Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MT9V131C12STC-DR by Onsemi is a 640x480 CMOS image sensor with 5.60um pixel size and 27 MHz master clock. Ideal for digital cameras, it offers a dynamic range of 60 dB and operates at temperatures ranging from -20 to 70 °C.
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UHIMA Technologies
Larger pixel size allows for more light to be captured, resulting in better image quality and low light performance.
Higher maximum supply voltage provides flexibility in power supply options and ensures stable operation.
High master clock frequency enables fast data processing and high frame rates for smooth image capture.
Compact body width allows for easy integration into various devices and systems.
CMOS image sensor technology offers high image quality, low power consumption, and a wide range of features for versatile applications.
Square package shape provides a symmetrical and compact design for efficient board layout and space utilization.
Lower minimum supply voltage helps in reducing power consumption and extending battery life.
High maximum operating temperature ensures reliable performance even in demanding environmental conditions.
High horizontal pixel count allows for detailed image capture and sharp resolution.
Wide output range provides flexibility in signal processing and compatibility with various interface standards.
Digital voltage output simplifies signal processing and communication with external devices.
Low minimum operating temperature ensures usability in cold environments without compromising performance.
Low maximum operating current helps in reducing power consumption and heat generation.
Ceramic housing provides durability, thermal resistance, and protection against environmental factors.
High dynamic range enables capturing a wide range of light intensities without losing detail in dark or bright areas.
Vertical pixel count complements the horizontal resolution for capturing high-quality images with accurate proportions.
Compact body length/diameter ensures space-efficient integration and mechanical compatibility with various mounting options.
Optical format specification provides compatibility with industry-standard lens systems for easy customization and adaptation.
Solder termination provides a reliable and robust electrical connection for long-term performance and durability.
2-wire interface simplifies connectivity and communication with external devices and controllers for seamless integration.
High frame rate ensures smooth and real-time image capture for dynamic scenes and fast-moving objects.
Frame array type organizes pixels in a structured grid for efficient data processing and image rendering.
Surface mounting feature offers easy and secure installation on PCBs or other surfaces for reliable and compact device design.
Image Sensors MT9V131C12STC-DR attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
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Maximum Operating Temperature:
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Optical Format (inch):
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PCN Obsolescence/ EOL - Mult Dev EOL 09/Oct/2020
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
BAV99
Weitron Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Output Current: .215 A; JESD-609 Code: e0; Maximum Forward Voltage (VF): .715 V;
2N7002
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
SS14
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358M
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
BSS138
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
1N4148
Nexperia
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS123LT1G
Onsemi
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
MBRS3200T3G
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
Rugao Dachang Electronic
OPA2277UA
Texas Instruments
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
LL4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
American Power Devices
LAN8720A-CP-TR
Microchip Technology
LAN8720A-CP-TR by Microchip: Ethernet transceiver with 100 Mbps data rate, operates at 3.3V, and consumes 54mA max supply current. Ideal for network interfaces in commercial applications due to its small size (4x4mm) and low power consumption.
Microsemi
AR0132AT6C00XPD20
Onsemi's AR0132AT6C00XPD20 is a 1/3-inch CMOS image sensor with 1280x960 resolution. It operates at -40 to 105 °C, with a pixel size of 3.75um and a max supply voltage of 1.95V. Ideal for applications requiring high dynamic range and fast frame rates up to 60fps.
TC237B
TC237B by Texas Instruments is an image sensor with 7.4x7.4 um pixel size and 680 horizontal pixels. It operates b/w -10 to 45 °C, with a supply voltage range of 21-23 V. Ideal for applications requiring high sensitivity and a dynamic range of 58 dB in a compact rectangular package.
KAI-02050-ABA-FD-BA
Onsemi's KAI-02050-ABA-FD-BA is a 5.5x5.5 um CCD image sensor with 1684H x 1264V pixels, offering a dynamic range of 64 dB. It operates b/w -50 to 70 °C and has a supply voltage range of 14.5V to 15.5V, making it suitable for industrial imaging applications requiring high-resolution and low-light performance in a compact SQUARE package.
