.810

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$17.800

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20

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$18.810

$17.800

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Chip1Stop

Japan . 20 parts In-Stock

1+ parts

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$23.600

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20

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$23.600

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Farnell

UK . 5 parts In-Stock

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Element14

Singapore . 5 parts In-Stock

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$22.380

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$20.600

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5

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$22.380

$20.600

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Flip Electronics (Authorized)

USA . 5 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 2,003 parts In-Stock

1+ parts

$37.050

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2,003

$37.050

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Vyrian

USA . 9,583 parts In-Stock

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VNN

France . 677 parts In-Stock

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Rapid Electronics

USA . 20 parts In-Stock

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IBS Electronics

USA . 20 parts In-Stock

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$18.262

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TME

Poland . 20 parts In-Stock

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$23.560

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Nova Conductors

Japan . 10 parts In-Stock

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USA . 5 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 15 parts In-Stock

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$20.060

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$20.060

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AZTECH Wire

Italy . 998 parts In-Stock

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$21.180

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998

$21.180

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Corohmni

South Africa . 266 parts In-Stock

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$23.600

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Corphita

USA . 245 parts In-Stock

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$35.100

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SupplyDigital Components

Austria . 8,186 parts In-Stock

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Problanco Electronics

Mexico . 5,792 parts In-Stock

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TANS Electronics

Latvia . 4,406 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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UHIMA Technologies

Türkiye . 273 parts In-Stock

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Kulean Microsystems

USA . 242 parts In-Stock

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Overview

Capture every moment with the AR0130CSSC00SPCA0-DPBR2 Image Sensor by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. This versatile sensor is perfect for applications such as security cameras, automotive vision systems, and industrial imaging. With its high performance and advanced features, this sensor provides exceptional value and benefits to customers. Experience crystal-clear images and seamless integration with the AR0130CSSC00SPCA0-DPBR2.

Feature Benefit Bullets

Pixel Size (um): 3.75X3.75

Small pixel size allows for higher resolution images with more detail and clarity.

Maximum Supply Voltage: 1.95 V

Higher supply voltage allows for better performance and signal-to-noise ratio.

Master Clock: 50 MHz

Fast master clock enables quick data processing and high frame rates.

Body Width: 10 inch

Compact body width makes it suitable for various applications and easy integration.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors offer low power consumption and high sensitivity, ideal for battery-operated devices.

Package Shape or Style: SQUARE

Square package shape provides ease of handling and integration in electronic devices.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for use in various environmental conditions.

Horizontal Pixel: 1280

High horizontal pixel count enables capturing detailed images with sharpness and accuracy.

Output Range: -22-22mA

Wide output range allows for flexibility in signal processing and compatibility with different systems.

Output Type: DIGITAL CURRENT

Digital current output simplifies data transmission and processing for efficient image capture.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures reliable performance even in harsh cold environments.

Maximum Operating Current: 65 mA

Reasonable operating current consumption for efficient power usage and longer device operation.

Dynamic Range: 82 dB

High dynamic range enables capturing a wide range of light intensities for accurate image reproduction.

Vertical Pixel: 960

Vertical pixel count contributes to image resolution and quality for detailed vertical information capture.

Body Length/Diameter: 10 mm

Compact body size allows for space-saving integration in compact electronic devices and systems.

Spectral Response (nm): 350-1150

Wide spectral response range enables capturing images in different lighting conditions and environments.

Optical Format (inch): 1/3

Standard optical format size for compatibility with various lenses and optical systems.

Termination Type: SOLDER

Solder termination ensures secure and reliable connections for stable performance and durability.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and communication with external devices for seamless integration.

Frame Rate: 45 fps

High frame rate allows for smooth and continuous image capture for dynamic scenes or fast-moving subjects.

Array Type: SINGLE FRAME

Single frame array type simplifies image processing and reduces complexity in system design.

Sensitivity (V/lx.s): 5.6 V/lx.s

High sensitivity allows for efficient light capture and improved image quality in low-light conditions.

Mounting Feature: SURFACE MOUNT

Surface mounting feature enables easy and secure installation on PCBs for streamlined production processes.

Technical Specifications

Image Sensors AR0130CSSC00SPCA0-DPBR2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO HAS ANALOG SUPPLY VOLTAGE 2.50-3.10 V

Array Type:

SINGLE FRAME

Body Width:

10 inch

Body Height:

1.38 mm

Body Length/Diameter:

10 mm

Dynamic Range:

82 dB

Frame Rate:

45 fps

Horizontal Pixel:

1280

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

65 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75X3.75

Sensitivity (V/lx.s):

5.6 V/lx.s

Sensors or Transducers Type:

Spectral Response (nm):

350-1150

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

960

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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