Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
CYII5SC1300AB-QDC by Onsemi is an image sensor with 1280x1024 pixels, 6.7x6.7um pixel size, and 40MHz master clock. It operates b/w -30 to 65 °C, outputs digital voltage from 0.50-2.20V, and has a dynamic range of 64dB. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.
Median Price
-
Lifecycle Status
Suppliers In-Stock
2
In-Stock Inventory
1k+
Digiode
1+ parts
100+ parts
1k+ parts
10k+ parts
Vyrian
Northwest PG Solutions
$3.034
Problanco Electronics
SupplyDigital Components
TANS Electronics
Kulean Microsystems
Corphita
Native Components
$2.676
UHIMA Technologies
Corohmni
Smaller pixel size allows for higher resolution imaging and better sharpness in the final images.
Allows for a wide range of power supply options, making it versatile for different applications.
High master clock speed enables fast data processing and transmission, leading to quick and efficient image capture.
Compact body width makes it suitable for applications where space is a constraint.
CMOS sensors are known for their low power consumption, high integration, and fast readout speeds, making them ideal for various imaging applications.
Low body height allows for easy integration into thin devices or systems.
Square package shape provides better symmetry and ease of mounting compared to irregular shapes.
Low minimum supply voltage helps in reducing power consumption and extending battery life in portable devices.
High maximum operating temperature ensures reliable performance even in harsh environmental conditions.
High horizontal pixel count provides detailed and high-quality images with sharpness and clarity.
A wide output range allows for capturing images in varying lighting conditions with good color reproduction.
Digital voltage output simplifies the interface with other digital systems for easy data processing and transmission.
Low minimum operating temperature ensures the sensor can function in extreme cold conditions without any issues.
Low maximum operating current leads to efficient power consumption and longer battery life in the device.
Ceramic housing offers excellent durability and thermal conductivity for reliable and long-lasting performance.
High dynamic range captures a wide range of light intensities in a single image, providing clear details in both dark and bright areas.
High vertical pixel count enhances image resolution for better quality and detailed images.
Compact body length/diameter allows for easy integration and flexibility in various system designs.
2/3 inch optical format is commonly used in professional imaging applications, ensuring compatibility and quality performance.
High data rate enables fast and efficient image transfer for real-time applications and high-speed imaging.
Solder termination provides secure and reliable connections for stable operation and longevity.
3-wire interface offers easy connectivity and communication with other devices or systems for seamless integration.
Optimal frame rate ensures smooth and high-quality video output for various imaging and recording applications.
Full frame array type provides uniform image quality across the entire sensor surface for consistent and accurate imaging results.
High sensitivity allows the sensor to capture clear and detailed images even in low light conditions or fast-moving subjects.
Surface mounting feature simplifies the installation process and allows for easy integration into various devices or systems.
Image Sensors CYII5SC1300AB-QDC attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Data Rate:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Housing:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Range:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensitivity (V/lx.s):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N7002
Rectron
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel; Terminal Form: GULL WING;
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
SMBJ18CA
Changzhou Starsea Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
FDN306P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
2N2222A
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
1N4148WS
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
General Instrument
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
TM4C1294NCPDTI3
Texas Instruments
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
1N4148WT
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Forward Voltage (VF): .5 V;
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20+
Analog Devices
DS18B20+ by Analog Devices is a 12-bit temperature sensor with 3.3/5V supply, -55 to 125°C range, and ±0.50°C accuracy. It features a 1-Wire interface for digital output and is commonly used in applications requiring precise temperature monitoring in various industries.
DP83848IVVX/NOPB
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
NOIX1SE016KB-LTI-E
NOIX1SE016KB-LTI-E by Onsemi is a 3.2x3.2 um CMOS image sensor with an optical format of 1.1 inches, offering a frame rate of 65 fps. This rectangular package sensor is ideal for surface mount applications requiring high-quality image capture in various devices and systems.
KAF-0261-AAA-CP-AE
The Onsemi KAF-0261-AAA-CP-AE is a CCD image sensor with 512x512 pixels, 20x20 um pixel size, and 87 dB dynamic range. It operates b/w -70 to 50 °C and has a spectral response of 400-1000 nm. Ideal for applications requiring high-quality imaging in industrial or scientific settings.
OV7670-VL2A
Omnivision Technologies
Image Sensors;
MT9V022IA7ATM
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-2.90V; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);
KAI-1003-AAA-CR-B2
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: INTERLINE; Horizontal Pixel: 1024; Minimum Operating Temperature: 0 Cel;
TCD1305DG
Toshiba
Toshiba TCD1305DG is an 8X64 um CCD image sensor with a 3648 horizontal pixel array. Operating at 4.5-5.5V, it offers a spectral response of 400-1200nm and sensitivity of 64 V/lx.s. Ideal for applications requiring high-resolution imaging in industrial cameras or scientific instruments.
KAI-0330-ABA-CB-AE-DUALOUTPUT
KAI-0330-ABA-CB-AE-DUALOUTPUT by Onsemi is an image sensor with 9x9 um pixel size, 648 horizontal pixels, and 484 vertical pixels. It operates at a max supply voltage of 15.5 V and min supply voltage of 12 V, providing analog voltage output. Ideal for applications requiring high dynamic range and spectral response from 400-1000 nm in a compact rectangular package.
