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AR0331SRSC00XUEE0-DPBR

Onsemi

AR0331SRSC00XUEE0-DPBR by Onsemi

Onsemi's AR0331SRSC00XUEE0-DPBR is a 2.2x2.2 um CMOS image sensor with 2048H x 1536V pixels, offering a dynamic range of 100 dB and operating at temperatures from -30 to 85 °C. It has a digital voltage output interface, operates at a max supply voltage of 1.95V, and features a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in automotive cameras and surveillance systems.

Median Price

$16.190

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Avnet

USA . 7,200 parts In-Stock

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Rochester

USA . 930 parts In-Stock

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$16.190

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$14.480

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$13.630

930

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$14.480

$13.630

Distributors (In-Stock)

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Digiode

USA . 766 parts In-Stock

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$25.622

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Vyrian

USA . 8,136 parts In-Stock

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VNN

France . 3,161 parts In-Stock

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Nova Conductors

Japan . 54 parts In-Stock

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AZTECH Wire

Italy . 722 parts In-Stock

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$15.780

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722

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Ampacity Inc.

Singapore . 875 parts In-Stock

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$22.920

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$22.920

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Corphita

USA . 2,187 parts In-Stock

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$24.273

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Corohmni

South Africa . 417 parts In-Stock

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$26.970

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Perfect Parts

USA . 8,373 parts In-Stock

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TANS Electronics

Latvia . 7,062 parts In-Stock

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Kulean Microsystems

USA . 4,391 parts In-Stock

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SupplyDigital Components

Austria . 2,217 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Problanco Electronics

Mexico . 689 parts In-Stock

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UHIMA Technologies

Türkiye . 133 parts In-Stock

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Overview

Capture stunning images and take your projects to the next level with the AR0331SRSC00XUEE0-DPBR Image Sensor by Onsemi. Known for its superior quality and reliability, Onsemi delivers cutting-edge technology that exceeds expectations. Ideal for a wide range of applications, this image sensor offers exceptional value with its high performance and precision. Elevate your imaging experience and unlock endless possibilities with the AR0331SRSC00XUEE0-DPBR Image Sensor.

Feature Benefit Bullets

Pixel Size (um) 2.2X2.2

Small pixel size allows for high-resolution image capture with great detail.

Maximum Supply Voltage 1.95 V

Allows for efficient power consumption and optimal performance.

Master Clock 48 MHz

High master clock frequency enables fast data processing and high frame rates.

Body Width 9.5 inch

Compact body size for easy integration and space-saving designs.

Sensors or Transducers Type IMAGE SENSOR,CMOS

CMOS image sensor technology provides high image quality and low power consumption.

Body Height 1.4 mm

Low profile design for compact installations and flexibility in placement.

Package Shape or Style SQUARE

Square package shape allows for easy mounting and alignment in setups.

Minimum Supply Voltage 1.7 V

Wide supply voltage range for flexibility in power supply options.

Maximum Operating Temperature 85 °C

Wide operating temperature range for versatility in different environmental conditions.

Horizontal Pixel 2048

High horizontal pixel count for detailed and sharp image resolution.

Output Range 0.84-1.96V

Wide output voltage range for compatibility with different systems and devices.

Output Type DIGITAL VOLTAGE

Digital voltage output for easy integration and signal processing.

Minimum Operating Temperature -30 °C

Low minimum operating temperature for reliability in cold environments.

Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)

Durable terminal finish for long-lasting performance and stability.

Maximum Operating Current 358 mA

High operating current for efficient power utilization and reliable performance.

Housing PLASTIC

Lightweight and durable plastic housing for ease of handling and durability.

Dynamic Range 100 dB

High dynamic range for capturing a wide range of light intensities and details in the image.

Vertical Pixel 1536

High vertical pixel count for detailed and high-resolution image capture.

Body Length/Diameter 9.5 mm

Compact body size for easy integration and space-saving designs.

Optical Format (inch) 1/3

Common optical format for compatibility with a wide range of lenses and accessories.

Termination Type SOLDER

Solder termination type for secure and reliable connections.

Output Interface Type 2-WIRE INTERFACE

2-wire interface for easy communication with other devices and systems.

Frame Rate 60 fps

High frame rate for smooth and real-time image capture and video recording.

Array Type FRAME

Frame array type for efficient image capture and processing in a structured manner.

Mounting Feature SURFACE MOUNT

Surface mount feature for easy and secure installation on PCBs or other surfaces.

Technical Specifications

Image Sensors AR0331SRSC00XUEE0-DPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE ANALOG SUPPLY VOLTAGE 2.5-3.1V, ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

9.5 inch

Body Height:

1.4 mm

Body Length/Diameter:

9.5 mm

Dynamic Range:

100 dB

Frame Rate:

60 fps

Horizontal Pixel:

2048

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

48 MHz

Mounting Feature:

Maximum Operating Current:

358 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

2.2X2.2

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

1536

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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