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KAI-4021-ABA-CR-BA

Onsemi

KAI-4021-ABA-CR-BA by Onsemi

KAI-4021-ABA-CR-BA by Onsemi is a 2048x2048 CCD image sensor with 7.4um pixel size and 60dB dynamic range. It operates b/w -50 °C to 70°C, making it suitable for industrial imaging applications requiring high-resolution and temperature versatility. The rectangular package style with through-hole mounting feature enhances ease of integration into various systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,667 parts In-Stock

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1,667

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Digiode

USA . 1,316 parts In-Stock

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1,316

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Distributors (Availability)

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TANS Electronics

Latvia . 8,347 parts In-Stock

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8,347

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SupplyDigital Components

Austria . 7,668 parts In-Stock

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7,668

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Problanco Electronics

Mexico . 5,621 parts In-Stock

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5,621

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Kulean Microsystems

USA . 5,554 parts In-Stock

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5,554

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Corphita

USA . 1,031 parts In-Stock

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Corohmni

South Africa . 156 parts In-Stock

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UHIMA Technologies

Türkiye . 80 parts In-Stock

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Overview

Experience unparalleled quality and performance with the KAI-4021-ABA-CR-BA by Onsemi. As a leading manufacturer of image sensors, Onsemi delivers cutting-edge technology that exceeds industry standards. With applications in various fields such as medical imaging, industrial inspection, and security systems, this product offers unmatched value, exceptional benefits, and superior advantages to customers. Don't settle for anything less than excellence – choose Onsemi for all your imaging sensor needs.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

The small pixel size allows for high-resolution image capture, making this product suitable for applications requiring detailed imaging.

Body Width: 25.4 inch

The compact size of the body makes it easy to integrate into various devices without taking up a lot of space.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD image sensors are known for their high-quality image output, making this product a good choice for applications where image accuracy is crucial.

Body Height: 4.95 mm

The low profile of the body allows for a sleek design and easy integration into slim devices.

Package Shape or Style: RECTANGULAR

The rectangular shape of the package allows for efficient placement and alignment within devices, maximizing space utilization.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, increasing its reliability and durability.

Horizontal Pixel: 2048

The high number of horizontal pixels allows for detailed image capture, making this product suitable for applications requiring high-resolution images.

Minimum Operating Temperature: -50 °C

The low minimum operating temperature allows for reliable operation even in cold environments, expanding the range of potential applications for this product.

Housing: CERAMIC

The ceramic housing provides durability and thermal stability, ensuring optimal performance in various operating conditions.

Dynamic Range: 60 dB

A wide dynamic range allows for accurate image capture in both bright and dark conditions, making this product suitable for diverse imaging requirements.

Vertical Pixel: 2048

The high number of vertical pixels allows for detailed image capture in both horizontal and vertical directions, enhancing overall image quality.

Body Length/Diameter: 35.56 mm

The compact body length or diameter makes this product easy to integrate into devices with limited space, without compromising on image quality.

Data Rate: 40 Mbps

The high data rate enables fast and efficient data transfer, ensuring real-time image processing and high-speed imaging applications.

Termination Type: SOLDER

Solder termination provides a reliable and secure connection, contributing to the overall durability and longevity of the product.

Array Type: INTERLINE

Interline array type allows for efficient image capture with reduced blooming effects, ensuring high-quality images even in challenging lighting conditions.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting offers a secure and stable mounting option, ensuring the sensor remains in place during operation and handling.

Technical Specifications

Image Sensors KAI-4021-ABA-CR-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 31 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

25.4 inch

Body Height:

4.95 mm

Body Length/Diameter:

35.56 mm

Data Rate:

40 Mbps

Dynamic Range:

60 dB

Horizontal Pixel:

2048

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

2048

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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