Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
MT9V126IA3XTC-TP by Onsemi is a 1/4 inch CMOS image sensor with 5.60x5.60 um pixel size, offering 680x512 resolution and 30 fps frame rate. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high dynamic range of 74.6 dB and compact square package design.
Median Price
$24.460
Lifecycle Status
Suppliers In-Stock
4
In-Stock Inventory
1k+
Rochester
1+ parts
100+ parts
$22.990
1k+ parts
$20.790
10k+ parts
-
Digiode
$23.237
Chip Stock
Vyrian
AZTECH Wire
$12.670
Corphita
$22.014
Corohmni
Authorized Procurement Solutions
TANS Electronics
Problanco Electronics
SupplyDigital Components
Kulean Microsystems
UHIMA Technologies
The small pixel size allows for higher resolution and improved image quality.
Allows for efficient power usage and prevents damage to the sensor.
High master clock frequency enables fast processing of image data.
Compact body width allows for easy integration into various devices and systems.
Stable power supply voltage ensures consistent and reliable performance.
CMOS sensor type offers low power consumption and high sensitivity.
Thin body height facilitates slim device design and reduces overall weight.
Square package shape allows for easy mounting and alignment in a variety of applications.
Low minimum supply voltage saves power and extends battery life.
Wide operating temperature range ensures reliable performance in various environments.
High horizontal pixel count results in sharper and more detailed images.
Wide output range provides flexibility in signal processing and compatibility with various systems.
Digital voltage output simplifies signal processing and integration with digital systems.
Low minimum operating temperature enables reliable performance in extreme cold conditions.
High-quality terminal finish ensures good solderability and long-term reliability.
Low operating current helps in power efficiency and reduces heat generation.
Wide dynamic range allows for capturing both bright and dark areas with detail.
High vertical pixel count enhances image resolution and overall quality.
Compact body length/diameter allows for space-saving integration in devices.
Standard optical format ensures compatibility with various lenses and optical systems.
Solder termination provides secure and reliable electrical connections.
2-wire interface simplifies connectivity and communication with other devices.
High frame rate allows for capturing fast-moving objects with clarity.
Frame array type enables simultaneous capture of an entire image for efficient processing.
Surface mount feature allows for easy and secure mounting on PCBs and other surfaces.
Image Sensors MT9V126IA3XTC-TP attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
JESD-609 Code:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Range:
Output Type:
Package Shape or Style:
Pixel Size (um):
Power Supplies (V):
Sensors or Transducers Type:
Sub-Category:
Maximum Supply Voltage:
Minimum Supply Voltage:
Terminal Finish:
Termination Type:
Vertical Pixel:
PCN Obsolescence/ EOL - Obsolete Notice 30/Jun/2022
PCN Design/Specification - AR01xxA/AS0149/ASX340/T3Cx/ASX34/MT9V 29/Jun/2022
PCN Assembly/Origin - Mult Dev 09/Feb/2023
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N2222A
Asi Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
Bharat Electronics
SMBJ18CA
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
MBR0520LT1
Motorola
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
MBRA160T3G
Onsemi
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
Semtech
Sensitron Semiconductor
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
KAI-29050-AAA-JP-B2
Onsemi's KAI-29050-AAA-JP-B2 is a 5.5x5.5 um CCD image sensor with 6576 (H) x 4384 (V) pixels, offering a dynamic range of 64 dB. It operates b/w -50 to 70 °C, with data rate of 40 Mbps and frame rate of 4 fps. Ideal for applications requiring high-resolution imaging in industrial and scientific fields.
MT9V403C12STM
Micron Technology
Micron Technology's MT9V403C12STM Image Sensor features 659x494 pixels, 9.9um pixel size, and operates at 3.3V with a temp range of -5 to 70°C. Ideal for surface mount applications in various industries like automotive and surveillance systems.
MT9V024IA7XTR-TR
MT9V024IA7XTR-TR by Onsemi is a CMOS image sensor with 6x6 um pixel size, 752 horizontal pixels, and 480 vertical pixels. It operates at a max supply voltage of 3.6V and has a master clock of 27 MHz. Ideal for applications requiring high-resolution imaging in devices such as cameras and surveillance systems.
