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AR0820ATSB18XUD20-E

Onsemi

AR0820ATSB18XUD20-E by Onsemi

The Onsemi AR0820ATSB18XUD20-E is an 8" CMOS image sensor with 3848x2168 resolution, 1/2" optical format, and 40 fps frame rate. Ideal for digital output applications in surface mount configurations.

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In-Stock Inventory

1k+

AR0820ATSB18XUD20-E by Onsemi
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Vyrian

USA . 1,252 parts In-Stock

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Digiode

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Native Components

USA . 408 parts In-Stock

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Northwest PG Solutions

USA . 544 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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SupplyDigital Components

Austria . 4,377 parts In-Stock

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Kulean Microsystems

USA . 4,129 parts In-Stock

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TANS Electronics

Latvia . 2,717 parts In-Stock

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Problanco Electronics

Mexico . 2,366 parts In-Stock

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Corphita

USA . 1,260 parts In-Stock

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UHIMA Technologies

Türkiye . 592 parts In-Stock

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Corohmni

South Africa . 226 parts In-Stock

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Overview

Capture the world in stunning clarity with the AR0820ATSB18XUD20-E image sensor by Onsemi. Known for their commitment to quality, Onsemi has crafted a sensor that delivers unparalleled performance in a compact 8-inch body. Whether used in surveillance systems, automotive cameras, or industrial imaging applications, this CMOS sensor offers crisp, high-resolution images with a digital output for seamless integration. Trust Onsemi to provide you with a reliable and versatile solution that will elevate your imaging projects to new heights.

Feature Benefit Bullets

Body Width: 8 inch

The wide body width allows for better stability and handling when installed in devices or equipment.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors provide high-quality, low-noise image capture, making this product ideal for applications requiring clear and accurate imaging.

Body Height: 1.875 mm

The low body height allows for compact integration into devices without adding bulk or weight, making it suitable for slim and lightweight designs.

Horizontal Pixel: 3848

The high horizontal pixel count results in detailed and sharp images, making this sensor perfect for capturing high-resolution visuals.

Output Type: DIGITAL OUTPUT

The digital output simplifies connectivity and data transfer, ensuring compatibility with modern devices and systems.

Vertical Pixel: 2168

The vertical pixel count contributes to the sensor's overall image quality by providing sufficient resolution for capturing clear and crisp visuals.

Body Length/Diameter: 11 mm

The compact body length allows for versatile mounting options in various devices or equipment, enhancing the product's adaptability.

Optical Format (inch): 1/2

The 1/2 inch optical format offers a good balance between sensor size and image quality, making it a versatile choice for different imaging applications.

Termination Type: SOLDER

The solder termination ensures secure and reliable connections, enhancing the sensor's durability and longevity in operation.

Frame Rate: 40 fps

With a high frame rate of 40 fps, this sensor can capture fast-moving subjects or dynamic scenes with smooth and fluid motion, making it ideal for video recording applications.

Array Type: FRAME

The frame array type allows for organized and efficient capture of multiple image frames, enabling advanced image processing and analysis capabilities.

Mounting Feature: SURFACE MOUNT

The surface mount feature simplifies installation and integration into devices or systems, offering convenience and flexibility in deployment.

Technical Specifications

Image Sensors AR0820ATSB18XUD20-E attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER

Array Type:

FRAME

Body Width:

8 inch

Body Height:

1.875 mm

Body Length/Diameter:

11 mm

Frame Rate:

40 fps

Horizontal Pixel:

3848

Mounting Feature:

Optical Format (inch):

1/2

Output Type:

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

2168

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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