Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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KAI-4011-CBA-CD-AE by Onsemi is a 2048x2048 CCD image sensor with 7.4um pixel size, offering a dynamic range of 60dB. It operates b/w -50 °C to 70°C and has a data rate of 40Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
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Digiode
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UHIMA Technologies
Corohmni
This small pixel size allows for high resolution images to be captured with detail and clarity.
The compact size of the body makes it suitable for integration into various electronics and devices.
CCD image sensors are known for their high-quality image output, making this sensor a reliable choice for imaging applications.
The low profile height of the sensor allows for easy installation in tight spaces.
The rectangular shape of the package provides a standard form factor for easy integration into designs.
With a high maximum operating temperature, this sensor can withstand tough environmental conditions.
The high number of horizontal pixels allows for detailed and sharp images to be captured.
The low minimum operating temperature ensures reliable operation even in extremely cold environments.
The ceramic housing provides durability and protection to the sensitive components inside.
The high dynamic range allows for the sensor to capture a wide range of brightness levels in a scene.
The vertical pixel count matches the horizontal count, providing a balanced and symmetrical image output.
The length/diameter ratio of the body ensures a compact yet functional design for easy integration.
The high data rate enables fast and efficient transfer of image data for real-time applications.
Solder termination provides a secure and reliable connection for long-term use.
Interline array type offers fast readout speeds and reduced image lag for improved performance.
The through hole mounting feature ensures a stable and secure attachment to the device or PCB.
Image Sensors KAI-4011-CBA-CD-AE attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
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Horizontal Pixel:
Housing:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Shape or Style:
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Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
1N4148
Surge Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358MX
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1552200253
Molex
WIRE AND CABLE;
MMBT3906LT1G
Onsemi
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
1N4148WS
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Texas Instruments
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
Hitachi
2N2222A
North American Philips Discrete Products Div
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Sensitron Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
SS14
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
STMicroelectronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
2N7002-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
1N4148W-7-F
Diodes Incorporated
1N4148W-7-F by Diodes Inc. is a single rectifier diode with 0.715V max forward voltage and 100V max reverse voltage. Ideal for applications requiring fast switching speeds, it has a small outline package style and matte tin terminal finish, making it suitable for surface mount PCB designs.
KAF-1603E
Image Sensors;
KAI-08052-QBA-JD-BA
KAI-08052-QBA-JD-BA by Onsemi is an image sensor with 5.5X5.5 um pixel size, 3296 horizontal pixels, and 2472 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KLI-4104-RAA-CP-AA
KLI-4104-RAA-CP-AA by Onsemi is an Image Sensor with 10x10 um pixel size, 60 dB dynamic range, and 30 Mbps data rate. It is ideal for applications requiring voltage output, such as industrial imaging systems or surveillance cameras.
CYII4SE6600AB-QFCH
CYII4SE6600AB-QFCH by Onsemi is an image sensor with 3.5x3.5 um pixel size, 40 MHz master clock, and 2210 horizontal pixels. Ideal for applications requiring a digital voltage output interface, such as surveillance cameras or industrial imaging systems.
MT9V024IA7XTR-TR
MT9V024IA7XTR-TR by Onsemi is a CMOS image sensor with 6x6 um pixel size, 752 horizontal pixels, and 480 vertical pixels. It operates at a max supply voltage of 3.6V and has a master clock of 27 MHz. Ideal for applications requiring high-resolution imaging in devices such as cameras and surveillance systems.
AR0141CS2C00SUEA0-DR
The Onsemi AR0141CS2C00SUEA0-DR is a CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 50 MHz master clock. It operates b/w -30 to 70 °C and has a dynamic range of 79 dB. Ideal for applications requiring high-resolution imaging at fast frame rates like surveillance cameras or industrial machine vision systems.
KAE-08152-FBA-JP-FA
KAE-08152-FBA-JP-FA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 40 MHz master clock, and 86 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.
AR0234CSSC28SUKA0-CP1
AR0234CSSC28SUKA0-CP1 by Onsemi is an image sensor with 1920x1200 resolution, 3x3 um pixel size, and 54 MHz master clock. It operates b/w -40 to 85 °C and offers a dynamic range of 71.4 dB. Ideal for applications requiring high-resolution imaging at fast frame rates like surveillance cameras or industrial machine vision systems.
AR0138AT3R00XUEA0-DRBR-E
IMAGE SENSOR,CMOS; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); JESD-609 Code: e1;
KAI-43140-AXA-JP-B1
Onsemi's KAI-43140-AXA-JP-B1 is a 4.5x4.5 um CCD image sensor with 8040 (H) x 5360 (V) pixels, offering a dynamic range of 60 dB. It operates b/w -50 to 70 °C and requires a supply voltage of 14.5-15.5 V, making it suitable for high-resolution imaging applications in industrial and scientific fields.
