Loading...

AR0239SRSC00SUEA0-DP

Onsemi

AR0239SRSC00SUEA0-DP by Onsemi

Onsemi's AR0239SRSC00SUEA0-DP is a 3x3 um CMOS image sensor with 1936 (H) x 1188 (V) resolution. Featuring an optical format of 1/2.7 inch, it offers a frame rate of 90 fps. Ideal for applications requiring high-quality imaging in a compact form factor such as surveillance cameras and automotive vision systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,212 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,212

-

-

-

-

Flip Electronics

USA . 2,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,600

-

-

-

-

Digiode

USA . 1,732 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,732

-

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

VNN

France . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 500 parts In-Stock

1+ parts

$4.750

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$4.750

-

-

-

AZTECH Wire

Italy . 273 parts In-Stock

1+ parts

$13.890

100+ parts

-

1k+ parts

-

10k+ parts

-

273

$13.890

-

-

-

Perfect Parts

USA . 14,358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,358

-

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

TANS Electronics

Latvia . 4,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,380

-

-

-

-

Argo Parts USA

USA . 4,341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,341

-

-

-

-

Problanco Electronics

Mexico . 3,042 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,042

-

-

-

-

SupplyDigital Components

Austria . 2,418 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,418

-

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Kulean Microsystems

USA . 1,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,331

-

-

-

-

Continental Prestige Electronics

USA . 1,218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,218

-

-

-

-

Corphita

USA . 831 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

831

-

-

-

-

Corohmni

South Africa . 416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

416

-

-

-

-

UHIMA Technologies

Türkiye . 164 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

164

-

-

-

-

Overview

Revolutionize your imaging experience with the AR0239SRSC00SUEA0-DP by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality image sensors that guarantee exceptional performance and reliability. Ideal for a wide range of applications, this CMOS sensor boasts a high frame rate of 90 fps and an impressive pixel size of 3X3 um. With its advanced features and superior design, the AR0239SRSC00SUEA0-DP provides unparalleled value, ensuring stunning image quality and unmatched precision for all your imaging needs.

Feature Benefit Bullets

Pixel Size (um): 3X3

The small pixel size of 3X3 um allows for high resolution images to be captured with excellent detail and clarity.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors offer low power consumption and high sensitivity, resulting in efficient and high-quality image capture.

Horizontal Pixel: 1936

The large number of horizontal pixels allows for detailed and sharp images to be produced with a wide field of view.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of Tin, Silver, and Copper as terminal finishes ensures a reliable and durable connection for long-lasting performance.

Vertical Pixel: 1188

With 1188 vertical pixels, this image sensor can capture images with high resolution and excellent depth.

Optical Format (inch): 1/2.7

The 1/2.7 inch optical format provides a good balance between image quality and sensor size, making it suitable for a variety of applications.

Termination Type: SOLDER

The solder termination type ensures a secure and stable connection, reducing the risk of signal interference or loss.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface allows for easy and reliable communication between the image sensor and other devices, simplifying integration and operation.

Frame Rate: 90 fps

The high frame rate of 90 fps enables smooth and fluid video capture, perfect for applications that require fast moving visuals.

Array Type: SINGLE FRAME

The single frame array type simplifies the imaging process, allowing for easy capture of individual frames for accurate and precise image recording.

Mounting Feature: SURFACE MOUNT

The surface mounting feature makes installation quick and easy, saving time and effort during the assembly process.

Technical Specifications

Image Sensors AR0239SRSC00SUEA0-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER, PHASE-LOCKED LOOP

Array Type:

SINGLE FRAME

Frame Rate:

90 fps

Horizontal Pixel:

1936

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/2.7

Output Interface Type:

2-WIRE INTERFACE

Pixel Size (um):

3X3

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

1188

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19