KAI-2093-ABA-AA-B2
IMAGE SENSOR,CCD;
AR1630CSSC34SMD10
Onsemi's AR1630CSSC34SMD10 is a 1/3.2 inch CMOS image sensor with 4632x3492 pixels, offering digital output at 30 fps. Ideal for applications requiring high-resolution imaging in a compact form factor, such as surveillance cameras and industrial machine vision systems.
KAI-0330D
The Onsemi KAI-0330D is a 9x9 um CCD image sensor with 648 (H) x 484 (V) pixels. It operates b/w -20 to 40 °C, with output range of 12-15.5V and dynamic range of 58 dB. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.
KAI-01150-CBA-JD-AE
The Onsemi KAI-01150-CBA-JD-AE is a 5.5x5.5 um CCD image sensor with 1280H x 720V pixels, offering a dynamic range of 64 dB. It operates b/w -50 to 70 °C and requires a supply voltage of 14.5-15.5 V. Ideal for applications requiring digital voltage output in an optical format of 1/2 inch, such as industrial imaging systems.
KAI-02150-QBA-FD-AE
KAI-02150-QBA-FD-AE by Onsemi is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 64dB dynamic range. It operates b/w -50 to 70 °C, with supply voltage ranging from 14.5V to 15.5V. Ideal for applications requiring high-resolution imaging in industrial cameras and machine vision systems.
KAI-16000-AAA-JR-B1
KAI-16000-AAA-JR-B1 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 4872 horizontal pixels, and 3248 vertical pixels. It has a dynamic range of 65 dB and outputs analog voltage. Ideal for applications requiring high-resolution imaging with precise color reproduction.
AMIS-710200
Image Sensors; Horizontal Pixel: 1728; Minimum Operating Temperature: 0 Cel; Vertical Pixel: 1; Maximum Operating Temperature: 50 Cel; Power Supplies (V): 5;
KAI-16050-CXA-JD-B1
The Onsemi KAI-16050-CXA-JD-B1 is a 5.5x5.5 um CCD image sensor with 4896 (H) x 3264 (V) pixels, offering a dynamic range of 64 dB. It operates at temperatures ranging from -50 to 70 °C and requires a power supply of 15V. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-0340-CBA-CB-AE-D
MT9V022IA7ATM-TR
MT9V022IA7ATM-TR by Onsemi is a 1/3 inch CMOS image sensor with 752x480 pixels, offering a max supply voltage of 3.6 V and operating temperature range from -40 to 85 °C. It features a digital current output type, dynamic range of 54.4 dB, and supports a frame rate of up to 60 fps, making it ideal for applications requiring high-quality imaging in various lighting conditions.
KLI-8023-RAA-ED-AA
KLI-8023-RAA-ED-AA by Onsemi is an Image Sensor with 9x9 um pixel size, 8002 horizontal pixels, and 87 dB dynamic range. Ideal for applications requiring a CCD image sensor with a spectral response of 350-850 nm, operating at temperatures from 0 to 70 °C.
MT9M034I12STC-DPBR
MT9M034I12STC-DPBR by Onsemi is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 115dB dynamic range. Ideal for applications requiring high-quality digital imaging at up to 60fps frame rate in a compact square package.
MT9P031I12STC
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.60-2.30V; Body Height: 1.25 mm;
KAI-02150-AAA-JP-AE
Onsemi's KAI-02150-AAA-JP-AE is a 5.5X5.5 um CCD image sensor with 1920x1080 resolution, 64 dB dynamic range, and 2/3 inch optical format. It operates b/w -50 to 70 °C, with supply voltage ranging from 14.5V to 15.5V. Ideal for high-quality imaging applications requiring precise color reproduction and low-light performance.
KAI-04050-ABA-JD-AE
KAI-04050-ABA-JD-AE by Onsemi is a 5.5x5.5 um CCD image sensor with 2336 (H) x 1752 (V) pixels, offering a dynamic range of 64 dB. It features an interline array type and solder termination, suitable for applications in industrial imaging systems and machine vision cameras.
