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KAI-08052-ABA-JP-BA

Onsemi

KAI-08052-ABA-JP-BA by Onsemi

KAI-08052-ABA-JP-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 3296 horizontal pixels, and 2472 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,311 parts In-Stock

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Digiode

USA . 117 parts In-Stock

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Problanco Electronics

Mexico . 7,565 parts In-Stock

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TANS Electronics

Latvia . 5,801 parts In-Stock

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SupplyDigital Components

Austria . 2,902 parts In-Stock

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Kulean Microsystems

USA . 1,290 parts In-Stock

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Corohmni

South Africa . 236 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 6 parts In-Stock

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Overview

Capture stunning images with the KAI-08052-ABA-JP-BA image sensor from Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This sensor is perfect for a wide range of applications, delivering exceptional performance and clarity. With its advanced features and precision engineering, the KAI-08052-ABA-JP-BA offers unparalleled value and benefits to customers, making it the ideal choice for any imaging project. Choose Onsemi and experience the difference in quality and innovation.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Smaller pixel size allows for higher resolution images with more detail.

Maximum Supply Voltage: 15.5 V

Higher supply voltage allows for better performance and increased sensitivity.

Body Width: 29 inch

Compact body width makes it easy to integrate into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD sensors provide high-quality images with low noise levels, making it suitable for professional applications.

Package Shape or Style: RECTANGULAR

Rectangular shape provides easy mounting and alignment in devices.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage can help in power saving and efficiency.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for reliable performance in various environments.

Horizontal Pixel: 3296

High horizontal pixel count results in detailed and sharp images.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature ensures functionality even in extreme cold conditions.

Dynamic Range: 66 dB

High dynamic range allows for capturing both bright and dark areas in an image without losing details.

Vertical Pixel: 2472

High vertical pixel count enhances image clarity and resolution.

Body Length/Diameter: 40 mm

Compact body length makes it suitable for space-constrained applications.

Optical Format (inch): 4/3

Standard optical format compatible with various lenses and optical systems.

Termination Type: SOLDER

Solder termination provides a secure and reliable connection for long-term use.

Array Type: INTERLINE

Interline array type allows for faster readout speed and reduced image lag.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature ensures stable and secure mounting in devices.

Technical Specifications

Image Sensors KAI-08052-ABA-JP-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS OUTPUT SENSITIVITY 35 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

29 inch

Body Length/Diameter:

40 mm

Dynamic Range:

66 dB

Horizontal Pixel:

3296

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

4/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2472

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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