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NOIP1SN0480A-STI

Onsemi

NOIP1SN0480A-STI by Onsemi

NOIP1SN0480A-STI by Onsemi features 4.80X4.80 um pixel size, 68 MHz master clock, and 808 (H) x 608 (V) resolution. This image sensor is ideal for applications requiring high-speed imaging with a frame rate of up to 120 fps in a compact surface-mount package.

Median Price

$22.880

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

$22.880

100+ parts

$21.510

1k+ parts

$19.450

10k+ parts

$19.450

500

$22.880

$21.510

$19.450

$19.450

DigiKey

USA . 359 parts In-Stock

1+ parts

$27.910

100+ parts

$22.285

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-

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359

$27.910

$22.285

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Mouser Electronics

USA . 500 parts In-Stock

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$21.420

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500

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$21.420

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Distributors (In-Stock)

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Digiode

USA . 1,984 parts In-Stock

1+ parts

$21.736

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$21.736

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Vyrian

USA . 577 parts In-Stock

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$22.880

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577

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Flip Electronics

USA . 9,500 parts In-Stock

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9,500

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Chip Stock

USA . 625 parts In-Stock

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625

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Nova Conductors

Japan . 500 parts In-Stock

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500

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TME

Poland . 330 parts In-Stock

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$24.550

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330

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$24.550

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 636 parts In-Stock

1+ parts

$19.450

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636

$19.450

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Corphita

USA . 1,718 parts In-Stock

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$20.592

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Corohmni

South Africa . 199 parts In-Stock

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$22.880

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Problanco Electronics

Mexico . 7,779 parts In-Stock

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7,779

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SupplyDigital Components

Austria . 5,960 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,435 parts In-Stock

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TANS Electronics

Latvia . 4,003 parts In-Stock

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Eastek

USA . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Kulean Microsystems

USA . 1,138 parts In-Stock

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Continental Prestige Electronics

USA . 855 parts In-Stock

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UHIMA Technologies

Türkiye . 567 parts In-Stock

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567

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Overview

Capture the world in stunning detail with the NOIP1SN0480A-STI image sensor by Onsemi. Designed with precision and innovation, this cutting-edge technology offers unparalleled quality and performance. Ideal for a wide range of applications, from automotive to security systems, this sensor provides crystal-clear images with exceptional clarity and accuracy. Elevate your projects with the reliability and excellence that only Onsemi can deliver. Experience the difference with the NOIP1SN0480A-STI - where every pixel tells a story.

Feature Benefit Bullets

Pixel Size (um)

Large pixel size allows for better light sensitivity and improved image quality.

Maximum Supply Voltage

Low operating voltage helps in reducing power consumption and heat generation.

Master Clock

High master clock frequency enables fast data processing and high frame rates.

Body Width

Compact body width allows for easy integration into various devices and systems.

Sensors or Transducers Type

CMOS image sensor technology offers high performance and low power consumption.

Body Height

Low body height enables slim design and space-saving in compact devices.

Package Shape or Style

Rectangular shape provides ease of handling and integration in different applications.

Minimum Supply Voltage

Low minimum supply voltage ensures reliable operation over a range of power sources.

Maximum Operating Temperature

Wide operating temperature range makes the sensor suitable for various environmental conditions.

Horizontal Pixel

High horizontal pixel count results in detailed and high-resolution images.

Minimum Operating Temperature

Low minimum operating temperature allows for operation in extreme cold conditions.

Terminal Finish

Durable terminal finish ensures reliable connections and long-term performance.

Maximum Operating Current

Low operating current helps in energy efficiency and prolongs battery life.

Dynamic Range

Wide dynamic range captures both dark and bright areas accurately in an image.

Vertical Pixel

High vertical pixel count enhances image sharpness and detail.

Body Length/Diameter

Optimal body length provides a balance between sensor performance and compact size.

Optical Format (inch)

Standard optical format allows for compatibility with a wide range of lenses and accessories.

Data Rate

High data rate enables fast transfer of image data for real-time processing.

Termination Type

Solder termination ensures secure connections and stable electrical contact.

Output Interface Type

4-wire interface offers versatility and compatibility with various systems and protocols.

Frame Rate

High frame rate allows for smooth and detailed video capture with minimal motion blur.

Array Type

Full frame array layout maximizes light sensitivity and image quality.

Mounting Feature

Surface mounting feature provides easy and secure installation on PCBs.

Technical Specifications

Image Sensors NOIP1SN0480A-STI attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER; IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE; IT ALSO HAVE MASTER CLOCK 340 MHZ (10-BIT) AND 272 MHZ (8-BIT) WHEN PLL IS NOT USED

Array Type:

FULL FRAME

Body Width:

4.93 inch

Body Height:

.75 mm

Body Length/Diameter:

6.13 mm

Data Rate:

68 Mbps

Dynamic Range:

59 dB

Frame Rate:

120 fps

Horizontal Pixel:

808

JESD-609 Code:

e1

Master Clock:

68 MHz

Mounting Feature:

Maximum Operating Current:

59 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/3.6

Output Interface Type:

4-WIRE INTERFACE

Package Shape or Style:

Pixel Size (um):

4.80X4.80

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

TIN SILVER COPPER

Termination Type:

SOLDER

Vertical Pixel:

608

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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