AR0132AT6B00XPW90
Onsemi AR0132AT6B00XPW90 Image Sensor features 3.75um Pixel Size, 50 MHz Master Clock, and 115 dB Dynamic Range. Ideal for applications requiring high-resolution imaging with a frame rate of 60 fps in automotive cameras, surveillance systems, and industrial machine vision.
AR0144CSSC20SUKA0-CRBR
Onsemi's AR0144CSSC20SUKA0-CRBR is a 1/4 inch CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 60 fps frame rate. It features a solder termination type and 2-wire interface for surface mount applications in various imaging devices.
MT9V131C12STC-TR
MT9V131C12STC-TR by Onsemi is a 640x480 CMOS image sensor with 5.60um pixel size and 27 MHz master clock. Ideal for digital cameras, it offers a dynamic range of 60 dB and operates at temperatures ranging from -20 to 70 °C.
AMIS-710200
Image Sensors; Horizontal Pixel: 1728; Minimum Operating Temperature: 0 Cel; Vertical Pixel: 1; Maximum Operating Temperature: 50 Cel; Power Supplies (V): 5;
KAI-08052-ABA-JP-BA
KAI-08052-ABA-JP-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 3296 horizontal pixels, and 2472 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-0373-EBA-CB-AE
KAI-0373-EBA-CB-AE by Onsemi is an image sensor with 768x484 pixels, 11.6X13.6 um pixel size, and 60 dB dynamic range. It operates b/w -25 to +40 °C and has a supply voltage range of 14.5V to 15.5V. Ideal for applications requiring high-quality imaging in a compact form factor such as industrial cameras or medical devices.
MT9V131C12STCES
Onsemi's MT9V131C12STCES image sensor features 5.6x5.6 um pixel size, 640x480 resolution, and 27 MHz master clock. Ideal for digital cameras, surveillance systems, and machine vision applications due to its high sensitivity of 1.9 V/lx.s and frame rate of 30 fps.
TC244-10
TC244-10 by Texas Instruments is an image sensor with 755x242 pixels, pixel size of 8.5x19.8 um, and operates at temperatures from -30 to 85 °C. It requires a 12V power supply and features THROUGH HOLE MOUNT for easy installation. Ideal for applications requiring high-resolution imaging in various environments.
KAF-8300-AXC-CD-AE
The Onsemi KAF-8300-AXC-CD-AE is a CCD image sensor with 5.4x5.4 um pixel size, offering a dynamic range of 64.4 dB and 3326 horizontal pixels. It operates b/w -10 to 70 °C, making it suitable for high-resolution imaging applications in various industries such as astronomy and microscopy.
KAF-09000-ABA-DD-AE
The Onsemi KAF-09000-ABA-DD-AE is a 3056x3056 pixel CCD image sensor with 12x12 um pixel size. It operates b/w -60 to 60 °C and offers a dynamic range of 84 dB. Ideal for high-resolution imaging applications, it features a spectral response of 300-1100 nm and data rate of 10 Mbps.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KAI-47051-AXA-JD-B1
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -50 Cel; Additional Features: IT HAS A SENSITIVITY OF 38 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER; Minimum Supply Voltage: 14.5 V;
KAI-4011-AAA-CR-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 35.56 mm; Termination Type: SOLDER; Dynamic Range: 60 dB;
KAI-4021-AAA-CR-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 2048; Termination Type: SOLDER; Minimum Operating Temperature: -50 Cel;
KAI-4020M
KAI-4011-ABA-CR-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -50 Cel; Body Width: 25.4 inch; Additional Features: IT HAS A SENSITIVITY OF 16 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER;
KAI-4021-AAA-CR-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Data Rate: 40 Mbps; Maximum Operating Temperature: 70 Cel; Dynamic Range: 60 dB;
KAI-4010CM
KAI-4011-AAA-CR-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Additional Features: IT HAS A SENSITIVITY OF 16 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER; Vertical Pixel: 2048; Body Length/Diameter: 35.56 mm;
KAI-4011-CBA-CD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 60 dB; Horizontal Pixel: 2048; Housing: CERAMIC;
KAI-4011CM
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Body Height: 4.95 mm; Pixel Size (um): 7.4X7.4;
KAI-4020CM
KAI-4011-ABA-CD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Height: 4.95 mm; Pixel Size (um): 7.4X7.4; Body Width: 25.4 inch;
KAI-4021
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 31 UV/ELECTRON, ELECTRONIC SHUTTER; Array Type: INTERLINE;
KAI-4011
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Data Rate: 40 Mbps; Body Length/Diameter: 35.56 mm;
KAI-4011M
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Dynamic Range: 60 dB; Termination Type: SOLDER;
KAI-4011-ABA-CR-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Array Type: INTERLINE; Housing: CERAMIC;
KAI-4010
KAI-4010M
KAI-4011-ABA-CD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Housing: CERAMIC; Vertical Pixel: 2048;
KAI-4011-CBA-CD-AE
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Pixel Size (um): 7.4X7.4; Body Length/Diameter: 35.56 mm; Vertical Pixel: 2048;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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