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AR0820ATSB18XUEA0-DPBR-E

Onsemi

AR0820ATSB18XUEA0-DPBR-E by Onsemi

Onsemi's AR0820ATSB18XUEA0-DPBR-E is an 8" CMOS image sensor with 3848x2168 resolution, 1/2" optical format, and 40 fps frame rate. Ideal for digital output applications in surface mount setups.

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1k+

AR0820ATSB18XUEA0-DPBR-E by Onsemi
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Digiode

USA . 2,052 parts In-Stock

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Vyrian

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Native Components

USA . 468 parts In-Stock

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Northwest PG Solutions

USA . 2,306 parts In-Stock

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Problanco Electronics

Mexico . 7,279 parts In-Stock

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SupplyDigital Components

Austria . 6,747 parts In-Stock

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Kulean Microsystems

USA . 3,311 parts In-Stock

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TANS Electronics

Latvia . 3,026 parts In-Stock

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Corphita

USA . 1,231 parts In-Stock

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UHIMA Technologies

Türkiye . 436 parts In-Stock

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Corohmni

South Africa . 101 parts In-Stock

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Overview

Capture every moment with crystal clear precision using the AR0820ATSB18XUEA0-DPBR-E image sensor by Onsemi. As a leader in the industry, Onsemi guarantees top-notch quality and reliability in all their products. This cutting-edge image sensor is perfect for a wide range of applications, from security cameras to advanced drone technology. Experience unparalleled performance and efficiency with this state-of-the-art sensor, delivering exceptional value and benefits to our customers. Don't settle for anything less than the best - choose Onsemi for all your imaging needs.

Feature Benefit Bullets

Body Width: 8 inch

The wide body width allows for more space for the sensors to capture detailed images and videos.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors provide high-quality images with low power consumption, making them ideal for various applications.

Body Height: 1.875 mm

The low body height ensures that the sensor can be easily integrated into compact devices without adding bulk.

Package Shape or Style: RECTANGULAR

The rectangular shape allows for easy mounting and alignment in electronic devices.

Horizontal Pixel: 3848

The high horizontal pixel count enables the sensor to capture detailed and sharp images with high resolution.

Output Type: DIGITAL OUTPUT

Digital output simplifies the integration of the sensor with digital systems and enables easy processing of the captured data.

Vertical Pixel: 2168

The high vertical pixel count complements the horizontal pixels in capturing detailed images with excellent clarity.

Body Length/Diameter: 11 mm

The compact body length/diameter makes the sensor suitable for small electronic devices and ensures efficient use of space.

Optical Format (inch): 1/2

The 1/2 inch optical format provides a good balance between sensor size and image quality, making it suitable for various imaging applications.

Termination Type: SOLDER

The solder termination type ensures reliable and secure connections for the sensor during integration into electronic circuits.

Frame Rate: 40 fps

With a high frame rate of 40 fps, the sensor can capture fast-moving subjects or scenes with smooth and clear video output.

Array Type: FRAME

The frame array type enhances the sensor's ability to capture multiple frames quickly, enabling efficient image processing and analysis.

Mounting Feature: SURFACE MOUNT

The surface mount feature simplifies the installation and mounting of the sensor on circuit boards or electronic devices, saving time and effort.

Technical Specifications

Image Sensors AR0820ATSB18XUEA0-DPBR-E attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER

Array Type:

FRAME

Body Width:

8 inch

Body Height:

1.875 mm

Body Length/Diameter:

11 mm

Frame Rate:

40 fps

Horizontal Pixel:

3848

Mounting Feature:

Optical Format (inch):

1/2

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

2168

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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