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AR0833CS3C12SUAA0-DP

Onsemi

AR0833CS3C12SUAA0-DP by Onsemi

Onsemi's AR0833CS3C12SUAA0-DP is a 1/3.2-inch CMOS image sensor with 3264x2448 pixels, offering a max supply voltage of 1.3V and a master clock of 24 MHz. Ideal for digital current output applications, it operates b/w -30 to 70 °C and features a dynamic range of 64 dB.

Median Price

$11.598

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

$10.310

1k+ parts

$9.220

10k+ parts

$8.680

12,000

-

$10.310

$9.220

$8.680

Verical

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

$12.887

1k+ parts

$11.525

10k+ parts

$10.850

12,000

-

$12.887

$11.525

$10.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,692 parts In-Stock

1+ parts

$10.906

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1,692

$10.906

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Vyrian

USA . 5,379 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 627 parts In-Stock

1+ parts

$1.434

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627

$1.434

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Northwest PG Solutions

USA . 726 parts In-Stock

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$1.578

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726

$1.578

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Corohmni

South Africa . 332 parts In-Stock

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$9.750

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332

$9.750

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Corphita

USA . 342 parts In-Stock

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$10.332

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342

$10.332

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AZTECH Wire

Italy . 582 parts In-Stock

1+ parts

$10.930

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582

$10.930

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Continental Prestige Electronics

USA . 12,000 parts In-Stock

1+ parts

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$9.750

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$9.750

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Kulean Microsystems

USA . 7,052 parts In-Stock

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7,052

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Problanco Electronics

Mexico . 6,965 parts In-Stock

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TANS Electronics

Latvia . 3,223 parts In-Stock

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SupplyDigital Components

Austria . 2,699 parts In-Stock

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2,699

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S.R.D Solutions

India . 2,000 parts In-Stock

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2,000

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UHIMA Technologies

Türkiye . 320 parts In-Stock

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320

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Overview

Capture every moment in stunning detail with the AR0833CS3C12SUAA0-DP image sensor by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. Ideal for a wide range of applications, this image sensor offers unparalleled value and benefits to customers. Whether you're capturing images for security purposes or creating high-quality content, this sensor provides exceptional performance and clarity. Trust Onsemi to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Pixel Size (um): 1.40

Smaller pixel size allows for higher resolution images with more detail.

Maximum Supply Voltage: 1.3 V

Efficient power consumption and compatibility with standard voltage levels.

Master Clock: 24 MHz

Fast processing speed for quick image capture and data transfer.

Body Width: 10 inch

Compact size for easy integration into various devices and applications.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS technology provides high quality images with low power consumption.

Maximum Operating Temperature: 70 °C

Wide temperature range for use in different environmental conditions.

Dynamic Range: 64 dB

High dynamic range for capturing both bright and dark areas in the same image.

Output Interface Type: 2-WIRE INTERFACE

Simple interface for easy connectivity and data transfer.

Frame Rate: 30 fps

Smooth video recording and fast image capture for moving subjects.

Mounting Feature: SURFACE MOUNT

Easy installation and secure mounting on PCBs or other surfaces.

Technical Specifications

Image Sensors AR0833CS3C12SUAA0-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER; IT ALSO OPERATES AT 2.8V ANALOG NOMINAL SUPPLY VOLTAGE

Array Type:

FULL FRAME

Body Width:

10 inch

Body Height:

1.325 mm

Body Length/Diameter:

10 mm

Dynamic Range:

64 dB

Frame Rate:

30 fps

Horizontal Pixel:

3264

Housing:

CERAMIC

Master Clock:

24 MHz

Mounting Feature:

Maximum Operating Current:

130 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3.2

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

1.40

Sensors or Transducers Type:

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.14 V

Termination Type:

SOLDER

Vertical Pixel:

2448

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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