Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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KAI-4011-ABA-CR-BA by Onsemi is a CCD image sensor with 2048x2048 pixels, 7.4um pixel size, and 60dB dynamic range. It operates b/w -50 °C to 70°C and has a data rate of 40 Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
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Corohmni
Smaller pixel size results in higher resolution images and better quality.
Compact size makes it suitable for various imaging applications.
CCD technology provides high-quality imaging with low noise.
Low profile design for easy integration into different systems.
Standard shape for easy handling and mounting.
High temperature tolerance for reliable performance in various environments.
High pixel count for detailed and clear image capture.
Wide temperature range allows for use in extreme conditions.
Durable ceramic housing for long-term reliability.
Wide dynamic range for capturing both dark and bright areas in an image.
Equal vertical and horizontal pixels for high-quality square images.
Balanced dimensions for easy installation and integration.
High data rate for fast and efficient image data transfer.
Solder termination for secure connections in a variety of setups.
Interline array for improved image quality and faster readout.
Easy through hole mounting for secure installation in different systems.
Image Sensors KAI-4011-ABA-CR-BA attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
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Data Rate:
Dynamic Range:
Horizontal Pixel:
Housing:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
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Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
2N2222A
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
MBRS1100T3G
Onsemi
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
M39029/58-360
Conesys
CONNECTOR ACCESSORY; MIL Conformity: YES; Mating Contacts: M39029/57-354; Terminal Type: CRIMP; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT;
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
EU2B-YS2J03C
Idec
ROTARY SWITCH;
SMBJ18CA
Bytesonic Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDD5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;
LM358N
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
MS3V-T1R32.768KHZ+/-20PPM12.5PF
Golledge Electronics
MS3V-T1R32.768KHZ+/-20PPM12.5PF by Golledge Electronics is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 12.5 pF load capacitance. It is ideal for applications requiring precise timing in temperature-sensitive environments due to its -40 to 85 °C operating range.
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Vishay Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Qualification: Not Qualified;
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
1N4148WS
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CMX
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Infineon Technologies
Motorola
1N4148WT
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Positronic Industries
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Body or Shell Style: RECEPTACLE;
TX253SPD-30
Texas Instruments
TX253SPD-30 by Texas Instruments is an image sensor with 7.4x7.4um pixel size, 680H x 500V resolution, and operates at -10 to 45°C. It requires a 12V power supply and features THROUGH HOLE MOUNTing. Ideal for applications requiring high-resolution imaging in varying temperature environments.
AR0135AT2M25XUEA0-TPBR
The Onsemi AR0135AT2M25XUEA0-TPBR is a 1/3 inch CMOS image sensor with 3.75x3.75 um pixel size and 54 fps frame rate. It is ideal for applications requiring high-quality imaging in a compact form factor, such as surveillance cameras and industrial machine vision systems.
MT9M021IA3XTM-DPBR1
MT9M021IA3XTM-DPBR1 by Onsemi is a 1/3" CMOS image sensor with 1280x960 resolution. It operates at 50 MHz, offers 64 dB dynamic range, and has a sensitivity of 5.3 V/lx.s. Ideal for applications requiring high-quality digital imaging at up to 60 fps.
KAI-08050-AAA-JP-BA
Onsemi's KAI-08050-AAA-JP-BA is a 5.5x5.5um CCD image sensor with 3296H x 2472V pixels, offering a dynamic range of 64dB. Operating b/w -50 °C to 70°C, it requires a 15V power supply and comes in a rectangular package. Ideal for applications requiring high-quality imaging in various environmental conditions.
AR0522SRSC09SURA0-DP
Onsemi's AR0522SRSC09SURA0-DP is a 12x1.62mm CMOS image sensor with 2592x1944 resolution, 1/2.5" optical format, and 60fps frame rate. It offers digital output via a 2-wire interface and is housed in a plastic package for surface mount applications.
KAF-16200-ABA-CD-AE
The Onsemi KAF-16200-ABA-CD-AE is a CCD image sensor with 6x6 um pixel size, offering 4500 horizontal and 3600 vertical pixels. With a dynamic range of 69.3 dB, it operates b/w 0 to 60 °C and requires a min supply voltage of 14.5 V. This rectangular sensor housed in ceramic is ideal for high-resolution imaging applications requiring precise color reproduction and low light sensitivity.
AR0330CS1C12SPKA0-CP
The Onsemi AR0330CS1C12SPKA0-CP is a 1/3 inch CMOS image sensor with 2304x1296 pixels. It operates at 27 MHz with a dynamic range of 69.5 dB and outputs digital voltage from 0.40-1.40V. Ideal for applications requiring high-resolution imaging and fast frame rates up to 60 fps, it features a compact square package suitable for surface mounting.
OV02680-H47A
Omnivision Technologies
OV02680-H47A by Omnivision Technologies is an image sensor with 1.75x1.75 um pixel size, ideal for applications requiring high-resolution imaging. Operating at temperatures from -30 to 85 °C, it offers a resolution of 1616x1216 pixels and runs on a power supply of 1.58V.
KAI-0340DM
Image Sensors;
TCD1201D
Toshiba
Toshiba's TCD1201D is an 8V CCD image sensor with 2048 horizontal pixels. Operating b/w -25°C to 60°C, it features a through-hole mount. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
NOIS1SC1000A-HHC
NOIS1SC1000A-HHC by Onsemi is a 1024x1024 CMOS image sensor with 15x15 um pixel size. It outputs analog voltage at 11 fps with a max operating current of 60.8 mA. Housed in a ceramic package, it is ideal for surface mount applications in frame array setups.
