Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MT9V024IA7XTM-DR1 by Onsemi is a 1/3-inch CMOS image sensor with 6x6 um pixel size, offering 60 fps frame rate. Ideal for applications requiring high-quality imaging such as surveillance cameras and industrial machine vision systems.
Median Price
$21.462
Lifecycle Status
Suppliers In-Stock
5
In-Stock Inventory
1k+
Flip Electronics (Authorized)
1+ parts
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100+ parts
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Advanced Electronics
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SupplyDigital Components
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Argo Parts USA
UHIMA Technologies
Corphita
A smaller pixel size allows for higher resolution images to be captured, making this image sensor suitable for applications where detailed images are required.
CMOS image sensors are known for their low power consumption, making this product energy-efficient and ideal for devices that require extended battery life.
The combination of tin, silver, and copper terminal finish ensures good conductivity and reliability, which is important for maintaining signal integrity in the image sensor.
The 1/3 inch optical format is a popular size in image sensors, providing a good balance between image quality and sensor size, making it suitable for a wide range of applications.
Solder termination provides a secure and reliable connection, ensuring the image sensor maintains good electrical contact and performance over time.
A high frame rate of 60 frames per second allows for smooth and detailed image capture, making this image sensor suitable for fast-paced applications where motion needs to be accurately captured.
The frame array type enables the image sensor to capture the entire image in a single frame, reducing the need for multiple exposures and improving overall efficiency.
The surface mount design allows for easy and secure installation of the image sensor onto circuit boards, making it suitable for compact devices where space is limited.
Image Sensors MT9V024IA7XTM-DR1 attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Frame Rate:
JESD-609 Code:
Mounting Feature:
Optical Format (inch):
Pixel Size (um):
Sensors or Transducers Type:
Terminal Finish:
Termination Type:
PCN Obsolescence/ EOL - Obsolete Notice 30/Sep/2022
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
NC7WZ17P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WT
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Shenzhen Socay Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
MBR0530T1G
Onsemi
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
Db Lectro
STM32H753ZIT6
STMicroelectronics
STM32H753ZIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20-Ch 16-Bit ADC and 2-Ch 12-Bit DAC channels. With a clock frequency of up to 48 MHz, it is ideal for industrial applications requiring CAN, Ethernet, and USB connectivity. This microcontroller operates b/w -40°C to +85°C temperature range.
First Components International
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
1N4148WS
Meritek Electronics
EU2B-YS2J03F
Idec
ROTARY SWITCH;
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
CRG0805F10K
TE Connectivity
TE Connectivity's CRG0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in various electronic circuits due to its compact size and high temperature rating.
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
Central Semiconductor
MT9V034C12STM-DR1
Onsemi's MT9V034C12STM-DR1 image sensor features 6x6 um pixel size, 27 MHz master clock, and 752x480 resolution. Ideal for applications requiring high sensitivity (4.8 V/lx.s) and a wide dynamic range of 100 dB. Suitable for surface mounting in various imaging systems.
NOIP1SN0500A-QTI
NOIP1SN0500A-QTI by Onsemi is an Image Sensor with 4.80X4.80 um pixel size, 72 MHz master clock, and 800x600 resolution. Ideal for digital imaging applications requiring high frame rates up to 545 fps in a compact SQUARE package suitable for SURFACE mounting.
KAI-11002-AAA-CR-B1
Onsemi's KAI-11002-AAA-CR-B1 is a 9x9 um pixel size CCD image sensor with 4008 horizontal and 2672 vertical pixels. It operates at a supply voltage range of 14.5V to 15.5V, offering an analog voltage output type and a dynamic range of 28 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAE-02152-FBB-SD-FA
The Onsemi KAE-02152-FBB-SD-FA is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 86dB dynamic range. It operates b/w -40 °C to +40°C and features current output. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
TCD1304DG(8Z,AW)
Toshiba
Toshiba's TCD1304DG(8Z,AW) is an 8X200 um CCD image sensor with a 2 MHz master clock. Operating at 3-5.5V, it offers a spectral response of 400-1200nm and sensitivity of 160 V/lx.s. Ideal for applications requiring high-resolution imaging in industrial automation and scientific instruments.
