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KAE-04471-FBA-SD-FA

Onsemi

KAE-04471-FBA-SD-FA by Onsemi

The Onsemi KAE-04471-FBA-SD-FA is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal pixels, and 2096 vertical pixels. It operates b/w -30 to 40 °C with a dynamic range of 72 dB. Ideal for applications requiring high-resolution imaging at a max supply voltage of 15.3 V and min supply voltage of 14.7 V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,988 parts In-Stock

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Vyrian

USA . 1,908 parts In-Stock

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Problanco Electronics

Mexico . 6,635 parts In-Stock

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SupplyDigital Components

Austria . 5,705 parts In-Stock

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Kulean Microsystems

USA . 2,356 parts In-Stock

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TANS Electronics

Latvia . 1,919 parts In-Stock

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Corphita

USA . 827 parts In-Stock

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Corohmni

South Africa . 144 parts In-Stock

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UHIMA Technologies

Türkiye . 10 parts In-Stock

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Overview

Capture stunning images with the KAE-04471-FBA-SD-FA Image Sensor by Onsemi. This high-quality sensor offers unparalleled performance and reliability, making it perfect for a wide range of applications. Whether you're a professional photographer looking to take your work to the next level or a tech enthusiast exploring new projects, this sensor delivers exceptional value and benefits. Trust in Onsemi's reputation for excellence and experience the advantages of cutting-edge technology with the KAE-04471-FBA-SD-FA Image Sensor.

Feature Benefit Bullets

Pixel Size (um) 7.4X7.4

Smaller pixel size allows for higher resolution images with more detail.

Maximum Supply Voltage 15.3 V

Allows for flexibility in power supply options with a higher maximum voltage.

Body Width 41 inch

Compact body width makes it suitable for various applications with space constraints.

Sensors or Transducers Type IMAGE SENSOR,CCD

CCD sensors provide high-quality images with low noise levels, making it a reliable choice for imaging applications.

Package Shape or Style RECTANGULAR

Rectangular package shape allows for easy integration into different systems or devices.

Minimum Supply Voltage 14.7 V

Low minimum supply voltage ensures energy-efficient operation.

Maximum Operating Temperature 40 °C

High maximum operating temperature enables use in various environmental conditions.

Horizontal Pixel 2096

High horizontal pixel count provides detailed and sharp images.

Output Type VOLTAGE OUTPUT

Voltage output simplifies connectivity and integration with other systems.

Minimum Operating Temperature -30 °C

Low minimum operating temperature ensures reliable performance in cold conditions.

Maximum Operating Current 9 mA

Low maximum operating current helps in reducing power consumption.

Dynamic Range 72 dB

High dynamic range allows for capturing a wide range of light intensities in a single image.

Vertical Pixel 2096

High vertical pixel count ensures detailed and high-resolution images.

Body Length/Diameter 43.5 mm

Compact body length/diameter makes it easy to install in various setups.

Optical Format (inch) 4/3

Common optical format allows for compatibility with a wide range of lenses and accessories.

Data Rate 40 Mbps

High data rate enables fast and efficient data transfer for real-time imaging applications.

Termination Type SOLDER

Solder termination type ensures secure and reliable connections for long-term use.

Frame Rate 30 fps

Decent frame rate enables smooth and clear video recording or imaging.

Array Type INTERLINE

Interline array type enables fast readout speed for real-time imaging applications.

Mounting Feature THROUGH HOLE MOUNT

Through hole mounting feature provides secure and stable installation in various setups.

Technical Specifications

Image Sensors KAE-04471-FBA-SD-FA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 45 UV/ELECTRON

Array Type:

INTERLINE

Body Width:

41 inch

Body Length/Diameter:

43.5 mm

Data Rate:

40 Mbps

Dynamic Range:

72 dB

Frame Rate:

30 fps

Horizontal Pixel:

2096

Mounting Feature:

Maximum Operating Current:

9 mA

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

4/3

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.3 V

Minimum Supply Voltage:

14.7 V

Termination Type:

SOLDER

Vertical Pixel:

2096

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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