Loading...

CYII5SM1300AA-QBC

Onsemi

CYII5SM1300AA-QBC by Onsemi

CYII5SM1300AA-QBC by Onsemi is a 2/3-inch CMOS image sensor with 6.7x6.7 um pixel size, operating at 40 MHz master clock. It offers a dynamic range of 64 dB and sensitivity of 8.46 V/lx.s, suitable for full-frame array applications in digital imaging systems requiring high-resolution output.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,938 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,938

-

-

-

-

Vyrian

USA . 1,505 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,505

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 8,012 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,012

-

-

-

-

Kulean Microsystems

USA . 6,973 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,973

-

-

-

-

SupplyDigital Components

Austria . 4,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,660

-

-

-

-

Northwest PG Solutions

USA . 2,231 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,231

-

-

-

-

Problanco Electronics

Mexico . 2,123 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,123

-

-

-

-

UHIMA Technologies

Türkiye . 653 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

653

-

-

-

-

Corphita

USA . 463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

463

-

-

-

-

Native Components

USA . 399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

399

-

-

-

-

Corohmni

South Africa . 52 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

52

-

-

-

-

Overview

Capture stunning images with the CYII5SM1300AA-QBC image sensor by Onsemi. Known for their high-quality manufacturing, Onsemi delivers top-notch products that exceed industry standards. This image sensor is perfect for a wide range of applications, providing crisp and clear images with a dynamic range of 64 dB. With a maximum operating temperature of 50 °C and a frame rate of 27 fps, this sensor is ideal for capturing fast-paced action or detailed still shots. Trust Onsemi to deliver innovative technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Pixel Size (um): 6.7X6.7

Smaller pixel size allows for higher resolution images and better detail in captured images.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage ensures stable and reliable operation of the image sensor.

Master Clock: 40 MHz

Higher master clock frequency enables faster data readout and processing.

Body Width: 15.24 inch

Compact body width allows for easy integration into various devices and applications.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors provide high image quality, low power consumption, and fast data readout.

Body Height: 2.25 mm

Low body height allows for slim design and easy installation in space-constrained environments.

Package Shape or Style: SQUARE

Square package shape provides efficient use of space and compatibility with standard mounting techniques.

Minimum Supply Voltage: 3 V

Low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 50 °C

High maximum operating temperature allows for reliable performance in demanding environmental conditions.

Output Range: 0.50-2.20V

Wide output range enables capturing images in varying lighting conditions with good exposure.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and integration with digital systems.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality in cold environments.

Maximum Operating Current: 60 mA

Low operating current consumption helps in minimizing power usage and heat generation.

Housing: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed cofired housing provides durability and protection to the image sensor components.

Dynamic Range: 64 dB

High dynamic range allows for capturing images with both bright and dark areas with good detail.

Body Length/Diameter: 15.24 mm

Compact body length/diameter enables easy integration and placement in devices.

Optical Format (inch): 2/3

2/3 inch optical format provides good image quality and compatibility with standard lenses.

Termination Type: SOLDER

Solder termination ensures reliable electrical connections for the image sensor.

Output Interface Type: 3-WIRE INTERFACE

3-Wire interface simplifies connectivity and communication with external systems.

Frame Rate: 27 fps

High frame rate allows for capturing fast-moving objects and smooth video recording.

Array Type: FULL FRAME

Full frame array type provides high-quality image capture across the entire sensor area.

Sensitivity (V/lx.s): 8.46 V/lx.s

High sensitivity allows for capturing clear and detailed images even in low light conditions.

Mounting Feature: SURFACE MOUNT

Surface mount feature simplifies installation and ensures secure mounting of the image sensor.

Technical Specifications

Image Sensors CYII5SM1300AA-QBC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

DUAL SHUTTER MODE

Array Type:

FULL FRAME

Body Width:

15.24 inch

Body Height:

2.25 mm

Body Length/Diameter:

15.24 mm

Dynamic Range:

64 dB

Frame Rate:

27 fps

Housing:

CERAMIC, METAL-SEALED COFIRED

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Current:

60 mA

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Optical Format (inch):

2/3

Output Interface Type:

3-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

6.7X6.7

Sensitivity (V/lx.s):

8.46 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20