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KAI-04050-CBA-JB-AE

Onsemi

KAI-04050-CBA-JB-AE by Onsemi

KAI-04050-CBA-JB-AE by Onsemi is a 5.5x5.5um CCD image sensor with 2336H x 1752V pixels, offering a dynamic range of 64dB. It features an interline array type and solder termination, suitable for applications in digital cameras, machine vision systems, and medical imaging devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,684 parts In-Stock

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Digiode

USA . 346 parts In-Stock

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Kulean Microsystems

USA . 7,959 parts In-Stock

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Problanco Electronics

Mexico . 7,356 parts In-Stock

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SupplyDigital Components

Austria . 6,898 parts In-Stock

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TANS Electronics

Latvia . 6,849 parts In-Stock

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Corphita

USA . 2,206 parts In-Stock

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Corohmni

South Africa . 195 parts In-Stock

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UHIMA Technologies

Türkiye . 159 parts In-Stock

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Overview

Capture every detail with the KAI-04050-CBA-JB-AE Image Sensor by Onsemi. Renowned for their high-quality manufacturing, Onsemi delivers cutting-edge technology that pushes boundaries in imaging solutions. Perfect for applications in medical imaging, security cameras, and industrial inspection, this sensor offers unparalleled value and performance. Elevate your projects with the superior features and advantages of the KAI-04050-CBA-JB-AE, providing crisp, clear images with exceptional dynamic range. Experience the world of possibilities with Onsemi's innovative image sensor technology.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

The small pixel size allows for higher resolution images to be captured, resulting in clearer and sharper photographs.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD sensors are known for their high-quality image output and low noise, making them a great choice for capturing detailed and accurate images.

Package Shape or Style: RECTANGULAR

The rectangular shape of the package allows for easier integration into various devices and systems, making it versatile for different applications.

Horizontal Pixel: 2336

The high number of horizontal pixels results in high-resolution images with greater detail and clarity, perfect for professional photography or industrial imaging.

Dynamic Range: 64 dB

A dynamic range of 64 dB offers a wide range of exposure levels that can be captured, ensuring accurate representation of both dark and bright areas in an image.

Vertical Pixel: 1752

The high number of vertical pixels contributes to the overall resolution and quality of the images, providing a more immersive and detailed viewing experience.

Termination Type: SOLDER

Solder termination ensures a secure and reliable connection between the image sensor and the circuitry, reducing the risk of signal loss or interference for consistent performance.

Array Type: INTERLINE

Interline array type allows for faster readout speeds and reduced blooming effects in images, resulting in better overall image quality and dynamic range.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature simplifies the installation process and provides a sturdy and stable attachment for the image sensor, ensuring proper alignment and performance.

Technical Specifications

Image Sensors KAI-04050-CBA-JB-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Dynamic Range:

64 dB

Horizontal Pixel:

2336

Mounting Feature:

Optical Format (inch):

1

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

1752

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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