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KAI-16000-CXA-JD-AE

Onsemi

KAI-16000-CXA-JD-AE by Onsemi

KAI-16000-CXA-JD-AE by Onsemi is an image sensor with 7.4um pixel size, 4872 horizontal pixels, and 3248 vertical pixels. It operates at a max supply voltage of 15.5V and has a dynamic range of 65dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,085 parts In-Stock

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Digiode

USA . 520 parts In-Stock

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Problanco Electronics

Mexico . 5,163 parts In-Stock

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TANS Electronics

Latvia . 5,066 parts In-Stock

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SupplyDigital Components

Austria . 4,902 parts In-Stock

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Kulean Microsystems

USA . 2,254 parts In-Stock

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Corphita

USA . 1,156 parts In-Stock

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UHIMA Technologies

Türkiye . 255 parts In-Stock

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Corohmni

South Africa . 207 parts In-Stock

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Overview

Capture every moment with the high-quality KAI-16000-CXA-JD-AE Image Sensor by Onsemi. Designed for exceptional performance, this sensor offers unparalleled clarity and precision in image capture. Whether you're a professional photographer, security system developer, or medical imaging specialist, this sensor delivers unmatched value and reliability. Experience the benefits of cutting-edge technology and elevate your projects to new heights with the KAI-16000-CXA-JD-AE Image Sensor.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Smaller pixel size allows for higher resolution images to be captured, making this product suitable for applications where detailed images are required.

Maximum Supply Voltage: 15.5 V

Higher supply voltage allows for better performance and flexibility in various operating conditions.

Body Width: 45.34 inch

Compact body width makes it easy to integrate this image sensor into different devices or systems without taking up much space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensors are known for their high-quality image capture capabilities, making this product suitable for applications where image accuracy is crucial.

Body Height: 4.88 mm

Low body height allows for a slim design and easy integration into various devices or systems.

Package Shape or Style: RECTANGULAR

Rectangular package shape provides stability and ease of mounting during integration.

Minimum Supply Voltage: 14.5 V

Relatively low minimum supply voltage helps in reducing power consumption and overall energy efficiency of the product.

Horizontal Pixel: 4872

High horizontal pixel count enables capturing wide and detailed images, suitable for various imaging applications.

Output Type: ANALOG VOLTAGE

Analog voltage output provides compatibility with a wide range of systems and applications, making this image sensor versatile in its use.

Dynamic Range: 65 dB

Good dynamic range allows for capturing images with high contrast and detail, ensuring accurate representation of the scene being captured.

Vertical Pixel: 3248

High vertical pixel count provides detailed images with good resolution, ideal for applications where vertical detail is important.

Body Length/Diameter: 44.45 mm

Compact body length/diameter makes this image sensor suitable for integration into smaller devices or systems without compromising on performance.

Data Rate: 30 Mbps

High data rate enables fast and efficient transfer of image data, making this sensor suitable for real-time imaging applications.

Termination Type: SOLDER

Solder termination provides a reliable and secure connection during integration, ensuring the longevity of the product.

Array Type: INTERLINE

Interline array type offers fast readout speeds and reduced image lag, making this product suitable for applications requiring quick image capture.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature provides a stable and secure mounting option for easy integration into different systems or devices.

Technical Specifications

Image Sensors KAI-16000-CXA-JD-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 30 UV/ELECTRON

Array Type:

INTERLINE

Body Width:

45.34 inch

Body Height:

4.88 mm

Body Length/Diameter:

44.45 mm

Data Rate:

30 Mbps

Dynamic Range:

65 dB

Horizontal Pixel:

4872

Mounting Feature:

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

3248

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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