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KAI-4011M

Onsemi

KAI-4011M by Onsemi

The Onsemi KAI-4011M is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 60dB dynamic range. It operates at a supply voltage range of 14.5V to 15.5V and outputs analog voltage signals. Ideal for applications requiring high-resolution imaging with precise color reproduction and low noise levels.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,498 parts In-Stock

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Digiode

USA . 1,081 parts In-Stock

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TANS Electronics

Latvia . 6,344 parts In-Stock

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Kulean Microsystems

USA . 4,919 parts In-Stock

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Problanco Electronics

Mexico . 4,780 parts In-Stock

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Corphita

USA . 1,927 parts In-Stock

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SupplyDigital Components

Austria . 1,902 parts In-Stock

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UHIMA Technologies

Türkiye . 310 parts In-Stock

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Corohmni

South Africa . 208 parts In-Stock

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Overview

Capture the world in stunning detail with the KAI-4011M image sensor by Onsemi. Renowned for their exceptional quality and reliability, Onsemi has crafted a product that exceeds expectations in the field of image sensors. Ideal for various applications such as surveillance cameras, industrial imaging, and medical devices, this sensor offers unparalleled value with its high resolution, wide dynamic range, and precise output. Elevate your projects to new heights with the KAI-4011M, the perfect choice for those who demand excellence in their imaging solutions.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Small pixel size allows for high resolution imaging, capturing fine details in images.

Maximum Supply Voltage: 15.5 V

Higher maximum supply voltage provides flexibility in power supply options and can support various operating conditions.

Body Width: 25.65 inch

Compact body width makes the sensor suitable for integration into small devices or tight spaces.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensors are known for their high-quality image capture capabilities, making this sensor a reliable choice for imaging applications.

Body Height: 4.95 mm

Low body height allows for thin device designs or easy integration into existing systems.

Package Shape or Style: RECTANGULAR

Rectangular package shape is common and easy to mount, simplifying the integration process.

Minimum Supply Voltage: 14.5 V

Low minimum supply voltage helps in power efficiency and can support operation in low-power environments.

Horizontal Pixel: 2048

High horizontal pixel count enables detailed and high-resolution image capture in the horizontal direction.

Output Type: ANALOG VOLTAGE

Analog voltage output provides compatibility with a wide range of signal processing systems and simplifies data handling.

Dynamic Range: 60 dB

High dynamic range allows the sensor to capture a wide range of light intensities accurately, resulting in high-quality images.

Vertical Pixel: 2048

High vertical pixel count enables detailed and high-resolution image capture in the vertical direction.

Body Length/Diameter: 35.56 mm

Compact body length/diameter makes the sensor suitable for a variety of applications without taking up too much space.

Data Rate: 40 Mbps

High data rate enables fast and efficient transmission of image data, ensuring real-time imaging capabilities.

Termination Type: SOLDER

Solder termination provides a reliable and sturdy connection during the mounting process, ensuring durability and long-term performance.

Array Type: INTERLINE

Interline array type allows for efficient image capture with reduced blooming and smearing effects, producing clear and sharp images.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature simplifies the installation process and ensures secure attachment to the device or system.

Technical Specifications

Image Sensors KAI-4011M attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY 16 UV/ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

25.65 inch

Body Height:

4.95 mm

Body Length/Diameter:

35.56 mm

Data Rate:

40 Mbps

Dynamic Range:

60 dB

Horizontal Pixel:

2048

Mounting Feature:

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2048

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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