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AR0330CS1C12SPKA0-CP2

Onsemi

AR0330CS1C12SPKA0-CP2 by Onsemi

The Onsemi AR0330CS1C12SPKA0-CP2 image sensor features 2304x1536 pixels, 27 MHz master clock, and 69.5 dB dynamic range. Ideal for applications requiring high-resolution imaging with a frame rate of 60 fps in a compact rectangular package.

Median Price

$12.965

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 5 parts In-Stock

1+ parts

$10.220

100+ parts

$7.890

1k+ parts

$6.710

10k+ parts

-

5

$10.220

$7.890

$6.710

-

Rochester

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$15.710

1k+ parts

$14.060

10k+ parts

$13.230

10

-

$15.710

$14.060

$13.230

Farnell

UK . 5 parts In-Stock

1+ parts

-

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-

1k+ parts

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5

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Distributors (In-Stock)

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Digiode

USA . 279 parts In-Stock

1+ parts

$16.625

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279

$16.625

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Vyrian

USA . 5,409 parts In-Stock

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5,409

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VNN

France . 3,102 parts In-Stock

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3,102

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 728 parts In-Stock

1+ parts

$2.376

100+ parts

-

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728

$2.376

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Ampacity Inc.

Singapore . 7 parts In-Stock

1+ parts

$14.880

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-

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-

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7

$14.880

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Corphita

USA . 1,404 parts In-Stock

1+ parts

$15.750

100+ parts

-

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1,404

$15.750

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Corohmni

South Africa . 235 parts In-Stock

1+ parts

$17.500

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235

$17.500

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AZTECH Wire

Italy . 451 parts In-Stock

1+ parts

$17.947

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451

$17.947

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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Continental Prestige Electronics

USA . 6,898 parts In-Stock

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6,898

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Argo Parts USA

USA . 5,273 parts In-Stock

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5,273

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Problanco Electronics

Mexico . 3,281 parts In-Stock

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3,281

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SupplyDigital Components

Austria . 2,930 parts In-Stock

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2,930

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TANS Electronics

Latvia . 2,346 parts In-Stock

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2,346

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Kulean Microsystems

USA . 2,060 parts In-Stock

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2,060

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 424 parts In-Stock

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424

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Overview

Enhance your visual experiences with the AR0330CS1C12SPKA0-CP2 Image Sensor by Onsemi. Known for their top-quality products, Onsemi delivers cutting-edge technology that meets the highest industry standards. This sensor is perfect for applications such as surveillance cameras, automotive vision systems, and industrial imaging. With its superior performance and reliability, this image sensor offers customers unmatched value, delivering clear, crisp images with exceptional detail. Upgrade your imaging capabilities with the AR0330CS1C12SPKA0-CP2 and see the difference for yourself!

Feature Benefit Bullets

Pixel Size (um): 2.2X2.2

The small pixel size allows for high resolution and detailed imaging.

Maximum Supply Voltage: 1.9 V

Provides a good operating range without risking damage to the sensor.

Master Clock: 27 MHz

High master clock frequency enables fast data readout and processing.

Body Width: 6.278 inch

Compact body width makes the sensor suitable for integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors offer low power consumption and high sensitivity, making them ideal for imaging applications.

Body Height: 0.7 mm

Low body height allows for slim and compact designs when incorporating the sensor.

Package Shape or Style: RECTANGULAR

Rectangular package shape is easy to mount and integrate into electronic systems.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 70 °C

Wide operating temperature range enhances the versatility of the sensor for various environmental conditions.

Horizontal Pixel: 2304

High horizontal pixel count provides detailed and sharp images.

Output Range: 0.40-1.40V

Wide output range allows for flexibility in signal processing and compatibility with different systems.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies interfacing with other digital systems.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature enables the sensor to function reliably in cold environments.

Maximum Operating Current: 75 mA

Moderate operating current consumption helps in energy efficiency.

Dynamic Range: 69.5 dB

High dynamic range allows capturing a wide range of light intensities without losing details.

Vertical Pixel: 1536

Vertical pixel count contributes to the overall resolution and quality of images.

Body Length/Diameter: 6.648 mm

Optimal body length/diameter ratio for easy integration and space-saving designs.

Spectral Response (nm): 350-1150

Wide spectral response range enables capturing images across various wavelengths of light.

Optical Format (inch): 1/3

Common optical format for easy compatibility with standard lenses and optical systems.

Termination Type: SOLDER

Solder termination provides a reliable connection for long-term usage.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and communication with external devices.

Frame Rate: 60 fps

High frame rate enables capturing fast-moving scenes with smooth motion.

Array Type: FRAME

Frame array type offers flexibility in capturing still images or videos.

Sensitivity (V/lx.s): 2 V/lx.s

High sensitivity allows the sensor to perform well in low light conditions.

Mounting Feature: SURFACE MOUNT

Surface mount feature simplifies the installation process and allows for easy PCB integration.

Technical Specifications

Image Sensors AR0330CS1C12SPKA0-CP2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, GLOBAL RESET RELEASE, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.76-2.9V

Array Type:

FRAME

Body Width:

6.278 inch

Body Height:

.7 mm

Body Length/Diameter:

6.648 mm

Dynamic Range:

69.5 dB

Frame Rate:

60 fps

Horizontal Pixel:

2304

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

75 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

2.2X2.2

Sensitivity (V/lx.s):

2 V/lx.s

Sensors or Transducers Type:

Spectral Response (nm):

350-1150

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

1536

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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