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KAI-4011-AAA-CR-BA

Onsemi

KAI-4011-AAA-CR-BA by Onsemi

KAI-4011-AAA-CR-BA by Onsemi is a CCD image sensor with 2048x2048 pixels, 7.4um pixel size, and 60dB dynamic range. It operates b/w -50 °C to 70°C and has a data rate of 40 Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,392 parts In-Stock

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Digiode

USA . 1,345 parts In-Stock

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SupplyDigital Components

Austria . 6,493 parts In-Stock

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Kulean Microsystems

USA . 5,772 parts In-Stock

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Problanco Electronics

Mexico . 2,573 parts In-Stock

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Corphita

USA . 1,831 parts In-Stock

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TANS Electronics

Latvia . 1,309 parts In-Stock

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UHIMA Technologies

Türkiye . 815 parts In-Stock

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Corohmni

South Africa . 161 parts In-Stock

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Overview

Unlock the power of crystal-clear imaging with the KAI-4011-AAA-CR-BA by Onsemi. As a leading manufacturer in the industry, Onsemi has crafted this cutting-edge image sensor to deliver unmatched quality and precision. Ideal for a wide range of applications, this sensor offers exceptional value and performance. Whether you're in the medical field, security industry, or photography sector, the KAI-4011-AAA-CR-BA is sure to elevate your projects to the next level. Trust Onsemi for superior technology that exceeds expectations.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Smaller pixel size allows for higher resolution images with more detail.

Body Width: 25.4 inch

Compact size makes it suitable for integration into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for producing high-quality images with low noise levels.

Body Height: 4.95 mm

Low profile design enables versatile mounting options in tight spaces.

Package Shape or Style: RECTANGULAR

Rectangular shape simplifies the integration process into existing systems.

Maximum Operating Temperature: 70 °C

Wide temperature range allows for operation in various environmental conditions.

Horizontal Pixel: 2048

High horizontal pixel count provides sharp images with excellent clarity.

Minimum Operating Temperature: -50 °C

Low temperature limit ensures reliable performance in cold environments.

Housing: CERAMIC

Ceramic housing offers durability and protection for the sensor components.

Dynamic Range: 60 dB

Wide dynamic range allows for capturing details in both bright and dark areas of an image.

Vertical Pixel: 2048

High vertical pixel count contributes to the overall image quality and resolution.

Body Length/Diameter: 35.56 mm

Optimal length and diameter for fitting into various applications without compromising performance.

Data Rate: 40 Mbps

High data rate enables fast transfer of image data for real-time processing.

Termination Type: SOLDER

Solder termination ensures secure connections for reliable operation.

Array Type: INTERLINE

Interline array design enhances image quality and reduces blooming effects.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting provides secure attachment to PCBs for stability during operation.

Technical Specifications

Image Sensors KAI-4011-AAA-CR-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 16 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

25.4 inch

Body Height:

4.95 mm

Body Length/Diameter:

35.56 mm

Data Rate:

40 Mbps

Dynamic Range:

60 dB

Horizontal Pixel:

2048

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

2048

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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