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AR0330CM1C21SHKA0-CP

Onsemi

AR0330CM1C21SHKA0-CP by Onsemi

The Onsemi AR0330CM1C21SHKA0-CP image sensor features 2.2x2.2 um pixel size, 27 MHz master clock, and 2304 horizontal pixels. Ideal for applications requiring a digital voltage output interface, this CMOS sensor offers a dynamic range of 69.5 dB and operates b/w -30 to 70°C temperatures.

Median Price

$14.224

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,772 parts In-Stock

1+ parts

$15.610

100+ parts

$12.237

1k+ parts

$11.448

10k+ parts

-

1,772

$15.610

$12.237

$11.448

-

Chip1Stop

Japan . 5,900 parts In-Stock

1+ parts

$51.800

100+ parts

$24.600

1k+ parts

-

10k+ parts

-

5,900

$51.800

$24.600

-

-

Rochester

USA . 10,884 parts In-Stock

1+ parts

-

100+ parts

$10.300

1k+ parts

$9.210

10k+ parts

$8.670

10,884

-

$10.300

$9.210

$8.670

Verical

USA . 5,965 parts In-Stock

1+ parts

-

100+ parts

$12.838

1k+ parts

$11.488

10k+ parts

$10.813

5,965

-

$12.838

$11.488

$10.813

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,126 parts In-Stock

1+ parts

$10.868

100+ parts

-

1k+ parts

-

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1,126

$10.868

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-

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Vyrian

USA . 1,814 parts In-Stock

1+ parts

$11.440

100+ parts

-

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1,814

$11.440

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Flip Electronics

USA . 10,000 parts In-Stock

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10,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$3.146

100+ parts

$3.114

1k+ parts

$2.989

10k+ parts

-

500

$3.146

$3.114

$2.989

-

Corphita

USA . 1,411 parts In-Stock

1+ parts

$10.296

100+ parts

-

1k+ parts

-

10k+ parts

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1,411

$10.296

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-

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Corohmni

South Africa . 208 parts In-Stock

1+ parts

$11.440

100+ parts

-

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208

$11.440

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Perfect Parts

USA . 24,528 parts In-Stock

1+ parts

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100+ parts

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24,528

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Authorized Procurement Solutions

USA . 7,900 parts In-Stock

1+ parts

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100+ parts

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7,900

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TANS Electronics

Latvia . 7,145 parts In-Stock

1+ parts

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7,145

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Problanco Electronics

Mexico . 4,433 parts In-Stock

1+ parts

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4,433

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SupplyDigital Components

Austria . 711 parts In-Stock

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711

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Native Components

USA . 465 parts In-Stock

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465

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Kulean Microsystems

USA . 430 parts In-Stock

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430

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Northwest PG Solutions

USA . 344 parts In-Stock

1+ parts

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344

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UHIMA Technologies

Türkiye . 270 parts In-Stock

1+ parts

-

100+ parts

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270

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Overview

Capture stunning images with the AR0330CM1C21SHKA0-CP image sensor from Onsemi. Known for their top-quality products, Onsemi delivers exceptional performance and reliability in the imaging technology industry. This cutting-edge image sensor is perfect for a wide range of applications, providing clear and vibrant images with a high dynamic range. Experience the value and benefits of this advanced sensor, offering customers unmatched quality and versatility in their imaging needs. Elevate your projects with the AR0330CM1C21SHKA0-CP and see the difference for yourself.

Feature Benefit Bullets

Pixel Size (um): 2.2 X 2.2

Small pixel size allows for high resolution images and better detail capture in the image sensor.

Maximum Supply Voltage: 1.9 V

Low maximum supply voltage for efficient power usage and compatibility with a variety of systems.

Master Clock: 27 MHz

Fast master clock speed ensures quick processing and transmission of image data.

Body Width: 6.253 inch

Compact body width allows for easy integration into different devices and systems.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

The CMOS sensor type offers high sensitivity and low noise for excellent image quality.

Package Shape or Style: RECTANGULAR

Rectangular package shape provides easy mounting and placement in devices.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage ensures reliable operation even in low power scenarios.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for use in various environmental conditions.

Horizontal Pixel: 2304

High horizontal pixel count ensures detailed and high-resolution images.

Output Range: 0.40-1.40V

Wide output voltage range allows for flexibility in signal processing and compatibility with different systems.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and integration with digital systems.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures functionality in cold conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Quality terminal finish for durability and reliable electrical connections.

Maximum Operating Current: 137 mA

Low operating current for efficient power usage and reduced heat generation.

Housing: PLASTIC

Lightweight and durable plastic housing for easy handling and protection of internal components.

Dynamic Range: 69.5 dB

High dynamic range for capturing both bright and dark details in the image.

Vertical Pixel: 1296

High vertical pixel count for detailed and sharp images.

Body Length/Diameter: 6.623 mm

Compact body length/diameter allows for space-efficient integration into devices.

Optical Format (inch): 1/3

Optical format size provides compatibility with different lenses and optical systems.

Termination Type: SOLDER

Solder termination type for reliable and robust electrical connections.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface for easy communication with external systems.

Frame Rate: 60 fps

High frame rate for smooth and detailed video capture.

Array Type: FRAME

Frame array type for efficient image capturing and processing.

Sensitivity (V/lx.s): 2 V/lx.s

High sensitivity for accurate and detailed image capture, even in low light conditions.

Mounting Feature: SURFACE MOUNT

Surface mount feature for easy and secure mounting on circuit boards or devices.

Technical Specifications

Image Sensors AR0330CM1C21SHKA0-CP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.7-2.9V

Array Type:

FRAME

Body Width:

6.253 inch

Body Height:

.745 mm

Body Length/Diameter:

6.623 mm

Dynamic Range:

69.5 dB

Frame Rate:

60 fps

Horizontal Pixel:

2304

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

137 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

2.2X2.2

Sensitivity (V/lx.s):

2 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

1296

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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