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KAI-47051-AXA-JD-B1

Onsemi

KAI-47051-AXA-JD-B1 by Onsemi

KAI-47051-AXA-JD-B1 by Onsemi is an image sensor with 5.5X5.5 um pixel size, 40 MHz master clock, and 66 dB dynamic range. Ideal for applications requiring high-resolution imaging at a max supply voltage of 15.5 V and operating temperatures ranging from -50 to 70 °C.

Median Price

$17,879.280

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 162 parts In-Stock

1+ parts

$17,879.280

100+ parts

$10,096.530

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162

$17,879.280

$10,096.530

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Verical

USA . 162 parts In-Stock

1+ parts

$17,879.280

100+ parts

$10,096.530

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-

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162

$17,879.280

$10,096.530

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 897 parts In-Stock

1+ parts

$16,985.316

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-

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897

$16,985.316

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Vyrian

USA . 7,499 parts In-Stock

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7,499

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 590 parts In-Stock

1+ parts

$18.880

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590

$18.880

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Corphita

USA . 1,229 parts In-Stock

1+ parts

$16,091.352

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1,229

$16,091.352

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Corohmni

South Africa . 114 parts In-Stock

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$17,879.280

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114

$17,879.280

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Ampacity Inc.

Singapore . 150 parts In-Stock

1+ parts

$33,076.670

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150

$33,076.670

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Kulean Microsystems

USA . 6,925 parts In-Stock

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6,925

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Argo Parts USA

USA . 5,281 parts In-Stock

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Problanco Electronics

Mexico . 4,026 parts In-Stock

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4,026

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TANS Electronics

Latvia . 2,769 parts In-Stock

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2,769

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Continental Prestige Electronics

USA . 1,389 parts In-Stock

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1,389

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SupplyDigital Components

Austria . 490 parts In-Stock

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490

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UHIMA Technologies

Türkiye . 151 parts In-Stock

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151

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Overview

Elevate your imaging experience with the KAI-47051-AXA-JD-B1 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality image sensors that cater to a wide range of applications. From capturing stunning visuals in photography and cinematography to enhancing security systems, this product offers unparalleled value and performance. With its advanced technology and reliable design, customers can expect superior image quality, precise detail, and seamless operation. Upgrade your imaging solutions with the KAI-47051-AXA-JD-B1 and take your projects to the next level.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Small pixel size allows for high resolution images to be captured with fine detail.

Maximum Supply Voltage: 15.5 V

Higher supply voltage provides flexibility in powering the image sensor in various applications.

Master Clock: 40 MHz

Fast master clock enables quick processing of image data for real-time applications.

Body Width: 44.55 inch

Compact body width for easy integration into devices.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensor technology provides high-quality images with low noise levels.

Body Height: 3.25 mm

Low profile body height for slim design requirements.

Package Shape or Style: RECTANGULAR

Rectangular package makes it easy to mount and align the image sensor.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage helps in energy efficiency.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows use in various environmental conditions.

Horizontal Pixel: 8856

Large number of horizontal pixels enables high-resolution images to be captured.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature ensures functionality in cold environments.

Dynamic Range: 66 dB

High dynamic range captures both bright and dark areas accurately in an image.

Vertical Pixel: 5280

Large number of vertical pixels enables detailed image capture.

Body Length/Diameter: 69.96 mm

A moderate body length provides a good balance between compact size and functionality.

Termination Type: SOLDER

Solder termination ensures secure and reliable connections.

Frame Rate: 7 fps

Decent frame rate is suitable for most applications requiring video or continuous image capture.

Array Type: INTERLINE

Interline array type reduces blooming effect and pixel saturation, resulting in cleaner images.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting provides secure attachment to PCBs or other surfaces.

Technical Specifications

Image Sensors KAI-47051-AXA-JD-B1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 38 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

44.55 inch

Body Height:

3.25 mm

Body Length/Diameter:

69.96 mm

Dynamic Range:

66 dB

Frame Rate:

7 fps

Horizontal Pixel:

8856

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

5280

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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