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MT9V034C12STM-TR

Onsemi

MT9V034C12STM-TR by Onsemi

MT9V034C12STM-TR by Onsemi is a 1/3 inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100 dB. It operates at a max supply voltage of 3.6 V and features a digital current output interface. Ideal for applications requiring high-resolution imaging at up to 60 fps.

Median Price

$11.277

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

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$11.277

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$11.277

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Vyrian

USA . 2,311 parts In-Stock

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Digiode

USA . 1,516 parts In-Stock

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1,516

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Distributors (Availability)

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Corohmni

South Africa . 76 parts In-Stock

1+ parts

$11.054

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76

$11.054

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Continental Prestige Electronics

USA . 5,059 parts In-Stock

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$11.277

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$11.051

5,059

$11.277

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$11.051

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$11.280

100+ parts

$10.716

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$10.039

10

$11.280

$10.716

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$10.039

AZTECH Wire

Italy . 597 parts In-Stock

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$18.464

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597

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Ampacity Inc.

Singapore . 402 parts In-Stock

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$19.750

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402

$19.750

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Lixinc

USA . 19,991 parts In-Stock

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Problanco Electronics

Mexico . 7,831 parts In-Stock

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Kulean Microsystems

USA . 5,628 parts In-Stock

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SupplyDigital Components

Austria . 3,673 parts In-Stock

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Argo Parts USA

USA . 1,251 parts In-Stock

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Corphita

USA . 788 parts In-Stock

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788

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UHIMA Technologies

Türkiye . 564 parts In-Stock

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564

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TANS Electronics

Latvia . 401 parts In-Stock

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401

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Overview

Elevate your imaging experience with the MT9V034C12STM-TR by Onsemi. As a leading manufacturer in the industry, Onsemi delivers unparalleled quality and reliability in their image sensors. Ideal for applications requiring high-resolution imaging, this CMOS sensor offers a dynamic range of 100 dB and a frame rate of 60 fps, ensuring crisp and clear visuals every time. Whether you're capturing still images or recording video, this sensor provides exceptional value, performance, and versatility for all your imaging needs. Trust Onsemi to enhance your imaging capabilities with the MT9V034C12STM-TR.

Feature Benefit Bullets

Pixel Size (um): 6X6

The small pixel size allows for high resolution images to be captured with this image sensor.

Maximum Supply Voltage: 3.6 V

This higher supply voltage provides sufficient power for the sensor to operate effectively.

Master Clock: 27 MHz

The fast master clock speed ensures quick and accurate image processing.

Body Width: 11.43 inch

The compact body width makes it easy to integrate this sensor into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

The CMOS sensor type offers high image quality and low power consumption.

Body Height: 2.3 mm

The slim body height allows for easy placement in devices with limited space.

Package Shape or Style: SQUARE

The square package shape provides a stable and sturdy design for the sensor.

Minimum Supply Voltage: 3 V

The low minimum supply voltage helps in conserving power during operation.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the sensor to be used in a variety of environments.

Horizontal Pixel: 752

The high horizontal pixel count results in detailed and sharp images being captured.

Output Range: -11-11mA

The wide output range allows for precise and accurate digital current output.

Output Type: DIGITAL CURRENT

The digital current output ensures compatibility with modern digital systems.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature means the sensor can still function in chilly conditions.

Maximum Operating Current: 60 mA

The sensor can handle a higher operating current, enabling it to capture images quickly.

Housing: CERAMIC

The ceramic housing provides durability and protects the sensor from damage.

Dynamic Range: 100 dB

The high dynamic range enables the sensor to capture both bright and dark areas accurately.

Vertical Pixel: 480

The vertical pixel count contributes to the overall image quality and resolution of the sensor.

Body Length/Diameter: 11.43 mm

The compact body length/diameter makes the sensor easy to handle and install.

Optical Format (inch): 1/3

The 1/3 inch optical format is a common standard in image sensors, ensuring compatibility with various devices.

Termination Type: SOLDER

The solder termination type allows for easy and secure connections during installation.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface provides a simple and efficient way to connect the sensor to other devices.

Frame Rate: 60 fps

The high frame rate ensures smooth and fluid motion capture when using the sensor.

Array Type: FRAME

The frame array type organizes the pixels in a structured manner, optimizing image quality.

Sensitivity (V/lx.s): 4.8 V/lx.s

The high sensitivity allows the sensor to capture clear images even in low light conditions.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies the installation process and makes the sensor suitable for a wide range of devices.

Technical Specifications

Image Sensors MT9V034C12STM-TR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

DUAL OUTPUT

Array Type:

FRAME

Body Width:

11.43 inch

Body Height:

2.3 mm

Body Length/Diameter:

11.43 mm

Dynamic Range:

100 dB

Frame Rate:

60 fps

Horizontal Pixel:

752

Housing:

CERAMIC

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

60 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

6X6

Sensitivity (V/lx.s):

4.8 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Vertical Pixel:

480

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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