Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Onsemi 11KAI-04070-PBA-JD-AE is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 70.5dB dynamic range. It operates b/w -50 to 70 °C and has a max supply voltage of 15.5V. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
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Vyrian
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Digiode
Native Components
$0.407
$0.391
Northwest PG Solutions
$0.448
$0.395
SupplyDigital Components
Problanco Electronics
Corphita
TANS Electronics
Kulean Microsystems
UHIMA Technologies
Corohmni
Smaller pixel size allows for higher resolution images with more detail.
Higher maximum supply voltage provides flexibility in power supply options and ensures stable performance.
Compact body width allows for easy integration into various devices and applications.
CCD image sensors are known for their high-quality imaging capabilities and sensitivity to light.
Low profile design enables the sensor to be easily incorporated into slim devices or systems.
Rectangular shape provides a standard form factor for ease of mounting and compatibility with other components.
Lower minimum supply voltage helps to reduce power consumption and extend battery life.
High maximum operating temperature ensures the sensor can withstand harsh environmental conditions.
High horizontal pixel count enables capturing detailed images with clarity and sharpness.
Low minimum operating temperature allows the sensor to function in extreme cold environments without loss of performance.
Low operating current helps in reducing power consumption and heat generation.
Wide dynamic range allows the sensor to capture both bright and dark areas in an image with high contrast.
High vertical pixel count contributes to the overall image resolution and quality.
Moderate body length/diameter allows for a balanced size that fits well in various applications.
Standard 4/3 optical format provides compatibility with a wide range of lenses and accessories.
Solder termination ensures secure and reliable connections in the assembly process.
Fast frame rate enables capturing moving objects or high-speed events with smooth motion.
Interline array type reduces blooming effects and enhances image quality, especially in high contrast scenes.
Through hole mounting simplifies the installation process and provides a secure attachment for the sensor.
Image Sensors 11KAI-04070-PBA-JD-AE attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
SMBJ18CA
Pulse Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Won-top Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
SS14
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Rfe International
1552200253
Molex
WIRE AND CABLE;
2N2222A
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
Cheng-yi Electronic
2N7002
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; JESD-609 Code: e3; Minimum DS Breakdown Voltage: 60 V;
Microsemi
LM358MX
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
International Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
1N4148WS
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
Infineon Technologies
BSS123,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
KAI-08051-QXA-JD-BA
Onsemi
KAI-08051-QXA-JD-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 3296 horizontal pixels, and 2472 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in various industries.
NOM02A4-AR03G
NOM02A4-AR03G by Onsemi is a CMOS image sensor with 4.5-5.5V supply voltage range, 0.90-1.1V analog output, and 67mA max current draw. It is ideal for applications requiring high-resolution imaging in a compact form factor, such as security cameras or industrial machine vision systems.
MT9V022I77ATM
The Onsemi MT9V022I77ATM is a CMOS image sensor with 6x6 um pixel size, 752H x 480V resolution, and 26.6 MHz master clock. It operates at -40 to 85 °C with a dynamic range of 54.4 dB. Ideal for applications requiring high-quality digital imaging at up to 60 fps frame rate in a compact square package suitable for surface mounting.
KAF-09000-ABA-DP-AE
Onsemi's KAF-09000-ABA-DP-AE is a 3056x3056 full-frame CCD image sensor with 12x12 um pixel size. It operates b/w -60 to 60 °C and offers a dynamic range of 84 dB. Ideal for high-resolution imaging applications requiring precise color reproduction and low light sensitivity.
TC237
Texas Instruments
TC237 by Texas Instruments is an image sensor with 7.4x7.4 um pixel size, ideal for applications requiring high sensitivity and a dynamic range of 58 dB. With a max supply voltage of 23V and operating temperature range from -10 to 45 °C, it offers 680 horizontal pixels and 500 vertical pixels for detailed imaging tasks.
KAI-01050-CBA-FD-AE
Onsemi's KAI-01050-CBA-FD-AE is a 5.5x5.5 um CCD image sensor with 1024x1024 pixels, offering a dynamic range of 64 dB. It operates b/w -50 to 70 °C and has a supply voltage range of 14.5V to 15.5V. Ideal for digital imaging applications requiring high-quality output in a compact square package.
NOIP1FN1300A-QDI
NOIP1FN1300A-QDI by Onsemi is an Image Sensor with 4.80X4.80 um pixel size, 72 MHz master clock, and 1/2 inch optical format. It operates b/w -40 to 85 °C and has a dynamic range of 60 dB. Ideal for high-speed imaging applications at up to 210 fps.
AR1820HSSC12SHEA0-DP1
Onsemi's AR1820HSSC12SHEA0-DP1 is a 1/2.3" CMOS image sensor with 1.25um pixel size, offering 24fps frame rate. It features Tin/Silver/Copper terminal finish and is ideal for applications requiring high-quality imaging in consumer electronics and industrial devices.
