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VSP7502ZWVR

Texas Instruments

VSP7502ZWVR by Texas Instruments

VSP7502ZWVR by Texas Instruments is an 8mm square CCD image sensor with a supply voltage range of 1.65-1.95V, operating temperature from -25 to 85°C, and digital output voltage of 1.50-2.10V. Ideal for applications requiring precise imaging in compact devices due to its small form factor and surface mounting feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,507 parts In-Stock

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Digiode

USA . 2,685 parts In-Stock

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2,685

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Distributors (Availability)

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Parana Technologies

USA . 654 parts In-Stock

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$2.422

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$2.919

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654

$2.422

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$2.919

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DigiPath Technology Company

USA . 827 parts In-Stock

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$2.667

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827

$2.667

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ChromeModa Solutions

Germany . 3,218 parts In-Stock

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$2.721

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$2.231

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IDEA Electronic Components Group

UK . 1,967 parts In-Stock

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$2.721

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$2.449

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Ampacity Inc.

Singapore . 1,515 parts In-Stock

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$12.750

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$12.750

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AZTECH Wire

Italy . 234 parts In-Stock

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$18.028

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Semicontronic

India . 585 parts In-Stock

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$42.750

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$41.681

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$41.468

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$42.750

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$41.468

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One Stop Electronics

USA . 734 parts In-Stock

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$53.750

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734

$53.750

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Corphita

USA . 4,985 parts In-Stock

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Perfect Parts

USA . 1,178 parts In-Stock

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Corohmni

South Africa . 185 parts In-Stock

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Microchip USA

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Overview

Capture the world in stunning detail with the VSP7502ZWVR Image Sensor by Texas Instruments. Crafted with precision and expertise, this sensor offers unparalleled quality and reliability that you can trust. From enhancing security systems to revolutionizing medical imaging technology, the applications of this sensor are limitless. Experience the value and benefits that this product brings to your projects, from its compact design to its impressive output range. Take your creations to the next level with the VSP7502ZWVR Image Sensor - where innovation meets excellence.

Feature Benefit Bullets

Maximum Supply Voltage: 1.95 V

Allows for efficient power usage while providing sufficient voltage for optimal performance.

Body Width: 8 inch

Provides a compact size for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR, CCD

Utilizes CCD technology for high-quality image capturing and processing.

Body Height: 1.2 mm

Slim design enables the sensor to be used in thin electronic devices.

Package Shape or Style: SQUARE

Square shape allows for easy placement and alignment during installation.

Minimum Supply Voltage: 1.65 V

Ensures stable operation at lower power consumption levels.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for a variety of environments.

Output Range: 1.50-2.10V

Provides a precise output range for accurate voltage measurements.

Output Type: DIGITAL VOLTAGE

Outputs digital voltage signals for easy processing and interpretation.

Minimum Operating Temperature: -25 °C

Capable of operating in cold temperatures without compromising performance.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Durable terminal finish for reliable electrical connections.

Maximum Operating Current: 0.001 mA

Low operating current for energy-efficient operation.

Housing: PLASTIC

Lightweight and durable housing material for long-term use.

Body Length/Diameter: 8 mm

Compact size for easy integration and placement within devices.

Termination Type: SOLDER

Solder termination for secure and robust connections.

Mounting Feature: SURFACE MOUNT

Surface mount feature for easy and secure installation on circuit boards.

Technical Specifications

Image Sensors VSP7502ZWVR attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Additional Features:

ITS ALSO OPERATES IN 2.7 TO 3.6V

Body Width:

8 inch

Body Height:

1.2 mm

Body Length/Diameter:

8 mm

Housing:

PLASTIC

JESD-609 Code:

e1

Mounting Feature:

Maximum Operating Current:

.001 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Range:

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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