Loading...

KAI-4011-ABA-CR-BA

Onsemi

KAI-4011-ABA-CR-BA by Onsemi

KAI-4011-ABA-CR-BA by Onsemi is a CCD image sensor with 2048x2048 pixels, 7.4um pixel size, and 60dB dynamic range. It operates b/w -50 °C to 70°C and has a data rate of 40 Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 931 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

931

-

-

-

-

Vyrian

USA . 569 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

569

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 2,916 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,916

-

-

-

-

SupplyDigital Components

Austria . 2,233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,233

-

-

-

-

Kulean Microsystems

USA . 1,783 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,783

-

-

-

-

Corphita

USA . 1,738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,738

-

-

-

-

Problanco Electronics

Mexico . 1,109 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,109

-

-

-

-

UHIMA Technologies

Türkiye . 826 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

826

-

-

-

-

Corohmni

South Africa . 166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

166

-

-

-

-

Overview

Elevate your imaging capabilities with the KAI-4011-ABA-CR-BA by Onsemi, a top-of-the-line image sensor designed to deliver unparalleled quality and precision. Manufactured by industry leaders Onsemi, this sensor boasts cutting-edge technology that ensures superior performance in a variety of applications. From industrial automation to medical imaging, this sensor provides unmatched value, offering customers enhanced clarity, accuracy, and reliability. Upgrade your imaging systems today with the KAI-4011-ABA-CR-BA and experience the difference for yourself.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Smaller pixel size results in higher resolution images and better quality.

Body Width: 25.4 inch

Compact size makes it suitable for various imaging applications.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD technology provides high-quality imaging with low noise.

Body Height: 4.95 mm

Low profile design for easy integration into different systems.

Package Shape or Style: RECTANGULAR

Standard shape for easy handling and mounting.

Maximum Operating Temperature: 70 °C

High temperature tolerance for reliable performance in various environments.

Horizontal Pixel: 2048

High pixel count for detailed and clear image capture.

Minimum Operating Temperature: -50 °C

Wide temperature range allows for use in extreme conditions.

Housing: CERAMIC

Durable ceramic housing for long-term reliability.

Dynamic Range: 60 dB

Wide dynamic range for capturing both dark and bright areas in an image.

Vertical Pixel: 2048

Equal vertical and horizontal pixels for high-quality square images.

Body Length/Diameter: 35.56 mm

Balanced dimensions for easy installation and integration.

Data Rate: 40 Mbps

High data rate for fast and efficient image data transfer.

Termination Type: SOLDER

Solder termination for secure connections in a variety of setups.

Array Type: INTERLINE

Interline array for improved image quality and faster readout.

Mounting Feature: THROUGH HOLE MOUNT

Easy through hole mounting for secure installation in different systems.

Technical Specifications

Image Sensors KAI-4011-ABA-CR-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 16 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

25.4 inch

Body Height:

4.95 mm

Body Length/Diameter:

35.56 mm

Data Rate:

40 Mbps

Dynamic Range:

60 dB

Horizontal Pixel:

2048

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

2048

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20