TC237B
TC237B by Texas Instruments is an image sensor with 7.4x7.4 um pixel size and 680 horizontal pixels. It operates b/w -10 to 45 °C, with a supply voltage range of 21-23 V. Ideal for applications requiring high sensitivity and a dynamic range of 58 dB in a compact rectangular package.
MT9V022177ATM
MT9V022177ATM by Onsemi is a 1/3 inch CMOS image sensor with 752x480 pixels. It operates at 26.6 MHz, has a dynamic range of 54.4 dB, and supports a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in devices such as cameras and surveillance systems.
NOIP1FN5000A-LTI
NOIP1FN5000A-LTI by Onsemi is a 4.8x4.8 um CMOS image sensor with 2592x2048 pixels, offering a dynamic range of 60 dB and sensitivity of 7.5 V/lx.s. It operates b/w -40 to 85 °C, has a max supply voltage of 1.9 V, and supports a frame rate of 100 fps. Ideal for applications requiring high-resolution imaging in various lighting conditions.
MT9V022IA7ATC
MT9V022IA7ATC by Onsemi is an image sensor with 6x6 um pixel size, 26.6 MHz master clock, and 752 horizontal pixels. Ideal for applications requiring a digital current output interface, such as frame arrays in cameras or surveillance systems.
AR0331SRSC00SHCA0-DRBR
Onsemi's AR0331SRSC00SHCA0-DRBR is a 2.2x2.2 um CMOS image sensor with 2048H x 1536V pixels, offering a dynamic range of 100 dB and operating at temperatures from -30 to 85 °C. It features a digital current output interface, operates at a max supply voltage of 1.95 V, and has a frame rate of 60 fps, making it ideal for high-quality imaging applications.
MT9M413C36STM-DR
The Onsemi MT9M413C36STM-DR is a CMOS image sensor with 12x12 um pixel size, 1280 horizontal pixels, and 1024 vertical pixels. It operates at a max supply voltage of 3.6V and has a master clock of 66 MHz. Ideal for applications requiring high-resolution imaging in environments with temperatures ranging from -5 to 60 °C.
AR0144CSSM20SUKA0-CPBR1
The Onsemi AR0144CSSM20SUKA0-CPBR1 is a 1280x800 CMOS image sensor with a 1/4-inch optical format. It features a 2-wire interface, solder termination, and surface mounting for applications in digital cameras, smartphones, and automotive imaging systems.
AMIS-710225
Image Sensors; Horizontal Pixel: 832; Power Supplies (V): 5; Maximum Operating Temperature: 50 Cel; Minimum Operating Temperature: 0 Cel;
KAF-16803-ABA-DD-AE
The Onsemi KAF-16803-ABA-DD-AE is a CCD image sensor with 4096x4096 pixels, 9x9 um pixel size, and 80 dB dynamic range. It operates b/w -60 to 60 °C, has a spectral response of 300-1100 nm, and data rate of 10 Mbps. Ideal for high-resolution imaging applications in astronomy, microscopy, and scientific research.
AR0239ATSH00XUEA0-DRBR-E
Onsemi's AR0239ATSH00XUEA0-DRBR-E is a 3x3 um CMOS image sensor with 1936H x 1188V pixels, offering a dynamic range of 128 dB. Operating at -40 to 105 °C, it has a digital voltage output interface and supports frame rates up to 90 fps. Ideal for applications requiring high-resolution imaging in automotive and surveillance systems.
KAI-16070-QXA-JD-B2
KAI-16070-QXA-JD-B2 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 40 MHz master clock, and 4864 horizontal pixels. Ideal for applications requiring high-resolution imaging in industrial cameras or scientific instruments due to its 70.5 dB dynamic range and INTERLINE array type.
KAI-4010CM
Image Sensors;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
11KAI-04070-CBA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Height: 3 mm; Maximum Supply Voltage: 15.5 V; Termination Type: SOLDER;
11KAI-04070-CBA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 11 mA; Maximum Supply Voltage: 15.5 V; Body Height: 3 mm;
11KAI-04070-FBA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -50 Cel; Maximum Operating Temperature: 70 Cel; Vertical Pixel: 2048;
11KAI-04070-FBA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Maximum Operating Current: 11 mA; Minimum Operating Temperature: -50 Cel;
11KAI-04070-PBA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Array Type: INTERLINE; Frame Rate: 28 fps;
11KAI-04070-QBA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Pixel Size (um): 7.4X7.4; Maximum Operating Current: 11 mA; Body Length/Diameter: 40 mm;
11KAI-04070-QBA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Frame Rate: 28 fps; Dynamic Range: 70.5 dB; Maximum Operating Temperature: 70 Cel;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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