MT9M034I12STC-DRBR
MT9M034I12STC-DRBR by Onsemi is an image sensor with 1280x960 pixels, 3.75um pixel size, and 115dB dynamic range. It operates at -30 to 70 °C, has a digital current output type, and uses a 2-wire interface. Ideal for applications requiring high-resolution imaging in various lighting conditions.
TSL1401CL
Ams-taos Usa
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.60-2.40V; Array Type: LINEAR;
CYII4SM6600AB-QDC
Onsemi's CYII4SM6600AB-QDC is a 3.5x3.5 um CMOS image sensor with 2210H x 3002V pixels, operating at 40 MHz clock speed. It offers a digital voltage output range of 0.50-2.80V and features a full-frame array design, suitable for applications requiring high sensitivity and dynamic range in imaging systems.
MT9M001C12STM-DR1
Onsemi's MT9M001C12STM-DR1 image sensor features 5.2x5.2 um pixel size, 3V to 3.6V supply voltage range, and 48 MHz master clock. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high resolution of 1280x1024 pixels and square package style with a ceramic housing.
AR0135CS2M00SUEA0-DRBR1
Onsemi's AR0135CS2M00SUEA0-DRBR1 is a 1/3 inch CMOS image sensor with 1280x960 pixels, offering a dynamic range of 71.1 dB and operating at temperatures from -30 to 70°C. With a max supply voltage of 1.95V and output interface type of 2-WIRE INTERFACE, it is ideal for applications requiring high-resolution imaging at up to 54 fps.
OV02680-H47A
Omnivision Technologies
OV02680-H47A by Omnivision Technologies is an image sensor with 1.75x1.75 um pixel size, ideal for applications requiring high-resolution imaging. Operating at temperatures from -30 to 85 °C, it offers a resolution of 1616x1216 pixels and runs on a power supply of 1.58V.
AMIS-710403-A6
Image Sensors; Minimum Operating Temperature: 0 Cel; Maximum Operating Temperature: 50 Cel; Power Supplies (V): 5; Horizontal Pixel: 1664;
AR0330CM1C25SUD20
Onsemi's AR0330CM1C25SUD20 is a 2.2x2.2um CMOS image sensor with 2304H x 1536V pixels, operating at 27MHz clock rate. It offers a dynamic range of 69.5dB and spectral response of 350-1150nm, suitable for applications requiring high-resolution imaging in automotive cameras and surveillance systems.
KAI-0373-EBA-CB-BA
KAI-0373-EBA-CB-BA by Onsemi is an image sensor with 768x484 pixels, 11.6X13.6 um pixel size, and 60 dB dynamic range. It operates b/w -25 to +40 °C and has a supply voltage range of 14.5V to 15.5V. This rectangular CCD sensor is ideal for applications requiring high-quality imaging in industrial settings.
AR0234CSSC28SUKA0-CP1
AR0234CSSC28SUKA0-CP1 by Onsemi is an image sensor with 1920x1200 resolution, 3x3 um pixel size, and 54 MHz master clock. It operates b/w -40 to 85 °C and offers a dynamic range of 71.4 dB. Ideal for applications requiring high-resolution imaging at fast frame rates like surveillance cameras or industrial machine vision systems.
KAF-4320-AAA-JP-B1
The Onsemi KAF-4320-AAA-JP-B1 is a CCD image sensor with 24x24 um pixel size, offering 2084 (H) x 2085 (V) resolution. It operates b/w -70 °C to 50°C, providing a dynamic range of 87.5 dB and spectral response of 300-1200 nm. Ideal for applications requiring high-resolution imaging in various environmental conditions.
