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TC237B

Texas Instruments

TC237B by Texas Instruments

TC237B by Texas Instruments is an image sensor with 7.4x7.4 um pixel size and 680 horizontal pixels. It operates b/w -10 to 45 °C, with a supply voltage range of 21-23 V. Ideal for applications requiring high sensitivity and a dynamic range of 58 dB in a compact rectangular package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,332 parts In-Stock

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Digiode

USA . 1,015 parts In-Stock

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1,015

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One Stop Electronics

USA . 1,460 parts In-Stock

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$0.750

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$0.750

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Parana Technologies

USA . 1,653 parts In-Stock

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$1.813

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$2.367

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$1.813

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$2.367

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DigiPath Technology Company

USA . 1,309 parts In-Stock

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$1.996

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$1.837

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$1.837

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IDEA Electronic Components Group

UK . 2,077 parts In-Stock

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$2.037

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$1.833

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2,077

$2.037

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$1.833

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ChromeModa Solutions

Germany . 1,324 parts In-Stock

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$2.037

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$1.670

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$2.037

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AZTECH Wire

Italy . 815 parts In-Stock

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$13.575

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815

$13.575

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Ampacity Inc.

Singapore . 396 parts In-Stock

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$24.750

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$24.750

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Semicontronic

India . 1,045 parts In-Stock

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$52.750

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$51.431

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$51.168

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$52.750

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Corphita

USA . 1,807 parts In-Stock

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Corohmni

South Africa . 372 parts In-Stock

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Overview

Elevate your imaging experience with the TC237B by Texas Instruments, a top-of-the-line image sensor that delivers exceptional quality and performance. With its innovative design and cutting-edge technology, this sensor is perfect for a wide range of applications in various industries. Whether you're capturing stunning visuals for security systems, medical imaging, or industrial automation, the TC237B offers unparalleled value, benefits, and advantages to meet all your imaging needs. Trust in Texas Instruments' reputation for excellence and choose the TC237B for superior results every time.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

The small pixel size allows for high resolution and detailed image capture.

Maximum Supply Voltage: 23 V

Allows for efficient power supply operation within the specified voltage range.

Body Width: 11 inch

Compact design for easy integration into various devices or systems.

Power Supplies (V): 22

Stable power supply voltage for consistent performance.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors offer high-quality image capture for accurate imaging.

Body Height: 3.7 mm

Low profile body for flexible mounting options and space-saving designs.

Package Shape or Style: RECTANGULAR

Rectangular shape for easy fitting and alignment in devices.

Minimum Supply Voltage: 21 V

Allows for operation even at lower supply voltages for energy efficiency.

Maximum Operating Temperature: 45 °C

High operating temperature range for versatile use in various environments.

Output Type: ANALOG VOLTAGE

Analog voltage output for compatibility with a wide range of systems.

Minimum Operating Temperature: -10 °C

Low operating temperature tolerance for use in cold environments.

Maximum Operating Current: 10 mA

Low current consumption for energy-efficient operation.

Housing: CERAMIC, METAL-SEALED COFIRED

Durable housing materials for long-term reliability and performance.

Dynamic Range: 58 dB

High dynamic range for capturing both dark and bright areas of an image effectively.

Vertical Pixel: 500

Optimal number of vertical pixels for clear and detailed image capture.

Body Length/Diameter: 12.2 mm

Compact body size for easy installation and space-saving designs.

Optical Format (inch): 1/3

Standard optical format for compatibility with various lenses.

Termination Type: SOLDER

Solder termination for secure and reliable connections.

Array Type: FRAME TRANSFER

Frame transfer array type for high-speed image capture and processing.

Sensitivity (V/lx.s): 0.03 V/lx.s

High sensitivity for capturing images in low-light conditions effectively.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature for easy and secure installation.

Technical Specifications

Image Sensors TC237B attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Array Type:

FRAME TRANSFER

Body Width:

11 inch

Body Height:

3.7 mm

Body Length/Diameter:

12.2 mm

Dynamic Range:

58 dB

Horizontal Pixel:

680

Housing:

CERAMIC, METAL-SEALED COFIRED

Mounting Feature:

Maximum Operating Current:

10 mA

Maximum Operating Temperature:

45 Cel

Minimum Operating Temperature:

-10 Cel

Optical Format (inch):

1/3

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Power Supplies (V):

22

Sensitivity (V/lx.s):

.03 V/lx.s

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

23 V

Minimum Supply Voltage:

21 V

Termination Type:

SOLDER

Vertical Pixel:

500

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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