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KAE-08152-ABA-JP-FA

Onsemi

KAE-08152-ABA-JP-FA by Onsemi

KAE-08152-ABA-JP-FA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 40 MHz master clock, and 86 dB dynamic range. Ideal for applications requiring high-resolution imaging in industrial cameras or surveillance systems due to its 2856x2856 pixel resolution and current output type.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,853 parts In-Stock

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Vyrian

USA . 506 parts In-Stock

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Kulean Microsystems

USA . 6,843 parts In-Stock

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TANS Electronics

Latvia . 4,979 parts In-Stock

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Problanco Electronics

Mexico . 3,486 parts In-Stock

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SupplyDigital Components

Austria . 1,879 parts In-Stock

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Corphita

USA . 1,833 parts In-Stock

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Corohmni

South Africa . 345 parts In-Stock

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UHIMA Technologies

Türkiye . 169 parts In-Stock

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Overview

Unlock the power of high-quality imaging with the KAE-08152-ABA-JP-FA by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their image sensors. Perfect for a wide range of applications, this sensor offers crystal-clear images and high performance. Experience unparalleled value and benefits with this advanced technology, providing customers with optimal results and endless possibilities. Elevate your imaging needs with the KAE-08152-ABA-JP-FA and discover a whole new world of visual excellence.

Feature Benefit Bullets

Pixel Size (um) 5.5X5.5

Small pixel size allows for high resolution images with fine details.

Maximum Supply Voltage 15.3 V

Wide voltage range provides flexibility in power supply options.

Master Clock 40 MHz

Fast master clock enables quick processing of images.

Body Width 41 inch

Compact body size for easy integration into devices.

Sensors or Transducers Type IMAGE SENSOR,CCD

High-quality CCD image sensor type ensures excellent image capture.

Body Height 5.62 mm

Low profile design for slim devices or installations.

Package Shape or Style RECTANGULAR

Rectangular shape for easy placement and alignment in products.

Minimum Supply Voltage 14.7 V

Low minimum supply voltage for efficient power usage.

Maximum Operating Temperature 60 °C

Wide operating temperature range for versatility in various environments.

Horizontal Pixel 2856

High horizontal pixel count for detailed, high-resolution images.

Output Type CURRENT OUTPUT

Current output type for accurate image data transmission.

Minimum Operating Temperature -50 °C

Ability to operate in low temperatures for diverse applications.

Dynamic Range 86 dB

Wide dynamic range for capturing both bright and dark areas in the same scene.

Vertical Pixel 2856

High vertical pixel count for detailed, high-resolution images.

Body Length/Diameter 43.5 mm

Compact body size for space-saving installations.

Optical Format (inch) 4/3

Standard optical format for compatibility with a wide range of lenses.

Termination Type SOLDER

Solder termination for secure and reliable connections.

Frame Rate 14 fps

Decent frame rate for smooth video recording or live streaming.

Array Type INTERLINE

Interline array type for reduced vertical smear and enhanced image quality.

Mounting Feature THROUGH HOLE MOUNT

Through hole mounting feature for easy and secure installation in devices.

Technical Specifications

Image Sensors KAE-08152-ABA-JP-FA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAVE OUTPUT SENSTIVITY OF 44 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

41 inch

Body Height:

5.62 mm

Body Length/Diameter:

43.5 mm

Dynamic Range:

86 dB

Frame Rate:

14 fps

Horizontal Pixel:

2856

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

4/3

Output Type:

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.3 V

Minimum Supply Voltage:

14.7 V

Termination Type:

SOLDER

Vertical Pixel:

2856

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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