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CYII5SC1300AA-HAC

Onsemi

CYII5SC1300AA-HAC by Onsemi

CYII5SC1300AA-HAC by Onsemi is an image sensor with 6.7x6.7 um pixel size, 40 MHz master clock, and 2/3 inch optical format. It operates at a max supply voltage of 3.6V and has a digital output interface type. Ideal for applications requiring high sensitivity and full-frame array type in a compact ceramic-metal-sealed co-fired housing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,361 parts In-Stock

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Vyrian

USA . 286 parts In-Stock

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Native Components

USA . 661 parts In-Stock

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$1.836

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Northwest PG Solutions

USA . 1,491 parts In-Stock

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$2.020

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SupplyDigital Components

Austria . 7,845 parts In-Stock

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TANS Electronics

Latvia . 4,033 parts In-Stock

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Problanco Electronics

Mexico . 3,471 parts In-Stock

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Corphita

USA . 2,421 parts In-Stock

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Kulean Microsystems

USA . 2,234 parts In-Stock

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UHIMA Technologies

Türkiye . 774 parts In-Stock

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Corohmni

South Africa . 67 parts In-Stock

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Overview

Elevate your imaging capabilities with the CYII5SC1300AA-HAC by Onsemi. As a leading manufacturer of image sensors, Onsemi delivers unparalleled quality and reliability in every product. Whether you're capturing stunning visuals for security systems, medical equipment, or industrial automation, this image sensor offers exceptional value with its high sensitivity and dynamic range. Trust Onsemi to provide cutting-edge technology that meets your needs and enhances your applications. Upgrade to the CYII5SC1300AA-HAC and experience the difference today.

Feature Benefit Bullets

Pixel Size (um): 6.7X6.7

Smaller pixel size allows for higher resolution images to be captured.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage ensures stable operation and performance.

Master Clock: 40 MHz

High master clock frequency enables fast data processing.

Body Width: 15.24 inch

Compact body width for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors are known for low power consumption and high image quality.

Minimum Operating Temperature: 0 °C

Can operate in low temperature environments without issues.

Dynamic Range: 64 dB

Wide dynamic range allows for capturing details in high contrast scenes.

Array Type: FULL FRAME

Full frame array provides uniform image quality across the entire sensor area.

Mounting Feature: SURFACE MOUNT

Surface mount design for easy and secure installation on PCBs.

Technical Specifications

Image Sensors CYII5SC1300AA-HAC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

DUAL SHUTTER MODE

Array Type:

FULL FRAME

Body Width:

15.24 inch

Body Height:

2.25 mm

Body Length/Diameter:

15.24 mm

Dynamic Range:

64 dB

Frame Rate:

27 fps

Housing:

CERAMIC, METAL-SEALED COFIRED

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Current:

60 mA

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Optical Format (inch):

2/3

Output Interface Type:

3-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

6.7X6.7

Sensitivity (V/lx.s):

8.46 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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