Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Onsemi's AR0237IRSH12SPRA0-DR-E is a 3x3 um CMOS image sensor with 1928H x 1088V pixels. It operates at a max supply voltage of 1.95V, has a master clock of 48 MHz, and offers a dynamic range of 96 dB. Ideal for applications requiring high-resolution imaging at up to 30 fps in a compact square package.
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Vyrian
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$1.385
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$1.524
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Corohmni
Small pixel size allows for higher resolution images to be captured with greater detail.
Higher supply voltage ensures stable and reliable operation of the image sensor.
High master clock frequency enables faster processing of image data for real-time applications.
Compact body width makes the image sensor suitable for space-constrained applications.
CMOS image sensor technology offers low power consumption and high integration capability.
Low body height facilitates easy integration into imaging systems with limited space.
Square package shape allows for efficient utilization of space on circuit boards.
Low minimum supply voltage helps in reducing power consumption of the image sensor.
Wide operating temperature range ensures reliable performance in varying environmental conditions.
High horizontal pixel count enables the capture of detailed and high-resolution images.
Wide output range provides flexibility in adjusting the output signal based on application requirements.
Digital voltage output simplifies interfacing with digital systems for seamless data transmission.
Low minimum operating temperature allows the image sensor to function reliably in cold environments.
Moderate operating current ensures efficient power usage without compromising performance.
Plastic housing offers a cost-effective and lightweight solution for the image sensor.
High dynamic range enables the image sensor to capture a wide range of brightness levels in a scene.
Vertical pixel count contributes to the overall resolution and quality of images captured by the sensor.
Compact body length/diameter allows for easy integration and assembly in imaging systems.
Common optical format ensures compatibility with a wide range of lenses for diverse imaging applications.
Solder termination provides a secure and reliable connection for the image sensor on circuit boards.
2-wire interface simplifies the connectivity of the image sensor with external devices for data transfer.
High frame rate of 30 fps enables smooth and real-time video capture using the image sensor.
Linear array configuration simplifies the image capturing process and ensures uniform image quality across the frame.
Surface mount capability makes the image sensor easy to mount on PCBs for streamlined manufacturing processes.
Image Sensors AR0237IRSH12SPRA0-DR-E attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Housing:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Output Range:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
BSS138
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
SS14
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
SMBJ18CA
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883C
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Package Equivalence Code: CAN8,.2;
1N4148WS
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148WS-7-F
Diodes Incorporated
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
STM32F407VGT6
STMicroelectronics
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Renesas Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Uniohm
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
CYII4SM6600AB-QDC
Onsemi
Onsemi's CYII4SM6600AB-QDC is a 3.5x3.5 um CMOS image sensor with 2210H x 3002V pixels, operating at 40 MHz clock speed. It offers a digital voltage output range of 0.50-2.80V and features a full-frame array design, suitable for applications requiring high sensitivity and dynamic range in imaging systems.
KAE-08152-FBA-JP-FA
KAE-08152-FBA-JP-FA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 40 MHz master clock, and 86 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.
AR0134CSSM00SUEA0-DPBR1
The Onsemi AR0134CSSM00SUEA0-DPBR1 is a 1/3 inch CMOS image sensor with a pixel size of 3.75um. It operates at a max supply voltage of 1.95V and has a master clock frequency of 50MHz. This sensor is commonly used in applications such as digital cameras, surveillance systems, and automotive imaging.
NOIP1FN2000A-LTI
NOIP1FN2000A-LTI by Onsemi features 1920x1200 resolution, 4.8um pixel size, and 360MHz master clock. Ideal for high-speed imaging applications with a frame rate of 230fps.
AR0234CSSM00SUKA0-CP1
The Onsemi AR0234CSSM00SUKA0-CP1 is a CMOS image sensor with 1920x1200 resolution, 3x3 um pixel size, and 71.4 dB dynamic range. It operates at -40 to 85 °C and has a frame rate of 120 fps. Ideal for applications requiring high-quality digital imaging in automotive or surveillance systems.
