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AR0220AT4R00XUEA1-VL-TPBM

Onsemi

AR0220AT4R00XUEA1-VL-TPBM by Onsemi

The Onsemi AR0220AT4R00XUEA1-VL-TPBM is a CMOS image sensor with 1828x948 pixels, 1/1.8" optical format, and 60 fps frame rate. It features digital output and a 2-wire interface, suitable for applications in surveillance cameras, automotive vision systems, and industrial imaging.

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AR0220AT4R00XUEA1-VL-TPBM by Onsemi
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Digiode

USA . 458 parts In-Stock

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Vyrian

USA . 348 parts In-Stock

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Native Components

USA . 772 parts In-Stock

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$0.385

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Northwest PG Solutions

USA . 2,157 parts In-Stock

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$0.373

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Kulean Microsystems

USA . 8,341 parts In-Stock

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TANS Electronics

Latvia . 5,047 parts In-Stock

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SupplyDigital Components

Austria . 3,177 parts In-Stock

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Problanco Electronics

Mexico . 1,706 parts In-Stock

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Corphita

USA . 1,140 parts In-Stock

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Corohmni

South Africa . 343 parts In-Stock

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UHIMA Technologies

Türkiye . 245 parts In-Stock

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Overview

Capture the world around you in stunning detail with the AR0220AT4R00XUEA1-VL-TPBM Image Sensor by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that exceed expectations. This CMOS image sensor offers exceptional clarity and precision with its 1828 horizontal pixels and 948 vertical pixels. Ideal for applications in automotive, surveillance, and industrial imaging, this sensor provides crisp digital output at 60 frames per second. Experience the superior performance and reliability of Onsemi's image sensors, setting new standards in image capture technology. Elevate your imaging capabilities with the AR0220AT4R00XUEA1-VL-TPBM today.

Feature Benefit Bullets

Body Width: 9 inch

The 9 inch width provides a larger surface area for capturing images, resulting in higher quality and more detailed pictures.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS image sensors are known for their low power consumption and high image quality, making them a popular choice for various applications.

Body Height: 1.675 mm

The low profile of 1.675 mm allows for compact and slim device designs, perfect for space-constrained applications.

Package Shape or Style: RECTANGULAR

The rectangular shape makes it easy to integrate the image sensor into different types of devices or systems.

Horizontal Pixel: 1828

With a high horizontal pixel count of 1828, this image sensor can capture detailed and sharp images with clarity.

Output Type: DIGITAL OUTPUT

Digital output ensures easy connectivity and compatibility with modern digital systems.

Vertical Pixel: 948

The vertical pixel count of 948 further enhances the resolution and detail in captured images.

Body Length/Diameter: 12 mm

The compact body length of 12 mm allows for easy integration and placement in various devices or setups.

Optical Format (inch): 1/1.8

The 1/1.8 inch optical format provides a good balance between sensor size and image quality, suitable for a wide range of applications.

Termination Type: SOLDER

Solder termination ensures a secure and reliable connection between the image sensor and other components.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the connection process and allows for easy communication with other devices or systems.

Frame Rate: 60 fps

The high frame rate of 60 fps enables smooth and fluid motion capture, ideal for applications requiring fast-moving subjects.

Array Type: FRAME

The frame array type enhances the sensor's ability to capture multiple frames quickly, improving overall image quality and performance.

Mounting Feature: SURFACE MOUNT

Surface mount capability offers easy and secure installation on PCBs or other surfaces, making it suitable for mass production and assembly processes.

Technical Specifications

Image Sensors AR0220AT4R00XUEA1-VL-TPBM attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

AEC-Q100, ROLLING SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.675 mm

Body Length/Diameter:

12 mm

Frame Rate:

60 fps

Horizontal Pixel:

1828

Mounting Feature:

Optical Format (inch):

1/1.8

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

948

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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