NOIP1SP0480A-STI
NOIP1SP0480A-STI by Onsemi is an image sensor with 4.80x4.80 um pixel size, 68 MHz master clock, and 808 (H) x 608 (V) resolution. It operates b/w -40 to 85 °C and has a dynamic range of 59 dB. Ideal for applications requiring high-speed imaging in compact devices.
KAI-1020-FBA-JD-BA
KAI-1020-FBA-JD-BA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1000 horizontal and vertical pixels, and a dynamic range of 58 dB. It operates at a supply voltage range of 14.5V to 15.5V and has a data rate of 40 Mbps. Ideal for applications requiring high-quality imaging in a compact form factor such as surveillance cameras or industrial machine vision systems.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MT9V024IA7XTM-DP2
MT9V024IA7XTM-DP2 by Onsemi is a 1/3" CMOS image sensor with 6x6 um pixel size, offering 60 fps frame rate. Ideal for surface mount applications in various imaging devices due to its compact 9mm square package design.
MT9V024IA7XTM-DP1
MT9V024IA7XTM-DP1 by Onsemi is a 1/3-inch CMOS image sensor with 6x6 um pixel size. It offers 60 fps frame rate, solder termination, and surface mounting feature. Ideal for applications requiring high-quality imaging in compact devices like smartphones and security cameras.
MT9V024IA7XTM-DR
MT9V024IA7XTM-DR by Onsemi is a 1/3-inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100 dB. Operating at -40 to 105°C, it has a frame rate of 60 fps and digital voltage output interface. Ideal for applications requiring high-quality imaging in varying temperature conditions.
MT9V024IA7XTM-DP
MT9V024IA7XTM-DP by Onsemi features a 6x6 um pixel size, 27 MHz master clock, and 100 dB dynamic range. Ideal for image sensing applications in devices requiring high-resolution imaging capabilities.
MT9V034C12STM-DP1
The Onsemi MT9V034C12STM-DP1 is a 1/3 inch CMOS image sensor with a pixel size of 6X6 um. It operates at a max supply voltage of 3.6 V and has a master clock frequency of 27 MHz. This sensor is commonly used in applications requiring high-resolution imaging at a frame rate of 60 fps.
MT9V034C12STM-DP
Onsemi's MT9V034C12STM-DP is a 1/3 inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100 dB. Operating at 60 fps with a pixel size of 6x6 um, it has an output interface type of 2-WIRE INTERFACE. Ideal for applications requiring high-resolution imaging and low-light sensitivity in compact devices.
MT9V024IA7XTM-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Optical Format (inch): 1/3; Terminal Finish: TIN SILVER COPPER; Additional Features: AEC-Q100; GLOBAL SHUTTER; Array Type: FRAME;
MT9V024IA7XTM-TR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-3V; Maximum Operating Temperature: 105 Cel;
MT9V024IA7XTM-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-3V; Master Clock: 27 MHz;
MT9V024IA7XTC-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-3V; Additional Features: GLOBAL SHUTTER;
MT9V034C12STM-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: -11-11mA; Body Width: 11.43 inch;
MT9V034C12STM-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: -11-11mA; Optical Format (inch): 1/3;
MT9V034C12STM-DR
Onsemi's MT9V034C12STM-DR is a 1/3-inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100dB. Operating at 60fps with a pixel size of 6x6um, it has an output interface type of 2-WIRE INTERFACE. Ideal for applications requiring high-resolution imaging and fast frame rates in compact designs.
MT9V024IA7XTM
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Dynamic Range: 100 dB; Vertical Pixel: 480; Minimum Operating Temperature: -40 Cel;
MT9V128IA3XTC-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Termination Type: SOLDER; Dynamic Range: 74.8 dB;
MT9V128IA3XTC-DP1
IMAGE SENSOR,CMOS; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);
MT9V128IA3XTC-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Minimum Operating Temperature: -40 Cel; Body Width: 9 inch;
MT9V128IA3XTC-DR1
MT9V128IA3XTC-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; JESD-609 Code: e1; Termination Type: SOLDER;
Supply Digital Components
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