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AR0220AT4C00XUEA2-DRBR

Onsemi

AR0220AT4C00XUEA2-DRBR by Onsemi

Onsemi's AR0220AT4C00XUEA2-DRBR is a 1/1.8 inch CMOS image sensor with 1828x948 pixels, offering digital output at 60 fps. Ideal for frame array applications, it features a rectangular package style suitable for surface mount installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

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Digiode

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Kulean Microsystems

USA . 3,921 parts In-Stock

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TANS Electronics

Latvia . 2,668 parts In-Stock

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Problanco Electronics

Mexico . 2,582 parts In-Stock

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Northwest PG Solutions

USA . 2,248 parts In-Stock

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Corphita

USA . 1,658 parts In-Stock

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Native Components

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SupplyDigital Components

Austria . 466 parts In-Stock

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Corohmni

South Africa . 441 parts In-Stock

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UHIMA Technologies

Türkiye . 349 parts In-Stock

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Overview

Capture stunning images with the AR0220AT4C00XUEA2-DRBR image sensor from Onsemi. Known for their high-quality products, Onsemi delivers cutting-edge technology that exceeds industry standards. This top-of-the-line CMOS sensor is perfect for a wide range of applications, offering digital output and a fast frame rate of 60 fps. With its compact design and surface mount feature, this sensor is easy to integrate into any project. Trust Onsemi to provide you with the best in image sensor technology, delivering unmatched performance and reliability. Elevate your imaging experience with the AR0220AT4C00XUEA2-DRBR today.

Feature Benefit Bullets

Body Width: 9 inch

The compact size of the body width allows for easy integration into various types of cameras or imaging devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors offer high-quality image capture and low power consumption, making them ideal for a wide range of applications.

Body Height: 1.7 mm

The low profile body height enables slim design possibilities for cameras or imaging systems.

Package Shape or Style: RECTANGULAR

The rectangular package shape allows for efficient placement and alignment within devices or camera modules.

Horizontal Pixel: 1828

The high horizontal pixel count provides detailed and sharp image capture capabilities for superior image quality.

Output Type: DIGITAL OUTPUT

Digital output allows for easy interfacing with digital devices and processing units, enhancing compatibility and performance.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of high-quality terminal finishes ensures reliable connections and long-term durability for the image sensor.

Vertical Pixel: 948

The vertical pixel count complements the horizontal pixel count for capturing detailed images with good resolution.

Body Length/Diameter: 12 mm

The compact body length or diameter allows for flexible mounting options and space-saving in various applications.

Optical Format (inch): 1/1.8

The optical format is optimized for sensor performance and compatibility with various lens configurations for improved image capture.

Termination Type: SOLDER

Solder termination provides reliable electrical connections and ensures stable operation of the image sensor in different operating conditions.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies data transmission and communication with other devices, enhancing overall system efficiency.

Frame Rate: 60 fps

The high frame rate enables smooth and real-time image capture, essential for applications requiring fast-moving subject tracking or video recording.

Array Type: FRAME

The frame array type facilitates high-speed image processing and data readout, contributing to the overall performance and efficiency of the image sensor.

Mounting Feature: SURFACE MOUNT

The surface mount feature simplifies installation and integration into various devices or modules, ensuring secure mounting for stable operation.

Technical Specifications

Image Sensors AR0220AT4C00XUEA2-DRBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

AEC-Q100, ROLLING SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.7 mm

Body Length/Diameter:

12 mm

Frame Rate:

60 fps

Horizontal Pixel:

1828

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/1.8

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

948

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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