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AR0130CSSC00SPBA0-DR

Onsemi

AR0130CSSC00SPBA0-DR by Onsemi

Onsemi's AR0130CSSC00SPBA0-DR is a 1/3 inch CMOS image sensor with 1280x960 pixels, offering a pixel size of 3.75um. It operates at a max supply voltage of 1.95V and has a master clock frequency of 50MHz. Ideal for applications requiring high-resolution imaging in devices such as surveillance cameras and industrial inspection systems due to its compact square package design and digital current output interface.

Median Price

$7.085

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,011 parts In-Stock

1+ parts

$8.760

100+ parts

$6.737

1k+ parts

$6.265

10k+ parts

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1,011

$8.760

$6.737

$6.265

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Rochester

USA . 100,852 parts In-Stock

1+ parts

-

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$5.410

1k+ parts

$4.840

10k+ parts

$4.550

100,852

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$5.410

$4.840

$4.550

Flip Electronics (Authorized)

USA . 89,680 parts In-Stock

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89,680

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Vyrian

USA . 2,413 parts In-Stock

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$5.180

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2,413

$5.180

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Digiode

USA . 1,178 parts In-Stock

1+ parts

$5.985

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1,178

$5.985

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Flip Electronics

USA . 13,680 parts In-Stock

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13,680

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Cyclops Electronics Ltd

UK . 6,000 parts In-Stock

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6,000

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Bristol Electronics

USA . 608 parts In-Stock

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608

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Distributors (Availability)

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Corohmni

South Africa . 97 parts In-Stock

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$5.180

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97

$5.180

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Corphita

USA . 1,600 parts In-Stock

1+ parts

$5.670

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1,600

$5.670

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Continental Prestige Electronics

USA . 44,174 parts In-Stock

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$5.410

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44,174

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Perfect Parts

USA . 17,359 parts In-Stock

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17,359

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Metaverse IC Inc.

Canada . 15,200 parts In-Stock

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15,200

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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SupplyDigital Components

Austria . 8,372 parts In-Stock

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8,372

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Kepictronics

USA . 5,000 parts In-Stock

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TANS Electronics

Latvia . 3,758 parts In-Stock

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Problanco Electronics

Mexico . 1,285 parts In-Stock

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1,285

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Northwest PG Solutions

USA . 1,209 parts In-Stock

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Kulean Microsystems

USA . 927 parts In-Stock

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927

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Native Components

USA . 715 parts In-Stock

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715

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UHIMA Technologies

Türkiye . 250 parts In-Stock

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ChipstoGo Electronic ltd

UK . 250 parts In-Stock

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Overview

Capture stunning images with the AR0130CSSC00SPBA0-DR image sensor by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. Designed for a wide range of applications, this image sensor offers exceptional value to customers by providing high-quality digital current output and a dynamic range of 82 dB. Enhance your projects with the AR0130CSSC00SPBA0-DR and experience the benefits of superior imaging technology.

Feature Benefit Bullets

Pixel Size (um): 3.75

Smaller pixels result in high resolution images with greater detail.

Maximum Supply Voltage: 1.95 V

Allows for efficient power consumption and operation within a safe voltage range.

Master Clock: 50 MHz

High clock speed enables fast processing and data transfer capabilities.

Body Width: 11.43 inch

Compact size for easy integration into various devices and applications.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors provide high sensitivity and low noise for quality image capture.

Body Height: 1.535 mm

Slim profile allows for versatile mounting options and space-saving designs.

Package Shape or Style: SQUARE

Square shape provides uniformity and ease of handling during installation.

Minimum Supply Voltage: 1.7 V

Ensures stable operation and compatibility with low-power systems.

Maximum Operating Temperature: 70 °C

Wide temperature range for reliable performance in various environments.

Horizontal Pixel: 1280

High pixel count delivers sharp and detailed images for professional applications.

Output Range: -22-22mA

Wide current output range allows for flexibility in signal processing and control.

Output Type: DIGITAL CURRENT

Digital output ensures reliable and accurate data transmission for post-processing.

Minimum Operating Temperature: -30 °C

Capable of functioning in extreme cold conditions without loss of performance.

Maximum Operating Current: 65 mA

Efficient power consumption to prolong battery life and reduce energy costs.

Housing: PLASTIC

Durable plastic housing for lightweight construction and durability in various environments.

Dynamic Range: 82 dB

Wide dynamic range captures details in both bright and dark areas of the image.

Vertical Pixel: 960

Vertical resolution for capturing clear images with balanced proportions.

Body Length/Diameter: 11.43 mm

Compact size for easy integration and versatile placement in devices.

Optical Format (inch): 1/3

Standard optical format for compatibility with various lenses and optical systems.

Termination Type: SOLDER

Secure solder connections for reliable data transmission and minimal signal loss.

Output Interface Type: 2-WIRE INTERFACE

Simple and efficient interface for seamless connectivity with external devices.

Frame Rate: 45 fps

High frame rate for smooth and fluid video recording and real-time monitoring.

Array Type: SINGLE FRAME

Single frame array design for easy integration and processing of image data.

Mounting Feature: SURFACE MOUNT

Surface-mounting capability for easy installation on PCBs and compact devices.

Technical Specifications

Image Sensors AR0130CSSC00SPBA0-DR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.5-3.1V

Array Type:

SINGLE FRAME

Body Width:

11.43 inch

Body Height:

1.535 mm

Body Length/Diameter:

11.43 mm

Dynamic Range:

82 dB

Frame Rate:

45 fps

Horizontal Pixel:

1280

Housing:

PLASTIC

Master Clock:

50 MHz

Mounting Feature:

Maximum Operating Current:

65 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.75

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

960

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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