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TC217-40

Texas Instruments

TC217-40 by Texas Instruments

TC217-40 by Texas Instruments is an image sensor with 11.7X9 um pixel size, 2/3 inch optical format, and 73 dB dynamic range. It operates b/w -30 to 85 °C and outputs analog voltage in the range of 0.32-0.41V. Ideal for applications requiring high sensitivity and precise imaging such as surveillance cameras or industrial machine vision systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,820 parts In-Stock

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4,820

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Digiode

USA . 2,722 parts In-Stock

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2,722

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 526 parts In-Stock

1+ parts

$2.842

100+ parts

-

1k+ parts

$3.331

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526

$2.842

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$3.331

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DigiPath Technology Company

USA . 746 parts In-Stock

1+ parts

$3.129

100+ parts

$2.879

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746

$3.129

$2.879

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IDEA Electronic Components Group

UK . 2,190 parts In-Stock

1+ parts

$3.193

100+ parts

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$2.874

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2,190

$3.193

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$2.874

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ChromeModa Solutions

Germany . 1,372 parts In-Stock

1+ parts

$3.193

100+ parts

$2.618

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1,372

$3.193

$2.618

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AZTECH Wire

Italy . 561 parts In-Stock

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$9.507

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561

$9.507

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Ampacity Inc.

Singapore . 1,064 parts In-Stock

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$37.750

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1,064

$37.750

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Semicontronic

India . 1,153 parts In-Stock

1+ parts

$50.750

100+ parts

$49.481

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$49.228

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1,153

$50.750

$49.481

$49.228

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One Stop Electronics

USA . 1,110 parts In-Stock

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$55.750

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1,110

$55.750

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Corphita

USA . 1,645 parts In-Stock

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1,645

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Corohmni

South Africa . 289 parts In-Stock

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Overview

Experience stunning image quality and reliability with the TC217-40 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you top-of-the-line image sensors that are perfect for a wide range of applications. From security systems to medical imaging, the TC217-40 offers exceptional value, benefits, and advantages to customers looking for high-performance solutions. Trust Texas Instruments to provide you with the quality and innovation you need for your imaging needs.

Feature Benefit Bullets

Pixel Size (um)

This small pixel size allows for high resolution images to be captured with great detail.

Maximum Supply Voltage

With a high maximum supply voltage, this sensor can operate efficiently even under varying voltage conditions.

Body Width

The compact body width makes this sensor suitable for a wide range of applications where space is limited.

Power Supplies (V)

The standard power supply voltage of 12V ensures compatibility with most electronic systems.

Sensors or Transducers Type

The use of CCD technology in this image sensor ensures high image quality and sensitivity.

Body Height

The low body height allows for easy integration into slim devices or applications with limited space.

Package Shape or Style

The rectangular shape of the package makes it easy to mount and align the sensor in the desired orientation.

Minimum Supply Voltage

With a low minimum supply voltage, this sensor can operate efficiently even in low power scenarios.

Maximum Operating Temperature

The high maximum operating temperature range allows this sensor to be used in a wide variety of environments.

Horizontal Pixel

The high number of horizontal pixels results in detailed and sharp images with high resolution.

Output Range

The output range of the sensor allows for precise and accurate image data to be captured and processed.

Output Type

The analog voltage output type is compatible with most image processing systems, enabling seamless integration.

Minimum Operating Temperature

The low minimum operating temperature range ensures that this sensor can be used in cold environments without issues.

Maximum Operating Current

The low operating current of the sensor helps in reducing power consumption and heat dissipation.

Housing

The ceramic and metal-sealed housing provides durability and protection to the sensitive components, ensuring long-term reliability.

Dynamic Range

The high dynamic range of the sensor allows for capturing scenes with both bright and dark areas accurately.

Vertical Pixel

The high number of vertical pixels contributes to the overall image quality and sharpness of the captured images.

Body Length/Diameter

The compact body length/diameter makes this sensor suitable for applications where space is a constraint.

Optical Format (inch)

The 2/3 inch optical format of this sensor is a standard size used in many imaging applications, ensuring compatibility.

Termination Type

The solder termination type allows for easy and reliable connectivity during the assembly process.

Array Type

The frame transfer array type enables fast and efficient image capture, making it suitable for high-speed applications.

Sensitivity (V/lx.s)

The high sensitivity of the sensor allows for high-quality image capture in low light conditions.

Mounting Feature

The through hole mounting feature provides a secure and stable installation of the sensor in a wide range of applications.

Technical Specifications

Image Sensors TC217-40 attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Array Type:

FRAME TRANSFER

Body Width:

18.54 inch

Body Height:

3.86 mm

Body Length/Diameter:

27.81 mm

Dynamic Range:

73 dB

Horizontal Pixel:

1134

Housing:

CERAMIC, METAL-SEALED COFIRED

Mounting Feature:

Maximum Operating Current:

9 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

2/3

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

11.7X9

Power Supplies (V):

12

Sensitivity (V/lx.s):

50 V/lx.s

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

13 V

Minimum Supply Voltage:

11 V

Termination Type:

SOLDER

Vertical Pixel:

486

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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