KAI-08052-QBA-JD-BA
KAI-08052-QBA-JD-BA by Onsemi is an image sensor with 5.5X5.5 um pixel size, 3296 horizontal pixels, and 2472 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
IMX290LQR-C
Sony
Sony's IMX290LQR-C image sensor features 2.9x2.9 um pixel size, 74.25 MHz master clock, and 120 fps frame rate. Ideal for applications requiring high-quality imaging in a compact form factor such as surveillance cameras or industrial machine vision systems.
KAI-01050-CBA-FD-AE
Onsemi's KAI-01050-CBA-FD-AE is a 5.5x5.5 um CCD image sensor with 1024x1024 pixels, offering a dynamic range of 64 dB. It operates b/w -50 to 70 °C and has a supply voltage range of 14.5V to 15.5V. Ideal for digital imaging applications requiring high-quality output in a compact square package.
MT9M025IX3STC
The Onsemi MT9M025IX3STC image sensor features 3.75um pixel size, 50MHz master clock, and 1/3 inch optical format. Ideal for applications requiring high-resolution imaging with a max supply voltage of 1.95V and digital output interface at a data rate of 700Mbps.
NOIV1SE1300A-QDC
NOIV1SE1300A-QDC by Onsemi features 4.80x4.80 um pixel size, 62 MHz master clock, and 1280 horizontal pixels. Ideal for image sensing applications with a dynamic range of 53 dB and frame rate of 150 fps.
KAI-01050-FBA-FD-BA
KAI-01050-FBA-FD-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 1024x1024 resolution, and 64 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as surveillance cameras or industrial machine vision systems.
KAI-1003-ABA-CD-AE
Onsemi's KAI-1003-ABA-CD-AE is a 12.8X12.8 um CCD image sensor with 1024x1024 pixels, offering a dynamic range of 72 dB. Operating b/w 0 to 40 °C, it has a supply voltage range of 14.5V to 15.5V and comes in a rectangular ceramic housing for industrial imaging applications.
CYIS1SM0250AA-WWC
CYIS1SM0250AA-WWC by Onsemi is a CMOS image sensor with 25um pixel size. It operates at 3.3-5V, has an 8MHz master clock, and offers a dynamic range of 74dB. Ideal for applications requiring high-resolution imaging at up to 30fps frame rate in a surface-mount package.
OV07675-A23A
Omnivision Technologies
OV07675-A23A by Omnivision Technologies is a CMOS image sensor with 2.50x2.50 um pixel size, offering 640x480 resolution and 71 dB dynamic range. Ideal for applications requiring high sensitivity and full-frame array type, it operates b/w -30 to 70 °C with a supply voltage range of 1.425V to 1.575V.
MT9V111D00ATCK82AC1-305
MT9V111D00ATCK82AC1-305 by Onsemi is a 640x480 CMOS image sensor with 5.6um pixel size, 27 MHz master clock, and 60dB dynamic range. Ideal for digital cameras, surveillance systems, and machine vision applications due to its high sensitivity and frame rate of 30 fps.
AR0135AT2M25XUEA0-TRBR
The Onsemi AR0135AT2M25XUEA0-TRBR is a 1/3 inch CMOS image sensor with 3.75x3.75 um pixel size, offering a frame rate of 54 fps. It is designed for surface mount applications, featuring Tin/Silver/Copper terminal finish and a square package style.
NOIX3SE012KB-LTI1
NOIX3SE012KB-LTI1 by Onsemi is an Image Sensor with 3.2X3.2 um Pixel Size, 32.4 MHz Master Clock, and 4096 Horizontal Pixels. Ideal for applications requiring high-resolution imaging such as surveillance cameras, industrial inspection systems, and medical imaging devices due to its superior performance and digital output interface (I2C/SPI).
KAI-16070-AXA-JD-B2
KAI-16070-AXA-JD-B2 by Onsemi is an image sensor with 7.4X7.4 um pixel size, 40 MHz master clock, and 15.5 V max supply voltage. Ideal for applications requiring high-resolution imaging such as industrial machine vision systems or medical imaging equipment due to its impressive technical specifications.
NOIV1SN1300A-QDC
NOIV1SN1300A-QDC by Onsemi is an image sensor with 1280x1024 resolution, 4.80x4.80 um pixel size, and 62 MHz master clock. Ideal for applications requiring high-speed imaging such as machine vision systems or industrial cameras due to its 150 fps frame rate and CMOS sensor technology.