KAF-09001-ABA-DP-AE
The Onsemi KAF-09001-ABA-DP-AE is a CCD image sensor with 3024x3024 pixels, 12x12 um pixel size, and 84 dB dynamic range. It operates b/w -50 to 60 °C, with a supply voltage range of 14.8V to 17V. Ideal for high-resolution imaging applications in industries like surveillance, astronomy, and medical imaging.
AR0135AT2M00XUEA0-DPBR
The Onsemi AR0135AT2M00XUEA0-DPBR image sensor features 3.75um pixel size, 50MHz master clock, and 1/3 inch optical format. Ideal for applications requiring a digital voltage output interface, with a frame rate of 54fps and a dynamic range of 67.7dB.
MT9V127IA3XTC-DP
MT9V127IA3XTC-DP by Onsemi features 5.6x5.6um pixel size, 27 MHz master clock, and 1/4 inch optical format. Ideal for image sensing applications with a frame rate of 60 fps, this CMOS sensor offers a dynamic range of 74.8 dB and operates b/w -40 to 105 °C temperature range.
TCD1304DG(8Z,AW)
Toshiba's TCD1304DG(8Z,AW) is an 8X200 um CCD image sensor with a 2 MHz master clock. Operating at 3-5.5V, it offers a spectral response of 400-1200nm and sensitivity of 160 V/lx.s. Ideal for applications requiring high-resolution imaging in industrial automation and scientific instruments.
AR0330CM1C00SHAA0-DR
The Onsemi AR0330CM1C00SHAA0-DR is a 1/3-inch CMOS image sensor with 2304x1296 pixels. It operates at a max supply voltage of 1.9V and offers a dynamic range of 69.5 dB. Ideal for applications requiring high-resolution imaging, such as surveillance cameras and industrial machine vision systems.
KAI-16070-QXA-JD-B1
Onsemi's KAI-16070-QXA-JD-B1 image sensor features 7.4X7.4 um pixel size, 40 MHz master clock, and 70.5 dB dynamic range. Ideal for applications requiring high-resolution imaging with a max supply voltage of 15.5 V and operating temperature range from -50 to 70 °C.
MT9V137C12STC-DP
Onsemi's MT9V137C12STC-DP is a 5.6x5.6 um CMOS image sensor with 680H x 512V pixels, offering a dynamic range of 74.6 dB and sensitivity of 11.9 V/lx.s. It operates at temperatures from -30 to 70 °C, with a max supply voltage of 1.9 V and frame rate of 30 fps, suitable for surface mount applications in various imaging systems.
TC241-10
TC241-10 by Texas Instruments is an image sensor with 754x244 pixels, pixel size of 11.5X27 um, and operates at temperatures from -10 to 45 °C. It requires a power supply of 12V and features THROUGH HOLE MOUNTing. Ideal for applications requiring high-resolution imaging in various environments.
AR0238CSSC12SHRA0-DR
Onsemi's AR0238CSSC12SHRA0-DR is a 3x3 um CMOS image sensor with 1928H x 1088V pixels, offering a dynamic range of 96 dB. Operating at -30 to 85 °C, it has a max supply voltage of 1.95 V and supports a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in compact devices.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KAI-47051-AXA-JD-B1
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -50 Cel; Additional Features: IT HAS A SENSITIVITY OF 38 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER; Minimum Supply Voltage: 14.5 V;
KAI-4011-AAA-CR-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 35.56 mm; Termination Type: SOLDER; Dynamic Range: 60 dB;
KAI-4021-AAA-CR-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 2048; Termination Type: SOLDER; Minimum Operating Temperature: -50 Cel;
KAI-4011-CBA-CD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 35.56 mm; Housing: CERAMIC; Body Width: 25.4 inch;
KAI-4020M
KAI-4011-ABA-CR-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -50 Cel; Body Width: 25.4 inch; Additional Features: IT HAS A SENSITIVITY OF 16 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER;
KAI-4021-AAA-CR-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Data Rate: 40 Mbps; Maximum Operating Temperature: 70 Cel; Dynamic Range: 60 dB;
KAI-4010CM
KAI-4011-AAA-CR-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Additional Features: IT HAS A SENSITIVITY OF 16 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER; Vertical Pixel: 2048; Body Length/Diameter: 35.56 mm;
KAI-4011-CBA-CD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 60 dB; Horizontal Pixel: 2048; Housing: CERAMIC;
KAI-4011CM
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Body Height: 4.95 mm; Pixel Size (um): 7.4X7.4;
KAI-4020CM
KAI-4011-ABA-CD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Height: 4.95 mm; Pixel Size (um): 7.4X7.4; Body Width: 25.4 inch;
KAI-4021
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 31 UV/ELECTRON, ELECTRONIC SHUTTER; Array Type: INTERLINE;
KAI-4011
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Data Rate: 40 Mbps; Body Length/Diameter: 35.56 mm;
KAI-4011M
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Dynamic Range: 60 dB; Termination Type: SOLDER;
KAI-4010
KAI-4010M
KAI-4011-ABA-CD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Housing: CERAMIC; Vertical Pixel: 2048;
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Vertical Pixel: 2048; Pixel Size (um): 7.4X7.4;
Supply Digital Components
$106.00
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12,000 In-Stock
Total price ≈ $80,197.29
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