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AR0132AT6R00XPEA0-TRBR

Onsemi

AR0132AT6R00XPEA0-TRBR by Onsemi

Onsemi's AR0132AT6R00XPEA0-TRBR is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 115dB dynamic range. It operates at -40 to 105 °C, has a max supply voltage of 1.95V, and uses a digital output interface. Ideal for applications requiring high-resolution imaging in varying temperature conditions.

Median Price

$16.210

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 28,698 parts In-Stock

1+ parts

-

100+ parts

$16.990

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28,698

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$16.990

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Flip Electronics (Authorized)

USA . 28,698 parts In-Stock

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28,698

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Rochester

USA . 1,996 parts In-Stock

1+ parts

-

100+ parts

$15.430

1k+ parts

$13.800

10k+ parts

$12.990

1,996

-

$15.430

$13.800

$12.990

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,152 parts In-Stock

1+ parts

$16.321

100+ parts

-

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2,152

$16.321

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Vyrian

USA . 2,385 parts In-Stock

1+ parts

$16.990

100+ parts

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2,385

$16.990

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Flip Electronics

USA . 28,698 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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28,698

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 172 parts In-Stock

1+ parts

$0.409

100+ parts

-

1k+ parts

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10k+ parts

$0.393

172

$0.409

-

-

$0.393

Northwest PG Solutions

USA . 1,294 parts In-Stock

1+ parts

$0.450

100+ parts

-

1k+ parts

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10k+ parts

$0.397

1,294

$0.450

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-

$0.397

Corphita

USA . 1,579 parts In-Stock

1+ parts

$15.462

100+ parts

-

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1,579

$15.462

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Corohmni

South Africa . 327 parts In-Stock

1+ parts

$16.990

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327

$16.990

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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9,000

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SupplyDigital Components

Austria . 7,688 parts In-Stock

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7,688

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Kulean Microsystems

USA . 6,506 parts In-Stock

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6,506

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TANS Electronics

Latvia . 4,909 parts In-Stock

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4,909

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Problanco Electronics

Mexico . 3,354 parts In-Stock

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3,354

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UHIMA Technologies

Türkiye . 229 parts In-Stock

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229

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Overview

Capture every moment in stunning detail with the AR0132AT6R00XPEA0-TRBR Image Sensor by Onsemi. As a leader in imaging technology, Onsemi delivers top-quality sensors that are perfect for a wide range of applications. Whether you're creating cutting-edge security systems, enhancing automotive safety features, or developing innovative medical devices, this image sensor offers unparalleled performance and reliability. Trust Onsemi to provide you with the tools you need to bring your vision to life.

Feature Benefit Bullets

Pixel Size (um): 3.75

A smaller pixel size allows for higher resolution and better image quality.

Maximum Supply Voltage: 1.95 V

Allows for efficient power consumption and compatibility with various systems.

Master Clock: 50 MHz

High master clock frequency enables fast data processing and image capture.

Body Width: 9 inch

Compact design makes it suitable for integration into small devices or equipment.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS sensors offer low power consumption, high speed, and integration capabilities.

Package Shape or Style: SQUARE

Square package shape provides easy mounting and alignment during installation.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage improves energy efficiency and extends battery life.

Maximum Operating Temperature: 105 °C

Wide operating temperature range allows for use in various environments or conditions.

Horizontal Pixel: 1280

High horizontal pixel count ensures detailed and sharp images.

Output Range: 0.40-1.50V

Wide output voltage range offers flexibility in signal processing and compatibility.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and reduces noise interference.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in cold environments or applications.

Terminal Finish: TIN SILVER COPPER

High-quality terminal finish ensures reliable connections and signal transmission.

Maximum Operating Current: 130 mA

Low operating current consumption helps in reducing power usage and heat generation.

Dynamic Range: 115 dB

High dynamic range enables the sensor to capture a wide range of light intensities.

Vertical Pixel: 960

Vertical pixel count contributes to the overall image resolution and quality.

Body Length/Diameter: 9 mm

Compact body size simplifies installation and integration into devices or systems.

Optical Format (inch): 1/3

Complies with industry standards and ensures compatibility with various optical components.

Termination Type: SOLDER

Solder termination provides secure and reliable electrical connections.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and data transfer between the sensor and the system.

Frame Rate: 60 fps

High frame rate enables smooth and real-time video recording or streaming.

Array Type: LINEAR

Linear array design ensures uniform image capture and accurate pixel alignment.

Mounting Feature: SURFACE MOUNT

Surface mount compatibility offers easy integration and secure attachment onto PCBs or surfaces.

Technical Specifications

Image Sensors AR0132AT6R00XPEA0-TRBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.5-3.1 V; ELECTRONIC ROLLING SHUTTER

Array Type:

LINEAR

Body Width:

9 inch

Body Height:

1.4 mm

Body Length/Diameter:

9 mm

Dynamic Range:

115 dB

Frame Rate:

60 fps

Horizontal Pixel:

1280

JESD-609 Code:

e1

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

130 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

TIN SILVER COPPER

Termination Type:

SOLDER

Vertical Pixel:

960

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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