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MT9V126IA3XTC-TP

Onsemi

MT9V126IA3XTC-TP by Onsemi

MT9V126IA3XTC-TP by Onsemi is a 1/4 inch CMOS image sensor with 5.60x5.60 um pixel size, offering 680x512 resolution and 30 fps frame rate. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high dynamic range of 74.6 dB and compact square package design.

Median Price

$24.460

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,084 parts In-Stock

1+ parts

$24.460

100+ parts

$22.990

1k+ parts

$20.790

10k+ parts

-

1,084

$24.460

$22.990

$20.790

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,031 parts In-Stock

1+ parts

$23.237

100+ parts

-

1k+ parts

-

10k+ parts

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2,031

$23.237

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Vyrian

USA . 3,699 parts In-Stock

1+ parts

-

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10k+ parts

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3,699

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 245 parts In-Stock

1+ parts

$12.670

100+ parts

-

1k+ parts

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245

$12.670

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Corphita

USA . 2,018 parts In-Stock

1+ parts

$22.014

100+ parts

-

1k+ parts

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2,018

$22.014

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Corohmni

South Africa . 294 parts In-Stock

1+ parts

$24.460

100+ parts

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1k+ parts

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294

$24.460

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

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8,000

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TANS Electronics

Latvia . 4,550 parts In-Stock

1+ parts

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4,550

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Problanco Electronics

Mexico . 2,567 parts In-Stock

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2,567

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SupplyDigital Components

Austria . 2,028 parts In-Stock

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2,028

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Kulean Microsystems

USA . 1,607 parts In-Stock

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1,607

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UHIMA Technologies

Türkiye . 132 parts In-Stock

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132

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Overview

Unlock the power of crystal-clear imaging with the MT9V126IA3XTC-TP image sensor by Onsemi. Crafted with precision and expertise, this sensor offers unparalleled quality and reliability for a wide range of applications. From surveillance systems to industrial automation, this sensor delivers crisp images with exceptional detail, making it the perfect choice for your next project. Experience the superior performance and value of Onsemi products and take your vision to the next level with the MT9V126IA3XTC-TP.

Feature Benefit Bullets

Pixel Size (um): 5.60X5.60

The small pixel size allows for higher resolution and improved image quality.

Maximum Supply Voltage: 1.9 V

Allows for efficient power usage and prevents damage to the sensor.

Master Clock: 27 MHz

High master clock frequency enables fast processing of image data.

Body Width: 9 inch

Compact body width allows for easy integration into various devices and systems.

Power Supplies (V): 1.8

Stable power supply voltage ensures consistent and reliable performance.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensor type offers low power consumption and high sensitivity.

Body Height: 1.4 mm

Thin body height facilitates slim device design and reduces overall weight.

Package Shape or Style: SQUARE

Square package shape allows for easy mounting and alignment in a variety of applications.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage saves power and extends battery life.

Maximum Operating Temperature: 105 °C

Wide operating temperature range ensures reliable performance in various environments.

Horizontal Pixel: 680

High horizontal pixel count results in sharper and more detailed images.

Output Range: -0.30-2.80V

Wide output range provides flexibility in signal processing and compatibility with various systems.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and integration with digital systems.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables reliable performance in extreme cold conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

High-quality terminal finish ensures good solderability and long-term reliability.

Maximum Operating Current: 50 mA

Low operating current helps in power efficiency and reduces heat generation.

Dynamic Range: 74.6 dB

Wide dynamic range allows for capturing both bright and dark areas with detail.

Vertical Pixel: 512

High vertical pixel count enhances image resolution and overall quality.

Body Length/Diameter: 9 mm

Compact body length/diameter allows for space-saving integration in devices.

Optical Format (inch): 1/4

Standard optical format ensures compatibility with various lenses and optical systems.

Termination Type: SOLDER

Solder termination provides secure and reliable electrical connections.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and communication with other devices.

Frame Rate: 30 fps

High frame rate allows for capturing fast-moving objects with clarity.

Array Type: FRAME

Frame array type enables simultaneous capture of an entire image for efficient processing.

Mounting Feature: SURFACE MOUNT

Surface mount feature allows for easy and secure mounting on PCBs and other surfaces.

Technical Specifications

Image Sensors MT9V126IA3XTC-TP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.66-2.94 V

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.4 mm

Body Length/Diameter:

9 mm

Dynamic Range:

74.6 dB

Frame Rate:

30 fps

Horizontal Pixel:

680

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

5.60X5.60

Power Supplies (V):

1.8

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

512

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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