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KAI-16000-AXA-JD-B2

Onsemi

KAI-16000-AXA-JD-B2 by Onsemi

KAI-16000-AXA-JD-B2 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 65 dB dynamic range, and 4872 horizontal pixels. It is ideal for applications requiring high-resolution imaging such as industrial machine vision systems or scientific cameras.

Median Price

$20,312.500

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2 parts In-Stock

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$20,312.500

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Verical

USA . 2 parts In-Stock

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$20,312.500

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Distributors (In-Stock)

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Digiode

USA . 1,357 parts In-Stock

1+ parts

$19,296.875

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1,357

$19,296.875

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Vyrian

USA . 8,852 parts In-Stock

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Sensible Micro Corp

USA . 23 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,239 parts In-Stock

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$18,281.250

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2,239

$18,281.250

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Corohmni

South Africa . 341 parts In-Stock

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$20,312.500

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Problanco Electronics

Mexico . 6,146 parts In-Stock

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TANS Electronics

Latvia . 4,559 parts In-Stock

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Kulean Microsystems

USA . 917 parts In-Stock

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SupplyDigital Components

Austria . 433 parts In-Stock

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UHIMA Technologies

Türkiye . 190 parts In-Stock

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Overview

Unleash the power of high-quality imaging with the KAI-16000-AXA-JD-B2 image sensor by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch products that exceed expectations. Ideal for a wide range of applications, this image sensor offers unparalleled value, benefits, and advantages to customers. Elevate your imaging capabilities with this innovative technology and experience the difference in quality and performance. Choose Onsemi for superior imaging solutions that set you apart from the competition.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

The small pixel size allows for high resolution and sharp images to be captured.

Maximum Supply Voltage: 15.5 V

Higher supply voltage allows for better performance and faster signal processing.

Body Width: 45.34 inch

The large body width provides stability and durability to the sensor.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors provide high-quality images with low noise, making this product ideal for high-resolution imaging.

Body Height: 4.88 mm

The slim body height allows for easy integration into various devices and equipment.

Package Shape or Style: RECTANGULAR

Rectangular shape makes it easy to mount and position the sensor in applications.

Minimum Supply Voltage: 14.5 V

Low minimum supply voltage helps in saving energy and reducing power consumption.

Horizontal Pixel: 4872

High horizontal pixel count ensures detailed and high-quality images.

Output Type: ANALOG VOLTAGE

Analog voltage output provides compatibility with a wide range of devices and systems.

Dynamic Range: 65 dB

High dynamic range allows for capturing both bright and dark areas in an image with detail.

Vertical Pixel: 3248

Vertical pixel count contributes to the overall image resolution and quality.

Body Length/Diameter: 44.45 mm

The compact body length allows for easy installation and positioning in tight spaces.

Data Rate: 30 Mbps

High data rate ensures quick and efficient transfer of image data.

Termination Type: SOLDER

Solder termination provides a secure and reliable connection for the sensor.

Array Type: INTERLINE

Interline array type facilitates faster readout and processing of image data.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature ensures secure attachment to a PCB or system board.

Technical Specifications

Image Sensors KAI-16000-AXA-JD-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 30 UV/ELECTRON

Array Type:

INTERLINE

Body Width:

45.34 inch

Body Height:

4.88 mm

Body Length/Diameter:

44.45 mm

Data Rate:

30 Mbps

Dynamic Range:

65 dB

Horizontal Pixel:

4872

Mounting Feature:

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

3248

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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