MT9V022I77ATC
MT9V022I77ATC by Onsemi is a 1/3-inch CMOS image sensor with 752x480 pixels. It operates at 26.6 MHz master clock, offers a dynamic range of 54.4 dB, and supports a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in industrial and automotive sectors.
KAI-29050-AAA-JP-B2
Onsemi's KAI-29050-AAA-JP-B2 is a 5.5x5.5 um CCD image sensor with 6576 (H) x 4384 (V) pixels, offering a dynamic range of 64 dB. It operates b/w -50 to 70 °C, with data rate of 40 Mbps and frame rate of 4 fps. Ideal for applications requiring high-resolution imaging in industrial and scientific fields.
MT9V024IA7XTC
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-3V; Additional Features: GLOBAL SHUTTER;
OV10635-N29Y-PB
Image Sensors; Screening Level: AEC-Q100;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MT9V024IA7XTM-DP2
MT9V024IA7XTM-DP2 by Onsemi is a 1/3" CMOS image sensor with 6x6 um pixel size, offering 60 fps frame rate. Ideal for surface mount applications in various imaging devices due to its compact 9mm square package design.
MT9V024IA7XTM-DP1
MT9V024IA7XTM-DP1 by Onsemi is a 1/3-inch CMOS image sensor with 6x6 um pixel size. It offers 60 fps frame rate, solder termination, and surface mounting feature. Ideal for applications requiring high-quality imaging in compact devices like smartphones and security cameras.
MT9V024IA7XTM-DR
MT9V024IA7XTM-DR by Onsemi is a 1/3-inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100 dB. Operating at -40 to 105°C, it has a frame rate of 60 fps and digital voltage output interface. Ideal for applications requiring high-quality imaging in varying temperature conditions.
MT9V024IA7XTM-DP
MT9V024IA7XTM-DP by Onsemi features a 6x6 um pixel size, 27 MHz master clock, and 100 dB dynamic range. Ideal for image sensing applications in devices requiring high-resolution imaging capabilities.
MT9V034C12STM-DP1
The Onsemi MT9V034C12STM-DP1 is a 1/3 inch CMOS image sensor with a pixel size of 6X6 um. It operates at a max supply voltage of 3.6 V and has a master clock frequency of 27 MHz. This sensor is commonly used in applications requiring high-resolution imaging at a frame rate of 60 fps.
MT9V034C12STM-DP
Onsemi's MT9V034C12STM-DP is a 1/3 inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100 dB. Operating at 60 fps with a pixel size of 6x6 um, it has an output interface type of 2-WIRE INTERFACE. Ideal for applications requiring high-resolution imaging and low-light sensitivity in compact devices.
MT9V024IA7XTM-TR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-3V; Maximum Operating Temperature: 105 Cel;
MT9V024IA7XTM-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-3V; Master Clock: 27 MHz;
MT9V024IA7XTC-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: -11-11mA; Body Width: 11.43 inch;
MT9V034C12STM-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: -11-11mA; Optical Format (inch): 1/3;
MT9V034C12STM-DR
Onsemi's MT9V034C12STM-DR is a 1/3-inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100dB. Operating at 60fps with a pixel size of 6x6um, it has an output interface type of 2-WIRE INTERFACE. Ideal for applications requiring high-resolution imaging and fast frame rates in compact designs.
MT9V024IA7XTM
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Dynamic Range: 100 dB; Vertical Pixel: 480; Minimum Operating Temperature: -40 Cel;
MT9V128IA3XTC-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Termination Type: SOLDER; Dynamic Range: 74.8 dB;
MT9V128IA3XTC-DP1
IMAGE SENSOR,CMOS; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);
MT9V128IA3XTC-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Minimum Operating Temperature: -40 Cel; Body Width: 9 inch;
MT9V128IA3XTC-DR1
MT9V128IA3XTC-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; JESD-609 Code: e1; Termination Type: SOLDER;
Supply Digital Components
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Quantity
12,000 In-Stock
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