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CYII4SD1300AA-QAC

Onsemi

CYII4SD1300AA-QAC by Onsemi

CYII4SD1300AA-QAC by Onsemi is a 7x7 um CMOS image sensor with 1280x1024 pixels, offering a dynamic range of 69 dB. It operates at a max supply voltage of 5V and has an output range of 1-4.50V, suitable for applications requiring high-resolution imaging in low-light conditions. The sensor's square ceramic housing and surface mounting feature make it ideal for compact electronic devices with stringent space requirements.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 1,704 parts In-Stock

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SupplyDigital Components

Austria . 4,062 parts In-Stock

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Kulean Microsystems

USA . 3,255 parts In-Stock

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Problanco Electronics

Mexico . 3,045 parts In-Stock

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Corphita

USA . 1,957 parts In-Stock

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TANS Electronics

Latvia . 1,793 parts In-Stock

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UHIMA Technologies

Türkiye . 892 parts In-Stock

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Native Components

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Northwest PG Solutions

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Corohmni

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Overview

Transform your imaging experience with the CYII4SD1300AA-QAC by Onsemi. As a leading manufacturer in image sensors, Onsemi delivers superior quality and performance in every product. Ideal for a wide range of applications, this image sensor offers unmatched value and benefits to customers. With its high resolution and advanced features, it provides crystal-clear images and precise data, making it the perfect choice for all your imaging needs. Upgrade your imaging solutions today with the CYII4SD1300AA-QAC by Onsemi.

Feature Benefit Bullets

Pixel Size (um): 7X7

Smaller pixel size allows for higher resolution images to be captured.

Maximum Supply Voltage: 5 V

Low voltage requirement makes it energy efficient and compatible with a variety of systems.

Master Clock: 10 MHz

High clock frequency enables fast image capturing and processing.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS technology provides high-quality images with low power consumption.

Body Height: 0.71 mm

Low profile design for compact applications.

Package Shape or Style: SQUARE

Square package offers easy integration and alignment in devices.

Horizontal Pixel: 1280

High horizontal pixel count allows for detailed and sharp images.

Output Range: 1-4.50V

Wide output range provides flexibility in signal processing and compatibility.

Output Type: DIGITAL VOLTAGE

Digital output simplifies data transmission and processing.

Housing: CERAMIC

Ceramic housing offers durability and protection for the sensor.

Dynamic Range: 69 dB

High dynamic range captures both bright and dark areas with detail.

Vertical Pixel: 1024

High vertical pixel count for capturing detailed images from top to bottom.

Optical Format (inch): 10

Large optical format allows for wide field of view and detailed images.

Data Rate: 10 Mbps

High data rate enables fast and efficient image transfer.

Termination Type: SOLDER

Solder termination offers secure and reliable connections.

Frame Rate: 23 fps

Decent frame rate for capturing smooth and clear videos.

Array Type: FULL FRAME

Full frame array captures complete image without cropping or distortion.

Sensitivity (V/lx.s): 7 V/lx.s

High sensitivity for capturing clear images in low light conditions.

Mounting Feature: SURFACE MOUNT

Surface mount option for easy and secure installation on PCBs.

Technical Specifications

Image Sensors CYII4SD1300AA-QAC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

FULL FRAME

Body Height:

.71 mm

Data Rate:

10 Mbps

Dynamic Range:

69 dB

Frame Rate:

23 fps

Horizontal Pixel:

1280

Housing:

CERAMIC

Master Clock:

10 MHz

Mounting Feature:

Optical Format (inch):

10

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

7X7

Sensitivity (V/lx.s):

7 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

5 V

Termination Type:

SOLDER

Vertical Pixel:

1024

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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