AR0231AT7R00XUEA0-DRBR-E
Onsemi's AR0231AT7R00XUEA0-DRBR-E is a CMOS image sensor with 3um pixel size, 27 MHz master clock, and 120dB dynamic range. Ideal for digital cameras, surveillance systems, and automotive applications due to its high resolution and fast frame rate of 60fps.
KAF-8300-AAB-CB-AE
The Onsemi KAF-8300-AAB-CB-AE is a CCD image sensor with 5.4x5.4 um pixel size, offering 3326 horizontal and 2504 vertical pixels. It operates b/w -10 to 70 °C with a dynamic range of 64.4 dB, outputting analog voltage at a data rate of 28 Mbps. Ideal for full-frame imaging applications due to its rectangular shape and through-hole mounting feature.
AR0239ATSC00XUEA0-DPBR
IMAGE SENSOR,CMOS; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MT9V024IA7XTM-DP2
MT9V024IA7XTM-DP2 by Onsemi is a 1/3" CMOS image sensor with 6x6 um pixel size, offering 60 fps frame rate. Ideal for surface mount applications in various imaging devices due to its compact 9mm square package design.
MT9V024IA7XTM-DP1
MT9V024IA7XTM-DP1 by Onsemi is a 1/3-inch CMOS image sensor with 6x6 um pixel size. It offers 60 fps frame rate, solder termination, and surface mounting feature. Ideal for applications requiring high-quality imaging in compact devices like smartphones and security cameras.
MT9V024IA7XTM-DR
MT9V024IA7XTM-DR by Onsemi is a 1/3-inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100 dB. Operating at -40 to 105°C, it has a frame rate of 60 fps and digital voltage output interface. Ideal for applications requiring high-quality imaging in varying temperature conditions.
MT9V024IA7XTM-DP
MT9V024IA7XTM-DP by Onsemi features a 6x6 um pixel size, 27 MHz master clock, and 100 dB dynamic range. Ideal for image sensing applications in devices requiring high-resolution imaging capabilities.
MT9V034C12STM-DP1
The Onsemi MT9V034C12STM-DP1 is a 1/3 inch CMOS image sensor with a pixel size of 6X6 um. It operates at a max supply voltage of 3.6 V and has a master clock frequency of 27 MHz. This sensor is commonly used in applications requiring high-resolution imaging at a frame rate of 60 fps.
MT9V034C12STM-DP
Onsemi's MT9V034C12STM-DP is a 1/3 inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100 dB. Operating at 60 fps with a pixel size of 6x6 um, it has an output interface type of 2-WIRE INTERFACE. Ideal for applications requiring high-resolution imaging and low-light sensitivity in compact devices.
MT9V024IA7XTM-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Optical Format (inch): 1/3; Terminal Finish: TIN SILVER COPPER; Additional Features: AEC-Q100; GLOBAL SHUTTER; Array Type: FRAME;
MT9V024IA7XTM-TR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-3V; Maximum Operating Temperature: 105 Cel;
MT9V024IA7XTM-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-3V; Master Clock: 27 MHz;
MT9V024IA7XTC-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-3V; Additional Features: GLOBAL SHUTTER;
MT9V034C12STM-DR1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: -11-11mA; Body Width: 11.43 inch;
MT9V034C12STM-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: -11-11mA; Optical Format (inch): 1/3;
MT9V034C12STM-DR
Onsemi's MT9V034C12STM-DR is a 1/3-inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100dB. Operating at 60fps with a pixel size of 6x6um, it has an output interface type of 2-WIRE INTERFACE. Ideal for applications requiring high-resolution imaging and fast frame rates in compact designs.
MT9V024IA7XTM
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Dynamic Range: 100 dB; Vertical Pixel: 480; Minimum Operating Temperature: -40 Cel;
MT9V128IA3XTC-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Termination Type: SOLDER; Dynamic Range: 74.8 dB;
MT9V128IA3XTC-DP1
MT9V128IA3XTC-DR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Minimum Operating Temperature: -40 Cel; Body Width: 9 inch;
MT9V128IA3XTC-DR1
MT9V128IA3XTC-TP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; JESD-609 Code: e1; Termination Type: SOLDER;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved