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KAI-4011-ABA-CD-BA

Onsemi

KAI-4011-ABA-CD-BA by Onsemi

KAI-4011-ABA-CD-BA by Onsemi is a 2048x2048 CCD image sensor with 7.4um pixel size and 60dB dynamic range. It operates b/w -50 °C to 70°C, making it suitable for industrial imaging applications requiring high-resolution and low-light performance. The rectangular package shape and through-hole mounting feature enhance its versatility in various imaging systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,682 parts In-Stock

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Vyrian

USA . 1,153 parts In-Stock

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Problanco Electronics

Mexico . 8,230 parts In-Stock

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SupplyDigital Components

Austria . 5,601 parts In-Stock

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TANS Electronics

Latvia . 4,959 parts In-Stock

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Corphita

USA . 2,080 parts In-Stock

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Kulean Microsystems

USA . 1,777 parts In-Stock

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UHIMA Technologies

Türkiye . 961 parts In-Stock

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Corohmni

South Africa . 124 parts In-Stock

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Overview

Experience the unparalleled quality and precision of the KAI-4011-ABA-CD-BA by Onsemi, a leading manufacturer in the industry. As a top-of-the-line image sensor, this product offers exceptional performance and reliability for a wide range of applications. From industrial automation to medical imaging, the KAI-4011-ABA-CD-BA delivers unmatched value with its advanced features and cutting-edge technology. Trust Onsemi to provide you with the best in image sensors, and elevate your projects to new heights.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Small pixel size allows for high resolution and detail in captured images.

Body Width: 25.4 inch

Compact size makes it suitable for integration into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high-quality imaging capabilities, making this sensor a reliable choice for image capture.

Body Height: 4.95 mm

Low profile design enables easy integration into slim devices.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for efficient placement and mounting within a device or system.

Maximum Operating Temperature: 70 °C

Wide operating temperature range makes it suitable for various environmental conditions.

Horizontal Pixel: 2048

High pixel count enables detailed and high-resolution image capture.

Minimum Operating Temperature: -50 °C

Ability to operate in low temperatures increases the versatility of this sensor.

Housing: CERAMIC

Ceramic housing provides durability and reliability, ensuring long-term performance.

Dynamic Range: 60 dB

Wide dynamic range allows for capturing a broad range of light intensities without over or underexposure.

Vertical Pixel: 2048

High pixel count in both horizontal and vertical directions ensures detailed and sharp images.

Body Length/Diameter: 35.56 mm

Optimal size for easy integration into various devices and systems.

Data Rate: 40 Mbps

High data rate enables fast image capture and transmission.

Termination Type: SOLDER

Solder termination provides secure and reliable electrical connections.

Array Type: INTERLINE

Interline array design provides efficient image capture and readout.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature allows for secure and stable installation within a device or system.

Technical Specifications

Image Sensors KAI-4011-ABA-CD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 16 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

25.4 inch

Body Height:

4.95 mm

Body Length/Diameter:

35.56 mm

Data Rate:

40 Mbps

Dynamic Range:

60 dB

Horizontal Pixel:

2048

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

2048

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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