NOIV1SN1300A-XXC
NOIV1SN1300A-XXC by Onsemi is a 1280x1024 CMOS image sensor with 4.80um pixel size and 62 MHz master clock. It operates b/w -40 to 85 °C, offering a dynamic range of 53 dB. Ideal for frame array applications in various industries due to its square package shape and 1/2 inch optical format.
KAI-08050-CBA-JB-AE
KAI-08050-CBA-JB-AE by Onsemi is a 5.5x5.5 um CCD image sensor with 3296 (H) x 2472 (V) pixels, offering a dynamic range of 64 dB. Its rectangular package style and solder termination make it suitable for industrial machine vision applications requiring high-resolution imaging in a 4/3 optical format.
OV07740-A32A
Omnivision Technologies
IMAGE SENSOR,CMOS;
MT9V032C12STM-DP
Onsemi's MT9V032C12STM-DP is a 1/3-inch CMOS image sensor with 6x6 um pixel size. It operates at 26.6 MHz master clock, offering 752 (H) x 480 (V) resolution for applications requiring high-quality digital imaging at up to 60 fps frame rate. Ideal for surface mounting in devices needing -30 to 70 °C temperature range and a dynamic range of 54.4 dB.
MT9V022177ATM
MT9V022177ATM by Onsemi is a 1/3 inch CMOS image sensor with 752x480 pixels. It operates at 26.6 MHz, has a dynamic range of 54.4 dB, and supports a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in devices such as cameras and surveillance systems.
AR0132AT6C00XPEA0-DPBR1
Onsemi's AR0132AT6C00XPEA0-DPBR1 image sensor features 3.75um pixel size, 50MHz master clock, and 115dB dynamic range. Ideal for applications requiring high-resolution imaging with a frame rate of 60fps in a compact square package.
KAI-2020-FBA-CP-AE
KAI-2020-FBA-CP-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, offering a dynamic range of 68 dB and 1600x1200 resolution. Ideal for applications requiring high-quality imaging in a compact form factor, this CCD sensor operates b/w -50 to 70 °C with supply voltage ranging from 14.5V to 15.5V.
MT9V024IA7XTM-TR
MT9V024IA7XTM-TR by Onsemi is a 1/3-inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100 dB. Operating at -40 to 105°C, it has a frame rate of 60 fps and digital voltage output interface. Ideal for applications requiring high-quality imaging in compact devices.
CMV4000-3E5M1CA
Ams Ag
CMV4000-3E5M1CA by Ams Ag is a ceramic-housed CMOS image sensor with a 60 dB dynamic range, 37 fps frame rate, and sensitivity of 5.56 V/lx.s. It operates b/w -30°C to 70°C, features SPI interface output, and is ideal for applications requiring high-quality imaging in various environmental conditions.
KAF-8300-AXC-CP-AA
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 23 MICRO V/ELECTRON; Maximum Operating Temperature: 70 Cel;
TCD1304DG
Toshiba
Toshiba TCD1304DG is an 8x200 um image sensor with a 2 MHz master clock, ideal for applications requiring high sensitivity (160 V/lx.s) and a wide dynamic range (49.54 dB). With a spectral response of 400-1200 nm, this CCD sensor operates at temperatures from -25 to 60 °C, making it suitable for various imaging solutions.
AR0330SR1C00SUKA0-CP
The Onsemi AR0330SR1C00SUKA0-CP is a 2.2x2.2 um CMOS image sensor with 2304 horizontal pixels and 1536 vertical pixels. It operates b/w -30 to 70 °C, has a dynamic range of 69.5 dB, and outputs digital voltage from 0.40-1.40V. Ideal for applications requiring high-resolution imaging in varying light conditions such as surveillance cameras or industrial machine vision systems.
KAF-3200-ABA-CD-B2
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 2184; Housing: CERAMIC; Minimum Operating Temperature: -60 Cel;
AR0522SRSC09SURA0-DP
Onsemi's AR0522SRSC09SURA0-DP is a 12x1.62mm CMOS image sensor with 2592x1944 resolution, 1/2.5" optical format, and 60fps frame rate. It offers digital output via a 2-wire interface and is housed in a plastic package for surface mount applications.
