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AR0820ATSB18XUEA0-DRBR-E

Onsemi

AR0820ATSB18XUEA0-DRBR-E by Onsemi

Onsemi's AR0820ATSB18XUEA0-DRBR-E is an 8" CMOS image sensor with 3848x2168 pixels, offering digital output at 40 fps. Ideal for frame array applications, this rectangular sensor in a 1/2" optical format is designed for surface mount installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,500 parts In-Stock

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2,500

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Vyrian

USA . 1,132 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 956 parts In-Stock

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$0.289

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$0.277

956

$0.289

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$0.277

Northwest PG Solutions

USA . 471 parts In-Stock

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$0.318

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$0.280

471

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$0.280

Kulean Microsystems

USA . 5,389 parts In-Stock

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5,389

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Problanco Electronics

Mexico . 5,131 parts In-Stock

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5,131

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SupplyDigital Components

Austria . 4,667 parts In-Stock

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4,667

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Corphita

USA . 2,135 parts In-Stock

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2,135

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UHIMA Technologies

Türkiye . 398 parts In-Stock

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398

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TANS Electronics

Latvia . 332 parts In-Stock

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332

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Corohmni

South Africa . 182 parts In-Stock

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Overview

Capture every moment with the AR0820ATSB18XUEA0-DRBR-E Image Sensor by Onsemi. Known for their exceptional quality and reliability, Onsemi brings you a cutting-edge product that is perfect for a wide range of applications. Whether you are looking to enhance your security system, improve your automotive camera, or upgrade your medical imaging equipment, this sensor offers unparalleled value, performance, and precision. Trust in Onsemi to deliver superior technology that exceeds your expectations.

Feature Benefit Bullets

Body Width: 8 inch

The wide body width allows for a larger sensor area, resulting in higher image quality and better low-light performance.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors are known for their low power consumption and high sensitivity, making them ideal for capturing sharp images with low noise.

Body Height: 1.875 mm

The slim body height allows for compact and slim camera designs, perfect for applications where space is limited.

Package Shape or Style: RECTANGULAR

The rectangular shape of the package makes it easy to integrate into various camera designs and setups.

Horizontal Pixel: 3848

With a high horizontal pixel count, this sensor can capture detailed and high-resolution images.

Output Type: DIGITAL OUTPUT

Digital output ensures easy connectivity and compatibility with various devices and systems.

Vertical Pixel: 2168

The high vertical pixel count allows for capturing images with excellent clarity and depth.

Body Length/Diameter: 11 mm

The compact body length/diameter makes it easy to integrate this sensor into a wide range of camera setups.

Optical Format (inch): 1/2

The 1/2 inch optical format provides a good balance between sensor size and image quality, suitable for a variety of applications.

Termination Type: SOLDER

The solder termination type ensures a secure and reliable connection, enhancing the longevity and durability of the sensor.

Frame Rate: 40 fps

With a high frame rate of 40 fps, this sensor is capable of capturing fast-moving subjects with smooth and sharp results.

Array Type: FRAME

The frame array type allows for efficient image capture and processing, resulting in high-quality output.

Mounting Feature: SURFACE MOUNT

The surface mounting feature makes it easy to install and secure the sensor onto various surfaces or boards.

Technical Specifications

Image Sensors AR0820ATSB18XUEA0-DRBR-E attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER

Array Type:

FRAME

Body Width:

8 inch

Body Height:

1.875 mm

Body Length/Diameter:

11 mm

Frame Rate:

40 fps

Horizontal Pixel:

3848

Mounting Feature:

Optical Format (inch):

1/2

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

2168

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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