KAI-0330-ABA-CB-BA-SINGLE
MT9V022I77ATM
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-2.90V; Pixel Size (um): 6X6;
OV10635-N29Y-PB
Image Sensors; Screening Level: AEC-Q100;
KAI-16000-AAA-JD-B1
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Data Rate: 30 Mbps; Array Type: INTERLINE;
NOIS1SM1000A-HHC
NOIS1SM1000A-HHC by Onsemi is a 1024x1024 CMOS image sensor with 15x15 um pixel size. Operating temperature ranges from -40 to 85 °C, with analog voltage output and 11 fps frame rate. Ideal for applications requiring high-resolution imaging in a compact square package.
KAI-2020M
KAI-2020M by Onsemi is an image sensor with 7.4X7.4 um pixel size, 40 MHz master clock, and 1600 horizontal pixels. Ideal for applications requiring high-quality imaging such as industrial machine vision systems or medical imaging devices due to its 68 dB dynamic range and 35 fps frame rate.
AS0140AT2C00XUSM0-DRBR
AS0140AT2C00XUSM0-DRBR by Onsemi is a 1/4 inch CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 27 MHz master clock. Ideal for digital cameras, surveillance systems, and machine vision applications due to its high frame rate of 60 fps and digital voltage output interface.
KAI-04050-ABA-JD-AE
KAI-04050-ABA-JD-AE by Onsemi is a 5.5x5.5 um CCD image sensor with 2336 (H) x 1752 (V) pixels, offering a dynamic range of 64 dB. It features an interline array type and solder termination, suitable for applications in industrial imaging systems and machine vision cameras.
KAI-16000-AXA-JR-AE
KAI-16000-AXA-JR-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 4872 horizontal pixels, and 3248 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 65 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-0340-ABB-CP-AA
KAI-0340-ABB-CP-AA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 640 horizontal pixels, and 480 vertical pixels. It operates b/w -50 to 70 °C with a supply voltage range of 14.75V to 15.25V. Ideal for applications requiring a CCD image sensor with a dynamic range of 62 dB in a ceramic, glass-sealed housing.
KAI-2020-FBA-CP-AE
KAI-2020-FBA-CP-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, offering a dynamic range of 68 dB and 1600x1200 resolution. Ideal for applications requiring high-quality imaging in a compact form factor, this CCD sensor operates b/w -50 to 70 °C with supply voltage ranging from 14.5V to 15.5V.
KAI-2001-ABA-CD-AE
KAI-2001-ABA-CD-AE by Onsemi is an image sensor with 7.4um pixel size, 1600H x 1200V resolution, and 60dB dynamic range. It operates at supply voltages b/w 14.5V to 15.5V and outputs analog voltage signals. Ideal for applications requiring high-quality imaging in a compact form factor.
KAI-16050-CXA-JD-AE
The Onsemi KAI-16050-CXA-JD-AE is a 5.5x5.5 um CCD image sensor with 4896 (H) x 3264 (V) pixels, offering a dynamic range of 64 dB. It operates b/w -50 °C to 70°C and features an interline array type, suitable for applications requiring high-resolution imaging in various environments.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
CYII5SM1300AA-QBC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.50-2.20V; Maximum Operating Current: 60 mA;
CYII4SM6600AA-QBC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.50-2V; Maximum Operating Current: 80 mA;
CYII4SE6600AB-QFCH
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.50-2.80V; Body Height: 3.04 mm;
CYII5FM1300AB-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.50-2.20V; Array Type: FULL FRAME;
CYII4SM1300AA-QBC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 1-4.50V; Data Rate: 10 Mbps;
CYII5SM1300AB-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.50-2.20V; Termination Type: SOLDER;
CYII4SC6600AA-HAC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.50-2V; Dynamic Range: 61 dB;
CYII4SM6600AB-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.50-2.80V; Vertical Pixel: 3002;
CYII4SM014KAA-GBC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 0.50-3V; Pixel Size (um): 8X8;
CYII5SC1300AA-QAC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.50-2.20V; Minimum Operating Temperature: 0 Cel;
CYII5FM1300AB-SDCES
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 0.50-2.02V; Body Length/Diameter: 10.15 mm;
CYII4SM1300AA-HBC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 1-4.50V; Frame Rate: 23 fps;
CYII5SM1300AA-HBC
CYII4SD1300AA-QAC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 1-4.50V; Optical Format (inch): 10;
CYII4SM6600AA-HBC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.50-2V; Additional Features: ROLLING SHUTTER;
CYII4SC014KAA-GAC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 0.50-3V; Frame Rate: 3.25 fps;
CYII4SC6600AA-QAC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.50-2V; Maximum Supply Voltage: 3.3 V;
CYII4SM014KAA-GEC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 0.50-3V; Minimum Operating Temperature: 0 Cel;
CYII5SC1300AA-HAC
Cypress Semiconductor
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.50-2.20V; Housing: CERAMIC, METAL-SEALED COFIRED;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved