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KAI-08050-ABA-JD-BA

Onsemi

KAI-08050-ABA-JD-BA by Onsemi

KAI-08050-ABA-JD-BA by Onsemi is a 5.5x5.5 um CCD image sensor with 3296 (H) x 2472 (V) pixels, offering a dynamic range of 64 dB. It operates b/w -50 °C to 70°C and has an optical format of 4/3 inch. Ideal for applications requiring high-quality imaging in industrial and scientific fields.

Median Price

$1,407.040

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

$1,407.040

100+ parts

$1,379.040

1k+ parts

$1,350.890

10k+ parts

-

2

$1,407.040

$1,379.040

$1,350.890

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 900 parts In-Stock

1+ parts

$1,336.688

100+ parts

-

1k+ parts

-

10k+ parts

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900

$1,336.688

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-

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Vyrian

USA . 3,570 parts In-Stock

1+ parts

-

100+ parts

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3,570

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,165 parts In-Stock

1+ parts

$1,266.336

100+ parts

-

1k+ parts

-

10k+ parts

-

2,165

$1,266.336

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-

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Corohmni

South Africa . 172 parts In-Stock

1+ parts

$1,407.040

100+ parts

-

1k+ parts

-

10k+ parts

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172

$1,407.040

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-

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TANS Electronics

Latvia . 5,469 parts In-Stock

1+ parts

-

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5,469

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Problanco Electronics

Mexico . 5,132 parts In-Stock

1+ parts

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5,132

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SupplyDigital Components

Austria . 3,109 parts In-Stock

1+ parts

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3,109

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Kulean Microsystems

USA . 702 parts In-Stock

1+ parts

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702

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UHIMA Technologies

Türkiye . 144 parts In-Stock

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144

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Overview

Experience crystal-clear imaging like never before with the KAI-08050-ABA-JD-BA by Onsemi. As a leading manufacturer in image sensors, Onsemi delivers exceptional quality and reliability. This CCD image sensor boasts a pixel size of 5.5X5.5 um and a dynamic range of 64 dB, offering unparalleled performance in a compact package. Perfect for applications in surveillance, medical imaging, and industrial automation, this sensor provides unmatched value and precision for all your imaging needs. Elevate your projects with the advanced technology of the KAI-08050-ABA-JD-BA.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

The small pixel size allows for high resolution images with fine details.

Body Width: 29 inch

The compact body width makes the sensor suitable for integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high-quality image capture capabilities.

Body Height: 3.34 mm

The low profile body height enables slim design possibilities for products.

Package Shape or Style: RECTANGULAR

The rectangular shape allows for easy placement and installation in devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Horizontal Pixel: 3296

The high horizontal pixel count contributes to detailed and sharp image output.

Minimum Operating Temperature: -50 °C

The low minimum operating temperature allows for use in extreme cold conditions.

Dynamic Range: 64 dB

The wide dynamic range ensures accurate representation of both dark and bright areas in the image.

Vertical Pixel: 2472

The high vertical pixel count adds to the overall image quality and resolution.

Body Length/Diameter: 40 mm

The moderate body length/diameter allows for versatility in design and integration.

Optical Format (inch): 4/3

The 4/3 optical format is a common standard, ensuring compatibility with other components.

Termination Type: SOLDER

Solder termination provides a secure and reliable connection for the sensor.

Frame Rate: 16 fps

The frame rate of 16 fps allows for smooth video recording and image capture.

Array Type: INTERLINE

Interline array type offers fast readout speeds and reduced image lag.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting makes installation and replacement of the sensor easier in various electronic devices.

Technical Specifications

Image Sensors KAI-08050-ABA-JD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

29 inch

Body Height:

3.34 mm

Body Length/Diameter:

40 mm

Dynamic Range:

64 dB

Frame Rate:

16 fps

Horizontal Pixel:

3296

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

4/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

2472

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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