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TC213-50

Texas Instruments

TC213-50 by Texas Instruments

TC213-50 by Texas Instruments is an image sensor with 12x12 um pixel size, 512 horizontal pixels, and 1000 vertical pixels. Operating at temperatures from -10 to 40 °C, it requires a 12V power supply. Ideal for applications requiring THROUGH HOLE MOUNT feature in various industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,967 parts In-Stock

1+ parts

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2,967

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Vyrian

USA . 2,870 parts In-Stock

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2,870

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,106 parts In-Stock

1+ parts

$1.963

100+ parts

$182.326

1k+ parts

$1.767

10k+ parts

-

1,106

$1.963

$182.326

$1.767

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DigiPath Technology Company

USA . 840 parts In-Stock

1+ parts

$2.162

100+ parts

$1.989

1k+ parts

-

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840

$2.162

$1.989

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IDEA Electronic Components Group

UK . 564 parts In-Stock

1+ parts

$2.206

100+ parts

-

1k+ parts

$1.985

10k+ parts

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564

$2.206

-

$1.985

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ChromeModa Solutions

Germany . 149 parts In-Stock

1+ parts

$2.206

100+ parts

$1.809

1k+ parts

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149

$2.206

$1.809

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Ampacity Inc.

Singapore . 1,379 parts In-Stock

1+ parts

$12.750

100+ parts

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1,379

$12.750

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AZTECH Wire

Italy . 861 parts In-Stock

1+ parts

$18.421

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861

$18.421

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One Stop Electronics

USA . 133 parts In-Stock

1+ parts

$21.750

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133

$21.750

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Semicontronic

India . 171 parts In-Stock

1+ parts

$31.750

100+ parts

$30.956

1k+ parts

$30.798

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171

$31.750

$30.956

$30.798

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Corphita

USA . 1,525 parts In-Stock

1+ parts

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1,525

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Corohmni

South Africa . 427 parts In-Stock

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427

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Overview

Capture stunning images with the TC213-50 Image Sensor by Texas Instruments, known for its superior quality and reliability. Ideal for a wide range of applications, this sensor offers crystal-clear images with precise detail and vibrant colors. Whether you're designing a security camera, medical imaging device, or industrial inspection system, the TC213-50 delivers exceptional performance and value. Trust Texas Instruments to provide cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Pixel Size (um): 12X12

The small pixel size of 12x12 um ensures high resolution and detailed image capture, making it suitable for applications requiring clear and precise imaging.

Power Supplies (V): 12

The 12V power supply allows for efficient and stable operation of the image sensor, ensuring consistent performance and reliable output.

Maximum Operating Temperature: 40 °C

With a maximum operating temperature of 40°C, this image sensor can withstand higher temperature environments, making it versatile and suitable for various applications.

Horizontal Pixel: 512

The high horizontal pixel count of 512 enables wider and more detailed image capture, providing better clarity and accuracy in imaging results.

Minimum Operating Temperature: -10 °C

The minimum operating temperature of -10°C allows this image sensor to function effectively even in colder environments, increasing its usability and reliability.

Vertical Pixel: 1000

The vertical pixel count of 1000 provides a higher resolution and better quality vertical image capture, making this image sensor ideal for applications that require detailed vertical imaging.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature simplifies the installation process and ensures secure and stable mounting of the image sensor, making it convenient and easy to integrate into various systems.

Technical Specifications

Image Sensors TC213-50 attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Horizontal Pixel:

512

Mounting Feature:

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-10 Cel

Pixel Size (um):

12X12

Power Supplies (V):

12

Sub-Category:

CCD Image Sensors

Vertical Pixel:

1000

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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