NOIP1FN025KA-GDI
NOIP1FN025KA-GDI by Onsemi is an image sensor with 4.5x4.5 um pixel size, 360 MHz master clock, and 5120x5120 resolution. It operates b/w -40 to 85 °C and has a dynamic range of 59 dB. Ideal for high-resolution imaging applications requiring fast frame rates up to 80 fps.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 0.4-1.26V; Maximum Supply Voltage: 1.26 V;
AR0234CSSC00SUKA0-CP1
The Onsemi AR0234CSSC00SUKA0-CP1 image sensor features 1920x1200 resolution, 3x3 um pixel size, and 71.4 dB dynamic range. It is ideal for applications requiring high-quality digital imaging such as surveillance cameras, automotive vision systems, and drones due to its compact rectangular package and 120 fps frame rate.
AR0234CSSC28SUKA0-CP1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 0.4-1.26V; Optical Format (inch): 1/2.6;
AR0234CSSM00SUKA0-CP
Onsemi's AR0234CSSM00SUKA0-CP is a CMOS image sensor with 1920x1200 resolution, 3x3 um pixel size, and 71.4 dB dynamic range. It operates at -40 to 85 °C, outputs digital voltage from 0.4-1.26V, and has a frame rate of 120 fps. Ideal for applications requiring high-resolution imaging in automotive or surveillance systems.
AR0234CSSM28SUKA0-CP1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 0.4-1.26V; Dynamic Range: 71.4 dB;
AR0234CSSC00SUKA0-CP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 0.4-1.26V; Frame Rate: 120 fps;
AR0234CSSC28SUKA0-CP
AR0234CSSC28SUKA0-CP by Onsemi is a CMOS image sensor with 1920x1200 resolution, 3x3 um pixel size, and 71.4 dB dynamic range. It operates at -40 to 85 °C and has a frame rate of 120 fps. Ideal for applications requiring high-quality digital imaging in automotive, surveillance, or industrial settings.
AR0231AT7C00XUEA0-DPBR-E
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Array Type: LINEAR; Output Interface Type: 2-WIRE INTERFACE;
AR0233AT2B17XUEA0-DRBR-E
Onsemi's AR0233AT2B17XUEA0-DRBR-E is a CMOS image sensor with 2048x1280 resolution, 41.58 dB dynamic range, and MIPI output interface. Ideal for applications requiring high-quality imaging at 60 fps, such as surveillance cameras and automotive vision systems.
AR0234CSSM00SUKA0-CR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 0.4-1.26V; Termination Type: SOLDER;
AR0234CSSC00SUKA0-CR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 0.4-1.26V; Pixel Size (um): 3X3;
AR0234CSSC28SUKA0-CR
AR023ZMCSC00SUEA0-DRBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.40-1.50V; Body Width: 10 inch;
AR0239SRSC00SUEA0-DP
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; JESD-609 Code: e1; Vertical Pixel: 1188; Pixel Size (um): 3X3; Output Interface Type: 2-WIRE INTERFACE;
AR0230CSSC00SUEA0-DRBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.40-1.50V; Output Interface Type: 2-WIRE INTERFACE;
AR0238CSSC12SHRA0-DP1
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL CURRENT; Package Shape or Style: SQUARE; Output Range: -22-22mA; Minimum Operating Temperature: -30 Cel;
AR0239SRSC00SUEA0-DPBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Frame Rate: 90 fps; Vertical Pixel: 1188; Pixel Size (um): 3X3; Array Type: SINGLE FRAME;
AR0220AT4R00XUEA1-TPBM
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Array Type: FRAME;
AR0221SR2C00SUEA0-DRBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: RECTANGULAR; Frame Rate: 60 fps; Array Type: FRAME; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);
AR0220AT3R00XUEA0-DRBR
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 0.40-1.20V; Body Width: 9 inch;
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