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KAE-01093-FBB-SD-FA

Onsemi

KAE-01093-FBB-SD-FA by Onsemi

KAE-01093-FBB-SD-FA by Onsemi is an image sensor with 1024x1024 pixels, 9x9 um pixel size, and 95 dB dynamic range. It operates b/w -50 to 60 °C and has a digital voltage output. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,900 parts In-Stock

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1,900

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Digiode

USA . 1,451 parts In-Stock

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1,451

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Distributors (Availability)

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TANS Electronics

Latvia . 4,786 parts In-Stock

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4,786

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Corphita

USA . 1,890 parts In-Stock

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1,890

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Problanco Electronics

Mexico . 1,593 parts In-Stock

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UHIMA Technologies

Türkiye . 679 parts In-Stock

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679

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SupplyDigital Components

Austria . 665 parts In-Stock

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665

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Kulean Microsystems

USA . 561 parts In-Stock

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561

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Corohmni

South Africa . 192 parts In-Stock

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Overview

Unlock the power of high-quality imaging with the KAE-01093-FBB-SD-FA by Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-notch image sensors that redefine clarity and precision. Ideal for a wide range of applications, this image sensor offers unmatched value and benefits to customers looking to enhance their imaging solutions. Elevate your projects with the superior performance and reliability of the KAE-01093-FBB-SD-FA by Onsemi.

Feature Benefit Bullets

Pixel Size (um): 9X9

The small pixel size allows for higher resolution imagery, making this image sensor suitable for capturing detailed photos or videos.

Maximum Supply Voltage: 6 V

Higher supply voltage allows for better performance and signal processing capabilities, making this image sensor ideal for high-quality imaging applications.

Body Width: 30 inch

The compact body width makes this image sensor suitable for integration into various devices and systems without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

Being a CCD image sensor type ensures high-quality image capture with low noise, making it a reliable choice for imaging applications.

Body Height: 5.49 mm

The low body height makes this image sensor compact and suitable for applications where space is limited.

Package Shape or Style: RECTANGULAR

The rectangular shape of the package makes it easy to integrate and mount the image sensor securely in various devices.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement ensures efficient power usage and compatibility with a wide range of applications.

Maximum Operating Temperature: 60 °C

The high maximum operating temperature allows this image sensor to be used in demanding environments without compromising performance.

Horizontal Pixel: 1024

A high number of horizontal pixels provide detailed image resolution, making this image sensor suitable for applications requiring high-quality imaging.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and integration with digital systems, making this image sensor easy to work with.

Minimum Operating Temperature: -50 °C

The low minimum operating temperature ensures that this image sensor can perform reliably even in extremely cold conditions.

Dynamic Range: 95 dB

A high dynamic range allows this image sensor to capture both bright and dark areas in an image accurately, ensuring detailed and high-quality imaging.

Vertical Pixel: 1024

A high number of vertical pixels further enhance image resolution, making this image sensor suitable for capturing detailed and crisp images.

Body Length/Diameter: 33 mm

The moderate body length/diameter provides a balance between compact size and functionality, making this image sensor versatile in various applications.

Data Rate: 40 Mbps

High data rate capabilities enable fast and efficient image capture and transmission, making this image sensor suitable for real-time imaging applications.

Termination Type: SOLDER

Solder termination ensures secure and reliable connections, making this image sensor durable and suitable for long-term use.

Frame Rate: 91 fps

A high frame rate allows for smooth and detailed video recording, making this image sensor ideal for applications requiring fast motion capture.

Array Type: INTERLINE

Interline array type provides efficient light sensitivity and fast readout speeds, making this image sensor suitable for dynamic imaging applications.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature ensures secure and stable installation, making this image sensor reliable in various operating conditions.

Technical Specifications

Image Sensors KAE-01093-FBB-SD-FA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE SUPPLY VOLTAGE FROM 14.7 TO 15.3V, ELECTRONIC SHUTTER, GLOBAL SHUTTER

Array Type:

INTERLINE

Body Width:

30 inch

Body Height:

5.49 mm

Body Length/Diameter:

33 mm

Data Rate:

40 Mbps

Dynamic Range:

95 dB

Frame Rate:

91 fps

Horizontal Pixel:

1024

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1

Output Type:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Termination Type:

SOLDER

Vertical Pixel:

1024

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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